• 센서학회지
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• 제24권3호
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• pp.169-174
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• 2015

In this study, we developed a system to detect the various defects in the metallic objects using the phenomenon that the defects cause the changes of the natural resonant frequencies. Our system consists of a FFT Amp, an Auto Impact Hammer, a Hammer controller and a PC. Auto Impact Hammer creates vibrations in the metallic objects when tapped on the surface. These vibrational signals are converted to the voltage signals by an acceleration sensor attached to the metallic part surface. These analog voltage signals were fed into an ADC (analog-digital converter) and an FFT (fast fourier transform) conversion in the FFT Amp to obtain the digital data in the frequency domain. Labview graphical program was used to process the digital data from th FFT amp to display the spectrum. We compared those spectra with the standard spectrum to find the shifts in the resonant frequencies of the metal parts, and thus detecting the defects. We used PCB's acceleration sensor and TI's TMS320F28335 DSP (digital signal processor) to obtain the resolution of 2.93 Hz and to analyze the frequencies up to 44 kHz.

• 방송공학회논문지
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• 제26권4호
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• pp.409-418
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• 2021

컨포멀 코팅은 PCB(Printed Circuit Board)를 보호하는 기술로 PCB의 고장을 최소화한다. 코팅의 결함은 PCB의 고장과 연결되기 때문에 성공적인 컨포멀 코팅 조건을 만족하기 위해서 코팅면에 기포가 발생했는지 검사한다. 본 논문에서는 영상 신호 처리를 적용하여 고위험군의 문제성 기포를 검출하는 알고리즘을 제안한다. 알고리즘은 문제성 기포의 후보를 구하는 단계와 후보를 검증하는 단계로 구성된다. 기포는 가시광 영상에서 나타나지 않지만, UV(Ultra Violet) 광원에서는 육안으로 구별이 가능하다. 특히, 문제성 기포의 중심은 밝기가 어둡고 테두리는 높은 밝기를 가진다. 이러한 밝기 특성을 논문에서는 협곡과 산맥 특징이라 부르고 두 가지 특징이 동시에 나타나는 영역을 문제성 기포의 후보라 하였다. 그러나 후보 중에는 기포가 아닌 후보가 존재할 수 있기 때문에 후보를 검증하는 단계가 필요하다. 후보 검증 단계에서는 합성곱 신경망 모델을 이용하였고, ResNet이 다른 모델과 비교하였을 때 성능이 가장 우수하였다. 본 논문에서 제시한 알고리즘은 정확률(Precision) 0.805, 재현율(Recall) 0.763, F1-점수(F1-score) 0.767의 성능을 보였고, 이러한 결과는 기포 검사 자동화에 대한 충분한 가능성을 보여준다.

• 전자공학회논문지SC
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• 제46권2호
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• pp.22-27
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• 2009

본 논문에서는 LCD 구동 모듈 PCB의 기능 검사를 위한 자동 검사 시스템인 EVT (Emulated Vision Tester)를 제안하고 구현하였다. 기존의 대표적인 자동검사 방법으로는 전기적 검사나 영상기반 검사방식이 있으나 전기적 검사만으로는 Timing이 주요한 변수가 되는 LCD 장비에서는 검출할 수 없는 구동불량이 존재하며 영상기반 검사는 영상획득에 일관성이 결여되거나 Gray Scale의 구분이 불명확하여 검출결과의 재현성이 떨어진다. EVT 시스템은 Pattern Generator에서 인가된 입력 패턴 신호와 구동 모듈을 통한 후 출력되는 디지털 신호를 직접 비교하여 패턴을 검사하고 아날로그 신호 (전압, 저항, 파형)의 이상 여부도 신속 정확하게 검사할 수 있는 하드웨어적인 자동 검사 방법이다. 제안된 EVT 검사기는 높은 검출 신뢰도와 빠른 처리 속도 그리고 간결한 시스템 구성으로 원가 절감 및 전공정 검사 자동화의 실현을 가능케 하는 등 많은 장점을 가진다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1992년도 춘계학술대회 논문집
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• pp.343-348
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• 1992

Using the real-time image processing technique, we have developed an automatic visual inspection system which detects the defects of the surface muonted components in PCB( missing components, mislocation, mismounts, and reverse polarity, etc ) and collects the quality control and production management data. An image processing system based on a commercial parallel processor, TRANSPUTER by which the image processing time can be largely reduced was designed. Analyzing the collected data, the proposed inspection system contributes to the productivity improvement throughthe reduction of defective rate.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2022년도 추계학술대회
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• pp.570-573
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• 2022

본 논문에서는 신경망 모델을 적용한 몰드변압기의 보이드 결함 크기 판별에 관한 연구를 수행하였다. PCB 기반의 로고우스키 코일형 부분방전 센서를 제작하여 부분방전 신호를 측정하였고, 보이드에 의한 부분방전 결함을 모의하기 위한 PD 전극계를 제작하였다. 또한 보이드는 원통형 모양의 알루미늄 틀을 제작하여 에폭시가 경화되는 과정에서 실린지를 삽입하고 공기를 주입하여 서로다른 직경을 가지는 4개의 시편을 제작하였다. 보이드 결함 크기 판별을 위해 부분방전 전하량, 방전 펄스 수, 위상 분포의 부분방전 특성 파라미터를 추출하여 Labview 기반의 VI (Virtual Instrument)로 역전파 알고리즘을 설계하였다. 실험 결과로부터 제작된 알고리즘은 90%이상의 판별률로 결함의 직경크기를 구분할 수 있었다. 본 연구의 결과는 현장에서 PD 측정 시 몰드변압기의 유지보수 및 절연물 교체의 근거 자료로 활용될 수 있을 것으로 판단된다.

• 한국재료학회지
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• 제24권4호
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• pp.186-193
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• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.125-130
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• 2011

The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within $20{\mu}m$ width on a $20{\mu}m$ thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.

• 제어로봇시스템학회논문지
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• 제3권3호
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• pp.323-331
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• 1997

A new probing mechanism and an active compliance control algorithm have been developed for the in-circuit test of a PCB( printed circuit board ). Commercially available robotic probing devices are incapable of controlling contact force generated through rigid probe contacts with a solder joint, at high speed. The uncontrollable excessive contact force often brungs about some defects on the surface of the solder joint, which is plastically deformable over some limited contact force. This force also makes unstable contact motions resulting in unreliable test data. To overcome these problems, we propose that a serially connected macro and micro device with active compliance provide the best potential for a safe and reliable in-circuit test. This paper describes the design characteristics, modeling and control scheme of the newly proposed device. The experimental results clearly show the effectiveness of the proposed system.