• Journal of Electrical Engineering and Technology
• /
• v.7 no.5
• /
• pp.730-735
• /
• 2012

This paper presents a method to design the waveform of a back electromotive force (back EMF) of an axial flux permanent magnet (AFPM) motor using printed circuit board (PCB) windings. When the magnetization distribution of permanent magnet (PM) is given, the magnetic field in the air gap region is calculated by the quasi three dimensional (3D) space harmonic analysis (SHA) method. Once the flux density distribution in the winding region is determined, the required shape of the back EMF can be obtained by adjusting the winding distribution. This can be done by modifying the distance between patterns of PCB to control the harmonics in the winding distribution. The proposed method is verified by finite element analysis (FEA) results and it shows the usefulness of the method in eliminating a specific harmonic component in the back EMF waveform of a motor.

• IE interfaces
• /
• v.10 no.1
• /
• pp.223-235
• /
• 1997

The process of determining the optimal tool path in PCB(printed circuit board) drilling operations is identical with that of solving a TSP(traveling salesman problem). However, the optimal solution will be ruined when a drill bit needs tracking back in its tool paths. The back tracking occurrences shorten a life of the main spindle and result in inaccurate mechanical movements. In this study, the performances of four heuristics(Nearest Neighbor, Convex Hull, Greatest Angle and Most Eccentric Ellipse) are evaluated to obtain feasible tool paths along with less number of back trackings for a large number of holes(more than 2000holes/bit) and to generate corresponding NC codes for a given CNC drill. Also, the operations of these algorithms are visualized to show a user the graphic image of tool visitation with PCB holes on a computer screen.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1993.11a
• /
• pp.49-54
• /
• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Proceedings of the IEEK Conference
• /
• 2001.06b
• /
• pp.257-260
• /
• 2001

Routing region modeling methods for PCB auto-routing system in Shape based type(non-grid method) used region process type and the shape located in memory as a individual element, and this element consumed small memory due to unique data size. In this paper we design PCB(Printed Circuit Board) auto-routing system using the auction algorithm method that 1) Could be reached by solving the shortest path from single original point to various destination, and 2) Shaped based type without any memory dissipation with the best speed. Also, the auto-routing system developed by Visual C++ in Window environment, and can be used in IBM Pentium computer or in various individual PC system.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.22 no.1
• /
• pp.12-20
• /
• 1997

Physical interconnect such as Printed Circuit Board(PCB) traces introduces new challenges for parameter extraction and delay calculation for high-speed system design. PCB traces are dominated by frequency dependent LC propagation which makes precharacterization difficult for all possible configurations. Moreover, simulating the transient behavior of the trace for noise and delay analysis requries the combined used of a variety of models and techniques for efficiently handling lossy, low-loss, frequency dependent, and coupled transmission lines together with lumped elements. In this paper we explain how the frequency dependence caused by ground plane proximity and skin effects can be modeled using the adstracted models. These abstracted (lumped) models are SPICE-compatible and can be simulated in time-domain, along with precharacterized lumped parasitic elements and nonlinear driver and load models.

• IE interfaces
• /
• v.6 no.2
• /
• pp.133-150
• /
• 1993

Recent industrial efforts are directed toward the development of CIM(Computer integrated Manufacturing) system. It is often the case that the analysis of the system dynamic behaviour is overlooked, even if it is important for both the economic justification and system performance evaluation. The main purpose of this study is to present a n approach of system performance evaluation for PCB(Printed Circuit Board) manufacturing, especially the inner layer manufacturing processes, using simulation. The general overview of the PCB manufacturing environment has first been discussed. Then a computer simulation program which can consider the diverse dynamic environmental changes has been developed. Extensive system analyses have been performed based on the program developed and the three measures proposed. The results obtained in this study provide valuable guidelines for practical concerns and some recommendations for future extensions.

• Fire Science and Engineering
• /
• v.33 no.6
• /
• pp.114-119
• /
• 2019

We found metallic migration phenomena at the fire scene in Printed circuit board (PCB) of LED light equipment which are commonly used. Accordingly we did this study. In order to generate rapidly metallic migration, we experiment the water drop test under low voltage (3.0 V) and a small amount of water condition. As a results of our experiment, we saw the growth of metallic migration of Copper and checked directly short of the PCB between isolated two poles by Cu migration. Finally we saw the shape of dendrite pattern by Cu migration using Scanning electron microscope (SEM) and analyzed that components via Energy dispersive Spectrometer (EDS).

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.20 no.11
• /
• pp.1130-1137
• /
• 2009

This paper proposes a new clock routing design for suppressing clock harmonic effects in a Printed Circuit Board (PCB) for a terrestrial Digital Multimedia Broadcasting(DMB) system. Typical crystal reference frequencies that are widely used in DMB tuners are 16.384 MHz, 19.2 MHz, 24.576 MHz. When the high-order harmonic components of these reference frequencies fall near the RF channel frequencies, receiver sensitivity of the tuners is seriously degraded. In this work, we propose a new clock routing design in order to address the clock harmonic coupling issue. The proposed design incorporates two inductors for isolating the clock ground from the main ground, and adopts a new strip line-style routing instead of the conventional microstrip line style routing to minimize the overlap area with the main ground. As a result, the RF sensitivity of the T-DMB tuner is improved by 2 dB.

• Korean Journal of Optics and Photonics
• /
• v.26 no.5
• /
• pp.261-264
• /
• 2015

In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.

• Korean Journal of Materials Research
• /
• v.20 no.1
• /
• pp.19-24
• /
• 2010

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).