• 한국정밀공학회지
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• 제20권5호
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• 방사성폐기물학회지
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• 제19권4호
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• pp.469-477
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• 2021

Safe storage of spent nuclear fuel in deep underground repositories necessitates an understanding of the long-term alteration of metal canisters and buffer materials. A small-scale laboratory alteration test was performed on metal (Cu or Fe) chips embedded in compacted bentonite blocks placed in anaerobic water for 1 year. Lactate, sulfate, and bacteria were separately added to the water to promote biochemical reactions in the system. The bentonite blocks immersed in the water were dismantled after 1 year, showing that their alteration was insignificant. However, the Cu chip exhibited some microscopic etch pits on its surface, wherein a slight sulfur component was detected. Overall, the Fe chip was more corroded than the Cu chip under the same conditions. The secondary phase of the Fe chip was locally found as carbonate materials, such as siderite (FeCO₃) and calcite ((Ca, Fe)CO₃). These secondary products can imply that the local carbonate occurrence on the Fe chip may be initiated and developed by an evolution (alteration) of bentonite and a diffusive provision of biogenic CO₂ gas. These laboratory scale results suggest that the actual long-term alteration of metal canisters/bentonite blocks in the engineered barrier could be possible by microbial activities.

• 한국지능시스템학회:학술대회논문집
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• 한국퍼지및지능시스템학회 1993년도 Fifth International Fuzzy Systems Association World Congress 93
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• pp.975-976
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• 1993

This talk presents the overview of the author's research and development activities on fuzzy inference hardware. We involved it with two distinct approaches. The first approach is to use application specific integrated circuits (ASIC) technology. The fuzzy inference method is directly implemented in silicon. The second approach, which is in its preliminary stage, is to use more conventional microprocessor architecture. Here, we use a quantitative technique used by designer of reduced instruction set computer (RISC) to modify an architecture of a microprocessor. In the ASIC approach, we implemented the most widely used fuzzy inference mechanism directly on silicon. The mechanism is beaded on a max-min compositional rule of inference, and Mandami's method of fuzzy implication. The two VLSI fuzzy inference chips are designed, fabricated, and fully tested. Both used a full-custom CMOS technology. The second and more claborate chip was designed at the University of North Carolina(U C) in cooperation with MCNC. Both VLSI chips had muliple datapaths for rule digital fuzzy inference chips had multiple datapaths for rule evaluation, and they executed multiple fuzzy if-then rules in parallel. The AT & T chip is the first digital fuzzy inference chip in the world. It ran with a 20 MHz clock cycle and achieved an approximately 80.000 Fuzzy Logical inferences Per Second (FLIPS). It stored and executed 16 fuzzy if-then rules. Since it was designed as a proof of concept prototype chip, it had minimal amount of peripheral logic for system integration. UNC/MCNC chip consists of 688,131 transistors of which 476,160 are used for RAM memory. It ran with a 10 MHz clock cycle. The chip has a 3-staged pipeline and initiates a computation of new inference every 64 cycle. This chip achieved an approximately 160,000 FLIPS. The new architecture have the following important improvements from the AT & T chip: Programmable rule set memory (RAM). On-chip fuzzification operation by a table lookup method. On-chip defuzzification operation by a centroid method. Reconfigurable architecture for processing two rule formats. RAM/datapath redundancy for higher yield It can store and execute 51 if-then rule of the following format: IF A and B and C and D Then Do E, and Then Do F. With this format, the chip takes four inputs and produces two outputs. By software reconfiguration, it can store and execute 102 if-then rules of the following simpler format using the same datapath: IF A and B Then Do E. With this format the chip takes two inputs and produces one outputs. We have built two VME-bus board systems based on this chip for Oak Ridge National Laboratory (ORNL). The board is now installed in a robot at ORNL. Researchers uses this board for experiment in autonomous robot navigation. The Fuzzy Logic system board places the Fuzzy chip into a VMEbus environment. High level C language functions hide the operational details of the board from the applications programme . The programmer treats rule memories and fuzzification function memories as local structures passed as parameters to the C functions. ASIC fuzzy inference hardware is extremely fast, but they are limited in generality. Many aspects of the design are limited or fixed. We have proposed to designing a are limited or fixed. We have proposed to designing a fuzzy information processor as an application specific processor using a quantitative approach. The quantitative approach was developed by RISC designers. In effect, we are interested in evaluating the effectiveness of a specialized RISC processor for fuzzy information processing. As the first step, we measured the possible speed-up of a fuzzy inference program based on if-then rules by an introduction of specialized instructions, i.e., min and max instructions. The minimum and maximum operations are heavily used in fuzzy logic applications as fuzzy intersection and union. We performed measurements using a MIPS R3000 as a base micropro essor. The initial result is encouraging. We can achieve as high as a 2.5 increase in inference speed if the R3000 had min and max instructions. Also, they are useful for speeding up other fuzzy operations such as bounded product and bounded sum. The embedded processor's main task is to control some device or process. It usually runs a single or a embedded processer to create an embedded processor for fuzzy control is very effective. Table I shows the measured speed of the inference by a MIPS R3000 microprocessor, a fictitious MIPS R3000 microprocessor with min and max instructions, and a UNC/MCNC ASIC fuzzy inference chip. The software that used on microprocessors is a simulator of the ASIC chip. The first row is the computation time in seconds of 6000 inferences using 51 rules where each fuzzy set is represented by an array of 64 elements. The second row is the time required to perform a single inference. The last row is the fuzzy logical inferences per second (FLIPS) measured for ach device. There is a large gap in run time between the ASIC and software approaches even if we resort to a specialized fuzzy microprocessor. As for design time and cost, these two approaches represent two extremes. An ASIC approach is extremely expensive. It is, therefore, an important research topic to design a specialized computing architecture for fuzzy applications that falls between these two extremes both in run time and design time/cost. TABLEI INFERENCE TIME BY 51 RULES {{{{Time }}{{MIPS R3000 }}{{ASIC }}{{Regular }}{{With min/mix }}{{6000 inference 1 inference FLIPS }}{{125s 20.8ms 48 }}{{49s 8.2ms 122 }}{{0.0038s 6.4㎲ 156,250 }} }}

• 대한전자공학회논문지SD
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• 제46권1호
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• pp.24-38
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• 2009

본 논문에서는 OCD(On-Chip Debugger)기반의 프로세서 디버거 구현한 것에 대해서 소개한다. 구현한 디버거는 프로세서 칩 내부에 내장에 내장해서 디버깅 기능을 하는 OCD로직과 심볼릭(Symbolic) 디버깅 기능을 지원하는 GNU 디버거 기반의 소프트웨어 디버거, 그리고 소프트웨어 디버거와 OCD를 연결해주고 고속 디버깅을 지원하는 인터페이스 & 컨트롤(Interface & Control) 블록으로 3개의 기능 블록으로 구성되어 있다. 디버거는 대상 프로세서에 OCD블록을 내장하여 소프트웨어 디버거를 이용해서 C/Assembly 레벨에서 디버깅이 가능하다. 디버깅 시스템(On-Chip Debugging System)은 FPGA로 구현된 32비트 RISC 타입 프로세서 코어에 OCD 블록을 내장해서 소프트웨어 디버거와 인터페이스 & 컨트롤 블록을 연동하여 동작을 검증하였다.

• 대한전자공학회논문지SD
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• 제42권2호
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• pp.65-72
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• 2005

공정기술과 EDA 툴의 발전에 따라서 하나의 실리콘 다이(Die)에 많은 IP가 집적되고 멀티프로세서가 포함되는 SoC 구조가 가능해지고 있다 그러나 대부분의 기존 SoC 버스는 공유버스 구조라는 문제점으로 인해 통신의 병목현상이 발생하고 이는 전체 시스템 성능을 저하시키는 요인이 된다. 많은 경우에 멀티프로세서 시스템의 성능은 CPU 자체의 속도보다는 효율적인 통신과 균형있는 연산의 분배가 좌우하게 된다 따라서 충분한 SoC 버스 대역폭(Bandwidth)을 확보하기 위한 하나의 해결책으로 크로스바 라우터(Crossbar Router)를 이용하여 효율적인 온 칩 버스구조인 SoC Network Architecture(SNA)를 제안한다. 제안된 SNA구조는 다중 마스터(multi-master)에 대해 다중 채널(multi-channel)을 제공하여 통신의 병목현상을 크게 줄일 수 있으며 뛰어난 확장성을 지원한다. 제안된 구조에 따라 모델 시스템을 설계하고 시뮬레이션을 진행한 결과 AMBA AHB 버스에 비해 평균 $40\%$ 이상 효율이 증가했다.

• 한국정보통신학회논문지
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• 제13권7호
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• pp.1475-1482
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• 2009

본 논문에서는 최적의 Lab-on-a-Chip을 설계하기 위해 나선형 마이크로 채널에서 등속영동 프로틴 분리를 수행하는 컴퓨터 시뮬레이션을 이차원 유한 요소법을 이용하여 개발하였다. 개발한 이차원 ITP 모델은 다섯 가지 요소로 구성되며 Leader로서 염산을, Terminator로서 카르로산, 두 개의 프로틴 중 프로틴 A는 아세트산, 프로틴 B는 벤조산, 그리고 BE(Background Electrolyte)로서 히스티딘을 사용하였다. 컴퓨터 모델은 다섯 가지 구성 요소들에 대한 질량 보존 방정식과 전위에 대한 전하 보존 방정식, 그리고 pH 계산은 전기적 중성 조건식에 기반하고 있다. 제안된 이차원 공간 ITP 모델의 검증을 위해 제안한 모델의 결과와 Bohuslav Gas 그룹에서 개발한 Simu 5의 결과를 비교하였다. 시뮬레이션 결과 일차원 채널에서 두 모델이 매우 유사한 일치를 보임으로 제안한 모델의 정확성을 검증해 주었다. 이차원 프로틴 분리는 Lab-on-a-Chip 설계를 위한 이차원 곡선 채널에서 수행되어 채널 형상이 프로틴 포커싱분포(dispersions)의 변화를 초래함을 알 수 있었다.

• 대한전자공학회논문지
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• 제18권4호
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• pp.34-42
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• 1981

PMOS집적기술을 이용하여 512-Bit mask programmable ROM을 설계하고 제작하였다. ROM의 내용은 제작공정에서 gate pattern으로 기억시켰으며 chip의 출력을 512(32×16)개의 점의 행렬로써 오실로스코프에 나타내어 확인하였다. 제작된 chip은 -6V와 - l2V의 범위에서 정상적으로 동작하였다 소모전력과 전달지연시간은 -6V에서 각각 3mW와 13μsec였다. -12V에서는 소모전력이 27mW로 증가하였으며 전달지연시간은 3μsec로 감소하였다. Chip의 출력은 TTL gate의 인력을 직접 구동시킬 수 있었으며 chip select에 의하여 출력을 disable 시켰을 때는 높은 임피던스 상태를 유지하였다.

• 마이크로전자및패키징학회지
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• 제18권1호
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• pp.41-47
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• 2011

Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size ($1.4\;mm{\times}1.2\;mm{\times}0.40\;mm$) while achieving equivalent electrical performance.