Investigation of Ag Migration from Ag Paste Bump in Printed Circuit Board |
Song, Chul-Ho
(Department of Nano Fusion Technology, Pusan National University)
Kim, Young-Hun (Department of Nano Fusion Technology, Pusan National University) Lee, Sang-Min (Department of Nano Fusion Technology, Pusan National University) Mok, Jee-Soo (Samsung Electro-Mechanics, ACI Division, Advanced Technology Team) Yang, Yong-Suk (Department of Nano Fusion Technology, Pusan National University) |
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