Fire Science and Engineering (한국화재소방학회논문지)

Korean Institute of Fire Science and Engineering (한국화재소방학회)
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A Study on Fire Hazard by Metallic Migration

금속 마이그레이션에 의한 화재 위험성 연구

  • Received : 2019.10.22
  • Accepted : 2019.11.05
  • Published : 2019.12.31
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Abstract

We found metallic migration phenomena at the fire scene in Printed circuit board (PCB) of LED light equipment which are commonly used. Accordingly we did this study. In order to generate rapidly metallic migration, we experiment the water drop test under low voltage (3.0 V) and a small amount of water condition. As a results of our experiment, we saw the growth of metallic migration of Copper and checked directly short of the PCB between isolated two poles by Cu migration. Finally we saw the shape of dendrite pattern by Cu migration using Scanning electron microscope (SEM) and analyzed that components via Energy dispersive Spectrometer (EDS).

우리는 LED등기구의 Printed circuit board (PCB)에서 화재의 원인으로 특정할 수 있는 금속 마이그레이션(Metallic migration) 현상을 발견하고, 본 연구를 진행하였다. 금속 마이그레이션 현상 가속화 실험인 물방울 시험을 소량의 물과 저전압(3 V)로 진행하고 절연되어있는 양극에서 직접적으로 금속 마이그레이션의 성장과 회로의 단락을 확인하였다. 그리고 전자주사현미경(SEM)을 통해 형태를 관찰하고 에너지 분산형 분광기(EDS)를 이용하여 성분을 분석한 결과, 절연된 부분에서 전극을 이루고 있는 구리의 성분을 검출하였다.

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References

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