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http://dx.doi.org/10.6117/kmeps.2022.29.3.055

A Study on Properties of Pb-free Solder Joints Combined Sn-Bi-Ag with Sn-Ag-Cu by Conditions of Reflow Soldering Processes  

Kim, Jahyeon (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology(KITECH))
Cheon, Gyeongyeong (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology(KITECH))
Kim, Dongjin (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology(KITECH))
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Ko, Yong-Ho (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology(KITECH))
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.3, 2022 , pp. 55-61 More about this Journal
Abstract
In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.
Keywords
SAC305; Sn-57Bi-1Ag; reflow soldering; combined Pb-free solder joint; interfacial reaction; intermetallic compound; reliability;
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Times Cited By KSCI : 1  (Citation Analysis)
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