• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.121-126
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• 2017

EES System support to maximize equipment efficiency by providing real-time information of main equipment which has a significant effect on product quality and productivity, and to prevent equipment failure by detecting equipment abnormality in advance. Smart Equipment Engineering System(S-EES) integrates the activities performed at equipment that are the core of production activities and manages them by system so as to maximize the efficiency of equipment and raise the quality level of products to one level. In other words, when the product is put into the equipment, the recipe is downloaded through the RMS, the recipe is set to the optimal condition through R2R(process control), and the system detects and controls the abnormality of the equipment during operation through the FDC function in real time it means. In this way, we are working with the suitable recipe that matches the lot of product, detecting the abnormality of the equipment during operation, preventing the product from being defective, and establishing a system to maximize the efficiency through real-time equipment management. In this study, we review the present status and problems of equipment management in actual production lines, collect the requirements of the manufacturing line for the PCB line, design and develop the system, The measurement model was studied.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Analytical Science and Technology
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• v.24 no.5
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• pp.395-400
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• 2011

This study has been carried out in order to effectively manage three groups of unregulated hazardous organic substances (PCDD/DFs, PAHs, PCBs) in South Korea. The investigated substances have been analyzed according to the test methods for hazardous substances in specified wastes provided by the National Institute of Environmental Research, Korea. Total contents of the organic compounds have been determined for hazardous wastes from three major industrial categories (paint, iron removal, steelmaking), such as waste organic solvent, waste paint or dust. By investigating the waste samples for 7 PAHs using GC/MSD, Naphthalene has been detected (N.D~1631.33 mg/kg). The highest Naphthalene concentration, which exceeded the korean marine dumping waste standard, was found in waste organic solvents and waste paints. Although a content analysis of 7 PCB isomers has been conducted, none of these compounds was detected. The analysis of PCDD/DFs has revealed that all samples meet the criterion for low POP content defined in the technical guidelines developed under the Basel Convention. The PCDD/DFs content in dust samples deriving from 10 manufacturing processes (billet, bloom) was determined to be in the range of N.D~5.66 ng I-TEQ/g waste.

• Journal of the Korea Society for Simulation
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• v.23 no.4
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• pp.51-64
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• 2014

Small and medium Enterprises (SMEs), which have a manufacturing method of small quantity batch production produce goods using a general-purpose equipment and attached auxiliary tools. Many previous studies have focused on finding the effective resource allocations for improving the firms' productivity. It is very important for SMEs to keep costs low in assigning jobs to each resource, because they should meet the future uncertain demand of consumers under the limited budget. Using the concept of salvage cost, this paper proposes how to effectively allocate the tasks to main resources in the production process. The salvage cost is defined that purchasing cost minus decrease in value by workload, the method considering this is expected to reduce total purchasing costs during business period. To validate the effect of the proposed method, we proceed the real case study targeting on S company, PCB manufacturer to compare purchase amounts and its costs between the allocation proposed based salvage cost and current allocation method of current S company. As a results, In short-term (3 year) business period, salvage allocation have remarkable superior outcome to existing method, but gradually have cancelled out the effects in long-term (8 year) plans. Unlike the cycle allocation method, there exists the idle-equipments in allocation based salvage value. we additionally analyze the profits with respect to rental strategy of them during business period.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.25-34
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• 2012

New calibration method for the near-field scanning (NFS) system is presented. The proposed calibration method consisted of a new near-field antenna (NFP) and newly devised patterns as circular patch patterns (CPPs) and meander patterns (MPs). The proposed patterns were used for improving spatial resolutions and simplifying a calibration procedure of the NFP compared to the conventional method defined in the IEC61967-3 and 6. Also, the effect of the length of NFPs on attenuation characteristics was investigated with length of 8mm and 30mm. For them, we designed and fabricated CPPs of diameter (D) = 20, 40, 60, and 100mm and MPs of various widths and spaces. We found the reverse relations between spatial resolutions and heights of measuring points by using simplified calibration procedure. The testing result shows that the spatial resolution of $120{\mu}m$ at height of $200{\mu}m$ was verified without complex correlation algorithms under 8GHz. For manufacturing cost all patterns and the NFP were realized with low-cost fabrication using PCB (FR-4) not by a conventional LTCC process. For verification of chip-level EMC from the results, near-field scanning system (NFSS) having step resolution of Sub-micron scale was produced and by using the proposed NFSS and proposed NFP measurement of chip shows accurately the shape of the resolution of $200{\mu}m$ patterns for securing a high level of chip-level EMC verification.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• Journal of Advanced Navigation Technology
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• v.7 no.2
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• pp.101-107
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• 2003

In this study, we provide a single element log-periodic antenna that the feeding networks and array structures are aperture coupled and series dipole array type. We made the antenna for direct receiving the Moogoongwha satellite broadcasting signal. The transmission power was able to feed the patch dipole in series due to lay perpendicularly 8 series patch dipole on tapered slot. The patch dipole radiation pattern which fed in series power, make the main beam direction up $37^{\circ}{\sim}42^{\circ}$ within the BS/CS bandwidth. The main beam gain was measured 9.31~11.03 dBi. Using 32 elements to array the elements properly, we acquire $4{\times}8$ array structure on limited PCB board. As a result, it has been found that the new planar DBS antenna structure have high gain over 10dBi and acceptable elevation angle over 42 degree, and we can apply this result to commercial DBS reception antenna manufacturing.

• Clean Technology
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• v.17 no.2
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• pp.103-109
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• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.12
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• pp.1007-1010
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• 2017

In this paper, a frequency selective surface(FSS) with bandstop operation for radio-frequency spectrum management is presented. The proposed FSS is composed of patterns of fractal-based miniaturized unit cells for stable performance for angles of incidence and polarizations. For practical applications requiring high productivity and environmental compatibility, we fabricated a film-type FSS by screen-printing using Ag ink, rather than a conventional manufacturing method using a printed circuit board. To validate this study, we measured the transmission characteristics of the proposed FSS using the free-space measurement method, and observed the received strength of signal penetrating the FSS film applied to a wall.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.165-170
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• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.