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Chip-level NFP Calibration and Verification Using Improved Probe for NFS Standardization  

Lee, Pil-Soo (School of Electronics Engineering, Soongsil University)
Wee, Jae-Kyung (School of Electronics Engineering, Soongsil University)
Kim, Boo-Gyoun (School of Electronics Engineering, Soongsil University)
Choi, Jai-Hoon (SK hynix, memory R&D)
Yeo, Soon-Il (ETRI)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.49, no.6, 2012 , pp. 25-34 More about this Journal
Abstract
New calibration method for the near-field scanning (NFS) system is presented. The proposed calibration method consisted of a new near-field antenna (NFP) and newly devised patterns as circular patch patterns (CPPs) and meander patterns (MPs). The proposed patterns were used for improving spatial resolutions and simplifying a calibration procedure of the NFP compared to the conventional method defined in the IEC61967-3 and 6. Also, the effect of the length of NFPs on attenuation characteristics was investigated with length of 8mm and 30mm. For them, we designed and fabricated CPPs of diameter (D) = 20, 40, 60, and 100mm and MPs of various widths and spaces. We found the reverse relations between spatial resolutions and heights of measuring points by using simplified calibration procedure. The testing result shows that the spatial resolution of $120{\mu}m$ at height of $200{\mu}m$ was verified without complex correlation algorithms under 8GHz. For manufacturing cost all patterns and the NFP were realized with low-cost fabrication using PCB (FR-4) not by a conventional LTCC process. For verification of chip-level EMC from the results, near-field scanning system (NFSS) having step resolution of Sub-micron scale was produced and by using the proposed NFSS and proposed NFP measurement of chip shows accurately the shape of the resolution of $200{\mu}m$ patterns for securing a high level of chip-level EMC verification.
Keywords
EMC; NFP; IEC 61967;
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  • Reference
1 IEC61967-3,6 Integrated Circuits Measurement of Electro Magnetic Emissions, 150KHz to 1GHz, Part3 Surface Scan Method, Part6 Magnetic Probe Method
2 Dong, X., Deng, S., Hubing, T., Beetner, D.,"Analysis of chip-level EMI using near-field Magnetic scanning", IEEE International Symposium on Electromagnetic Compatibility, 2004, pp. 174-177.
3 Dong, X., Deng, S., Beetner, D.G., Hubing, T.H., Van Doren, T.P., "Determination of High Frequency Package Currents from Near Field Scan Data", IEEE International Symposium on Electromagnetic Compatibility, 2005, pp. 679-683
4 Jin Shi, Jiangqi He, Chan, E., Slattery, K., Jin Zhao, Fejfar, J., Zanella, F. "Equivalent radiation source extraction method for system level EMI and RFI prediction", Electromagnetic Compatibility, 2008. IEEE International Symposium on, Aug. 2006, pp. 1-5.
5 Hiroki Funato, Takashi Suga, "Magnetic Near Field Probe for GHz Band and Spatial Resolution Improvement Technique", Electromagnetic Compatibility, 17th International Zurith Symposium on, Feb. 2006, pp. 284-287.