1 |
I. E. Anderson, J. Master. Sci: Master Electron. 18,
55 (2007).
|
2 |
H. Y. Lu, J. Master. Sci: Master Electron. 17, 171
(2006).
DOI
|
3 |
Y. E. Shin and S. J Hwang, J. KIEEME 16, 549
(2003).
|
4 |
W. B. Hampshire, The Search for Leadfree Solders
(Soldering & Surface Mount Technology, MCB
University Press, 1993) p. 49.
|
5 |
S. S. Ha, J. W. Kim, and S. B. Jung, J. KWS 24, 6
(2006).
|
6 |
S. O. Ha, S. S. Ha, J. B. Lee, J. W. Yoon, J. H. Park,
Y. C. Chu, J. H. Lee, S. J. Kim, and S. B. Jung, J.
Microelectron. Packag. Soc. 16, 33 (2009).
|
7 |
J. S. Park, I. J. Jo, and Y. E. Shin, J. KIEEME 22,
199 (2009).
|
8 |
JIS Z 3198-7, Translated and Published by J apanese
Standards Association (2003).
|