A Study on Fire Hazard by Metallic Migration
![]() |
Choi, Gyeong Won
(National Forensic Service)
Hyun, Byoung Soo (National Forensic Service) Kim, Sun Jae (National Forensic Service) Lim, Kyu Young (National Forensic Service) Woo, Seung Woo (National Forensic Service) Lee, Dong Kyu (National Forensic Service) Cho, Young Jin (National Forensic Service) Park, Jong Taek (National Forensic Service) Goh, Jae Mo (National Forensic Service) Park, Nam Kyu (National Forensic Service) |
1 | J. Jachim, G. Freeman and L. Turbini, "Use of Surface Insulation Resistance and Contact Angle Measurements to Characterize the Interaction of Three Water Soluble Flexes with FR-4 Substrates", IEEE CPMP Part B, Vol. 20, No. 4, pp. 443-451 (1997). |
2 | Y. Zhou, P. Yang, C. Yuan and Y. Huo, "Electrochemical Migration Failure of the Copper Trace on Printed Circuit Board Driven by Immersion Silver Finish", IEEE Conference on Prognostics and System Health Management, Vol. 33, pp. 559-564 (2013). |
3 | X. Qi, H. Ma, C. Wang, S. Shang, X. Li, Y. Wang and H. Ma, "Electrochemical Migration Behavior of Sn-based Lead-free Solder", Journal of Materials Science: Materials in Electronics, Vol. 30, No. 15, pp. 14695-14702 (2019). DOI |
4 | The Institute for Interconnecting and Packaging Electronic Circuit, "IPC-TM-650, Test Methods Manual" (1973). |
5 | The Institute for Interconnecting and Packaging Electronic Circuit, "IPC-M-109, Moisture-sensitive Component Standards and Guideline Manual" (1997). |
6 | J. Kim, "The Issues and the Technology Trends of LED", Electronics and Telecommunications Trends, Vol. 24, No. 120, pp. 61-76 (2009). |
7 | G. T. Kohman, H. W. Hermance and G. H. Downes, "Silver Migration in Electrical Insulation", Bell System Technical Journal, Vol. 33, No. 6, pp. 1115-1147 (1955). |
8 | T. Yanagisawa, "History of Ionic Migration and Factor for Its Growth", Journal of The Surface Finishing Society of Japan, Vol. 51, No. 5, pp. 479-483 (2000). DOI |
9 | T. Tsukui, "Reliability Analysis with Ionic Migration Generating on Print Wiring Board", Journal of The Surface Finishing Society of Japan, Vol. 51, No. 5, pp. 473-478 (2000). DOI |
10 | K. Shutoh "Accident Case and Ionic Migration of Home Electric Appliance Articles", Journal of The Surface Finishing Society of Japan, Vol. 51, No. 5, pp. 490-494 (2000). DOI |
11 | D. B. Lee, J. H. Kim, S. K. Kang, S. W. Chang, J. H. Lim and D. S. Ryu, "Acceleration Test of Ion Migration for PCB Electronic Reliability Evaluation", Journal of The Korean Society for Power System Engineering, Vol. 9, No. 1, pp. 64-69 (2005). |
12 | W. S. Hong, S. B. Jung and K. B. Kim, "Analysis method of metallic ion migration", Journal of KWS, Vol. 23, No. 2, pp. 22-30 (2005). |
13 | The Institute for Interconnecting and Packaging Electronic Circuit, "IPC-TR-476A, Electrochemical Migration" (1997). |
14 | B. Rudra and D. Jennigs, "Failure-mechanism Models for Conductive-filament Formation", IEEE Transcations on Reliability, Vol. 43, No. 3, pp. 354-360 (1994). DOI |
15 | J. W. Bang and C. W. Lee, "Flux Residue Effect on the Electrochemical Migration of Sn-3.0AG-0.5Cu", Journal of KWJS, Vol. 29, No. 5, pp. 95-98 (2011). |
16 | S. H. Huh, A. S. Shin and S. J. Ham, "Ion-migration Failure Mechanism under Biased HAST", The Korean Microelectronics and Packaging Society, Vol. 22, No. 1, pp. 43-49 (2015). DOI |
17 | W. S. Hong, B. C. Kang, B. S. Song and K. B. Kim, "A Study on the Metallic Ion Migration Phenomena of PCB", Kor. J. Mater. Res, Vol. 15, No. 1, pp. 54-60 (2005). DOI |
18 | Y. H Chun and L. J. Kwon, "Accelerated Life Test and Data Analysis of the Silver Through Hole Printed Wiring Board", Journal of the Korean Society for Quality Management, Vol. 25, No. 2, pp. 15-27 (1997). |
19 | S. I. Lee, S. W. Shin and D. S. Ko, "A Study on Failure pattern in PCB Manufacturing Process", Journal of SCVK, Vol. 2, No. 1, pp. 1-6 (2014). |
![]() |