• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• Journal of the Institute of Convergence Signal Processing
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• v.9 no.2
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• pp.135-140
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• 2008

In this paper, the spiral antenna with the center frequencies of 315MHz, 433MHz, and 447MHz for RKE system of a vehicle is designed on PCB. The antenna is microstrip line-fed, and applied PIFA concept near the feeding part to easily tune center frequency and input impedance. The PIFA-type spiral antenna with the size of $30mm{\times}20mm$ is designed on printed PCB by considering the effect of circuits and components on PCB, ECU case and vehicle body. Also chip inductor inserted dual-band spiral antenna of 315MHz and 447MHz is designed. We found that the antenna designed on PCB satisfied the antenna specifications through measurement and field test.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.773-777
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• 1998

This paper presents the results of measured permittivity of PCB sheet material in the frequency range of 0.1 ~ 2[㎓] and temperature range of 25~ 85[>$^{\circ}C$]. Microstrip lines with different physical length are implemented to measure the attenuation and phase shift of the signals through these lines. The loss factor of glass-epoxy and teflon could by calculated with the measured dielectric constant and the attenuation. From the experiment, the glass-epoxy was more influenced by temperature and frequency than teflon. The average dielectric constants of glass-epoxy and teflon within the measured frequency range are 4.48 and 2.18, respectively.

• Proceedings of the KIEE Conference
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• 2008.10a
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• pp.111-112
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• 2008

Induced electromagnetic fields of printed circuit board are computed using method of moment. In this calculation PEC and dielectric boards are considered when exposed to the external fields. The volume and surface integral equations are presented for the electromagnetic wave scattering from plate structures composed of dielectric and conducting objects. To reduce the computing time a fast multipole technique is applied.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1485-1488
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• 1996

This paper presents a method for analyzing electromagnetic field of planar microwave structures, which is based on Finite Element Method and optimizes structure of microstripline on Printed Circuit Board.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.476-479
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• 2002

The proposed DC/DC converter employs a pair of neighboring printed-circuit-board windings as a coreless transformer Thus, the proposed DC/DC converter can be fabricated In an ultra low-profile fashion. The performance of the proposed low-profile DC/DC converter is confirmed with experiments on a prototype converter that delivers 58W of power at the maximum efficiency of $84\%$.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.269-272
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• 1988

This paper deals with the test strategy on the short-open for the printed circuit board. A group testing algorithm, which is the several testing point to be measured redefined as one of the testing points, was suggested. As a result, the total testing time was reduced to 30${\sim}$50 percent.

• Ceramist
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• v.21 no.2
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• Journal of Electrical Engineering and information Science
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• v.2 no.5
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• pp.40-44
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• 1997

This paper presents the results of studies made for measuring the relative complex permittivity of PCB sheet material in he frequency a range of 100MHz∼1GHz using vector network analyzer. A measurement cell was developed for this purpose using broad-band impedance method and the dielectric constant and loss tangent of two PCBV sheet materials, glass-epoxy and teflon, were measured. The effect of copper cladding was studied.