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http://dx.doi.org/10.3807/KJOP.2015.26.5.261

Laser-Driven Peeling of the Photoresist-Protective Film of a Printed Circuit Board  

Min, Hyung Seok (Department of Materials Science and Engineering, Yonsei University)
Heo, Jun Yeon (Department of Materials Science and Engineering, Yonsei University)
Lee, Jee Young (Department of Materials Science and Engineering, Yonsei University)
Lee, Myeongkyu (Department of Materials Science and Engineering, Yonsei University)
Publication Information
Korean Journal of Optics and Photonics / v.26, no.5, 2015 , pp. 261-264 More about this Journal
Abstract
In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.
Keywords
Pulsed laser; Laser-driven delamination;
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