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http://dx.doi.org/10.7731/KIFSE.2019.33.6.114

A Study on Fire Hazard by Metallic Migration  

Choi, Gyeong Won (National Forensic Service)
Hyun, Byoung Soo (National Forensic Service)
Kim, Sun Jae (National Forensic Service)
Lim, Kyu Young (National Forensic Service)
Woo, Seung Woo (National Forensic Service)
Lee, Dong Kyu (National Forensic Service)
Cho, Young Jin (National Forensic Service)
Park, Jong Taek (National Forensic Service)
Goh, Jae Mo (National Forensic Service)
Park, Nam Kyu (National Forensic Service)
Publication Information
Fire Science and Engineering / v.33, no.6, 2019 , pp. 114-119 More about this Journal
Abstract
We found metallic migration phenomena at the fire scene in Printed circuit board (PCB) of LED light equipment which are commonly used. Accordingly we did this study. In order to generate rapidly metallic migration, we experiment the water drop test under low voltage (3.0 V) and a small amount of water condition. As a results of our experiment, we saw the growth of metallic migration of Copper and checked directly short of the PCB between isolated two poles by Cu migration. Finally we saw the shape of dendrite pattern by Cu migration using Scanning electron microscope (SEM) and analyzed that components via Energy dispersive Spectrometer (EDS).
Keywords
Metallic migration; Ion migration; Insulation degradation; Fire safety; Fire science;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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