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http://dx.doi.org/10.5370/KIEE.2015.64.4.567

Characterization of Linear Microwave Plasma using the Fluid Simulation  

Seo, Kwon-Sang (Dept. of Electrical and Computer Engineering, Pusan National University)
Han, Moon-Ki (Dept. of Electrical and Computer Engineering, Pusan National University)
Kim, Dong-Hyun (Dept. of Electrical and Computer Engineering, Pusan National University)
Lee, Ho-Jun (Dept. of Electrical and Computer Engineering, Pusan National University)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.64, no.4, 2015 , pp. 567-572 More about this Journal
Abstract
Discharge characteristics of linear microwave plasma were investigated by using fluid simulation of 2D axis-symmetry based on finite elements method. The microwave power was 2.45 GHz TEM mode and transmitted through linear antenna. Resistive power and pressure were considered simulation variables and argon was used for working gas. A decrease of electron density along the quartz tube was observed in low power condition but relatively uniform plasmas were generated in chamber by increasing the resistive power. The electron temperature was highly detected near the surface of quartz tube because the electron was heated only dielectric surface. The power transmission efficiency decreased and characteristics of surface plasma were observed in high electron density condition.
Keywords
2.45 GHz; Fluid simulation; Linear microwave plasma; PECVD;
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Times Cited By KSCI : 3  (Citation Analysis)
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1 COMSOL Multiphysics Version 4.4 User Guide, December 2013.
2 M. Kaiser, K. M. Baumgartner, and A. Mattheus, “Microwave based plasma technology” Proceedings of the 20th International Conference on Applied Electromagnetics and Communications; Dubrovnik, Croatia, Sept 20-23; IEEE: Piscataway, NJ, 2010.
3 T. Yamada, M. Ishihara, and M. Hasegawa, “Large area coating of graphene at low temperature using a roll-to-roll microwave plasma chemical vapor deposition” Thin Solid Films, vol. 532, pp. 89-93, Apr., 2013.   DOI   ScienceOn
4 H. Rauscher, Plasma Technology for Hyperfunctional Surfaces : Food, biomedical, and textile applications, Weinheim: Wiley-Vch, 2010.
5 D. M. Pozar, Microwave Engineering, 3rd Edition, New York: Wiley, 2004.
6 E. J. Son, D. H. Kim, and H. J. Lee, “Analysis of DC Plasma using Electrostatic Probe and Fluid Simulation” Trans. KIEE., vol. 63, No. 10, pp. 1417-1422, Oct., 2014.
7 K. Y. Lee, D. H. Kim, H. J. Lee, “Fabrication of Atmospheric Coplanar Dielectric Barrier Discharge and Analysis of its Driving Characteristics” Trans. KIEE., vol. 63, No. 1, pp. 80-84, Jan., 2014.
8 H. Schlemm, A. Mai, S. Roth, D. Roth, K. M. Baumgartner, and H. Muegge, “Industrial large scale silicon nitride deposition on photovoltaic cells with linear microwave plasma sources” Surf. Coat. Technol., vol. 174-175, pp. 208-211, Sep.-Oct., 2003.   DOI   ScienceOn
9 M. Gunther, I. Bialuch, S. Peter, K. Bewilogua, and F. Richter, “High rate deposition of hard aC: H films using microwave excited plasma enhanced CVD” Surf. Coat. Technol., vol. 205, pp. S94-S98, July, 2011.   DOI   ScienceOn
10 T. H. Kim, D. H. Kim, H. J. Lee, “A Study on the Characteristics of μc-Si:H Films Prepared by Multistep Deposition Method using SiH4/H2 Gas Mixture” Trans. KIEE., vol. 63, No. 2, pp. 250-256, Feb., 2014.
11 M. Liehr and M. Dieguez-Campo, “Microwave PECVD for large area coating” Surf. Coat. Technol., vol. 200, No. 1-4, pp. 21-25, Oct., 2005.   DOI   ScienceOn