• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.228-233
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• 2010

We studied the optical characteristics correlated with low dielectric constants of low-k SiOCH thin films through ellipsometry. The low-k SiOCH thin films were prepared by CCP-PECVD method using BTMSM(Bis-trimethylsilylmethane) precursors deposited on p-Si wafer. The Si-O-CHx, Si-O-Si, Si-CHx, CHx and Si-H bonding groups were specified by FTIR spectroscopic spectra, and the groups coupled with the nano-porous structural organic/inorganic hybrid-type of SiOCH thin films which has extremely low dielectric constant close to 2.0. The structural groups includes highly dense pore as well as ions in SiOCH thin films affecting to complex refraction characteristics of single layer on the p-Si wafer. The structural complexity originate the complex refractive constants of the films, and resulted the elliptical polarization of the incident linearly polarized light source of Xe-light source in the range from 190 nm to 2100 nm. Phase difference and amplitude ratio between s wave and p wave propagating through SiOCH thin film was studied. After annealing, the amplitude of p wave was reduced more than s wave, and phase difference between p and s wave was also reduced.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.227-227
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• 2010

기존 실리콘 박막 태양 전지는 적외선에 대한 감응도와 흡수도가 낮아서 광흡수율을 증가시킬 경우 효율의 효과적인 개선이 기대되어진다. 이를 개선하기 위해서 밴드갭이 Si에 비해 상대적으로 낮은 Ge을 도입함으로써 Si와 Ge 화합물을 형성할 경우 결정상태와 수소 함유량에 따라 밴드갭 조절이 가능하다. 또한 Ge는 Si에 비해 빛에 대한 감응도가 우수하여 광흡수율을 증가시킬수 있다. 단 SiGe 박막의 Ge 량이 일정량이상 많아질 경우 박막 내 결함 등의 생성으로 광변환 효율이 오히려 감소하므로 Ge 량의 적정화가 필요하다. 본 실험에 사용된 SiGe:H Layer는 $SiH_4$ 가스와 $GeH_4$ 가스를 혼합하여 증착하였고 증착두께는 150nm로 고정하였으며 증착장비는 PECVD를 이용하였다. 파워는 플라즈마의 방전특성을 알아본 후 최소파워를 이용하여 증착하였다. 이는 증착 시 플라즈마에 의한 박막 손상을 최소화하기 위함이다. Ellipsometry를 이용하여 박막의 두께와 optical bandgap을 측정하였다. 박막의 특성을 평가하기 위해서 STA 장비를 이용하여 dark conductivity, photo conductivity, activation energy 등을 측정하였고, MDC를 이용해 C-V 곡선을 측정하였고, 이를 terman method를 이용하여 $D_{it}$를 계산하였다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.11A
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• pp.1091-1096
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• 2010

Stiction in microelectromechanical systems (MEMS) has been a major failure mechanism. Especially, in RF MEMS switches, moving parts often suffered in-use and release related stiction problems. Some materials and methods have been used to prevent this problem. Diamond-like carbon (DLC) has not only been used as a protective material owing to its good mechanical properties but also has been used as a hydrophobic material. Its properties could be controlled by post annealing treatment in various conditions. We synthesized DLC films using a radio frequency plasma enhanced chemical vapor deposition (RF PECVD) method on silicon substrates using methane ($CH_4$) and hydrogen ($H_2$) gas. Then, the change of the hydrophobic property of the films was investigated undervarious annealing temperatures in nitrogen and in oxygen ambient. The films, that were annealed above $700^{\circ}C$ in nitrogen ambient, showed a high contact angle of water (> $90^{\circ}$) even though their mechanical property was sacrificed to some degree. The structural variation and the changes of the hydrophobic and mechanical properties of the DLC films were analyzed by Raman spectrum, contact angle measurement, surface profiler, and a nanoindentation test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.63-66
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• 2003

To diffuse Zn at solid-state, the $SiO-2$/ZnO/$SiO_2$ wafers was made by PECVD and RF Sputter. Thicknesses of bottom $SiO_2$ and cap $SiO_2$ was about 500 ${\AA}$ and about 3500 ${\AA}$. Diffusion temperatures were $760^{\circ}C$, $780^{\circ}C$, and $800^{circ}C$, and diffusion times were 1, 2, 3, 4, 5, and 6 hr. LED chips were fabricated by the diffused wafers at Fab. The peak wavelength of all chips showed about 625~650 nm and red color. Main reason for Iv change was by diffusion temperature not diffusion time. The lower temperature was the higher Iv. We thick that these properties is because of the very high diffusion temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.1
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• pp.41-46
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• 2009

The low dielectric SiOCH films were deposited on p-type Si(100) substrates through the dissociation of BTMSM $(((CH_3)_3Si)_2CH_2)$ precursors with oxygen gas by using PECVD method. BTMSM precursor was introduced with the flow rates from 42 to 60 sccm by 2 sccm step into reaction chamber but with the constant flow rate of 60 sccm $O_2$. SiOCH thin films were annealed at $450^{\circ}C$ for 30 minutes. The electrical property of SiOCH thin films was studied by MIS, Al/SiOCH/p-Si(100), structure. Annealed samples showed large reduction of the maximum capacitance yielding low dielectric constant owing to reductions of surface charge density. After exposure at room temperature and atmospheric pressure, dielectric constant of SiOCH films was totally increased. However, annealed SiOCH thin films were more stable than as-deposited SiOCH thin films for natural oxidation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.4
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• pp.567-572
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• 2015

Discharge characteristics of linear microwave plasma were investigated by using fluid simulation of 2D axis-symmetry based on finite elements method. The microwave power was 2.45 GHz TEM mode and transmitted through linear antenna. Resistive power and pressure were considered simulation variables and argon was used for working gas. A decrease of electron density along the quartz tube was observed in low power condition but relatively uniform plasmas were generated in chamber by increasing the resistive power. The electron temperature was highly detected near the surface of quartz tube because the electron was heated only dielectric surface. The power transmission efficiency decreased and characteristics of surface plasma were observed in high electron density condition.

• Journal of the Semiconductor & Display Technology
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• v.13 no.4
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• pp.15-20
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• 2014

The fracture analysis of $SiN_x$ layers, which were deposited by low-temperature plasma enhanced chemical vapor deposition (LT-PECVD) and could be used for an encapsulation layer of a flexible organic light emitting display (OLED), was performed by an electrical method. The specimens of metal-insulator-metal (MIM) structure were prepared using Pt and ITO electrodes. We stressed MIM specimen mechanically by bending outward with a bending radius of 15mm repeatedly and measured leakage current through the top and bottom electrodes. We also observed the cracks, were generated on surface, by using optical microscope. Once the cracks were initiated, the leakage current started to flow. As the amount of cracks increased, the leakage current was also increased. By correlating the electrical leakage current in the MIM specimen with the bending times, the amount of cracks in the encapsulation layer, generated during the bending process, was quantitatively estimated and fracture behavior of the encapsulation layer was also closely investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.9
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• pp.766-772
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• 2011

Amorphous Si (a-Si) thin films of $p^+/p^-/n^+$ were deposited on $Si_3N_4$/glass substrate by using a plasma enhanced chemical vapor deposition (PECVD) method. These films were annealed at various temperatures and for various times by using a rapid thermal process (RTP) equipment. This step was added before the main thermal treatment to make the nuclei in the a-Si thin film for reducing the process time of the crystallization. The main heat treatment for the crystallization was performed at the same condition of $600^{\circ}C$/18 h in conventional furnace. The open-circuit voltages ($V_{oc}$) were remained about 450 mV up to the nucleation condition of 16min in the nucleation RTP temperature of $680^{\circ}C$. It meat that the process time for the crystallization step could be reduced by adding the nucleation step without decreasing the electrical property of the thin film Si for the solar cell application.

• Proceedings of the KIEE Conference
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• 2009.04b
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• pp.248-250
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• 2009

고효율 태양전지를 위한 결정질 태양전지의 구조 중 UNSW에서 개발한 BCSC(buried contact solar cell)가 있는데, 이는 전면 전극을 laser 처리 후 무전해 니켈 도금으로 형성한 것이다. 이같은 전면 전극을 형성하기 위해서는 무전해 nickel 도금 후 열처리가 필수적이다. 우리는 이 공정을 확립하기 위해 결정질 wafer에 후면을 PECVD로 SiNx막을 형성하여 $30\Omega/\square$로 도핑한 후 후면을 불산으로 제거한 상태에서 양면을 니켈 무전해 도금으로 전극을 형성하여 $300^{\circ}C,\;350^{\circ}C,\;400^{\circ}C$에서 각각 3,6,9분간 진행하였다. 그 결과 $400^{\circ}C$에서 3분간 열처리된 sample이 상대적으로 가장 명확한 IV curve를 형성하였다. 이 실험의 결과는 PN 접합 구조에서 전극을 nickel로 사용할 때 유용하게 사용될 수 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.328-331
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• 2004

Hot filament 플라즈마 화학기상 증착법(HFPECVD)를 사용하여 질산화철의 농도에 따른 탄소나노튜브의 성장 특성을 관찰하기 위해 실험을 진행하였다. 암모니아($NH_3$)를 희석가스로 사용하였고, 아세틸렌($C_2H_2$)를 탄소 원료가스로 각각 사용하였다. 암모니아 가스 플라즈마를 사용하여 전처리 된 질산화철 촉매층의 SEM(Scanning Electron Microscopy) 이미지를 관찰하여 본 결과, 나노 사이즈의 촉매 그레인(grain)을 발견할 수 있었다. 그리고 탄소 나노튜브의 직경과 성장 밀도 또한 전처리 된 촉매 층에 따라 다른 양상을 보였다. TEM(Transmission Electron Microscopy)를 사용하여 탄소나노튜브를 관찰한 결과 bamboo 구조를 한 다중벽 탄소 나노튜브(MWCNT)를 관찰할 수 있었다.