• Title/Summary/Keyword: On-Chip Memory

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Design of Local Field Switching MRAM (Local Field Switching 방식의 MRAM 설계)

  • Lee, Gam-Young;Lee, Seung-Yeon;Lee, Hyun-Joo;Lee, Seung-Jun;Shin, Hyung-Soon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.8
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    • pp.1-10
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    • 2008
  • In this paper, we describe a design of a 128bit MRAM based on a new switching architecture which is Local Field Switching(LFS). LFS uses a local magnetic field generated by the current flowing through an MTJ. This mode reduces the writing current since small current can induce large magnetic field because of close distance between MTJ and the current. It also improves the cell selectivity over using conventional MTJ architecture because it doesn't need a digit line for writing. The MRAM has 1-Transistor 1-Magnetic Tunnel Junction (IT-1MTJ) memory cell structure and uses a bidirectional write driver, a mid-point reference cell block and a current mode sense amplifier. CMOS emulation cell is adopted as an LFS-MTJ cell to verify the operation of the circuit without the MTJ process. The memory circuit is fabricated using a $0.18{\mu}m$ CMOS technology with six layers o) metal and tested on custom board.

VLSI architecture design of CAVLC entropy encoder/decoder for H.264/AVC (H.264/AVC를 위한 CAVLC 엔트로피 부/복호화기의 VLSI 설계)

  • Lee Dae-joon;Jeong Yong-jin
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.30 no.5C
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    • pp.371-381
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    • 2005
  • In this paper, we propose an advanced hardware architecture for the CAVLC entropy encoder/decoder engine for real time video compression. The CAVLC (Context-based Adaptive Variable Length Coding) is a lossless compression method in H.264/AVC and it has high compression efficiency but has computational complexity. The reference memory size is optimized using partitioned storing method and memory reuse method which are based on partiality of memory referencing. We choose the hardware architecture which has the most suitable one in several encoder/decoder architectures for the mobile devices and improve its performance using parallel processing. The proposed architecture has been verified by ARM-interfaced emulation board using Altera Excalibur and also synthesized on Samsung 0.18 um CMOS technology. The synthesis result shows that the encoder can process about 300 CIF frames/s at 150MHz and the decoder can process about 250 CIF frames/s at 140Mhz. The hardware architectures are being used as core modules when implementing a complete H.264/AVC video encoder/decoder chip for real-time multimedia application.

Implementation of DMAC on SoC based on AMBA Platform (AMBA Platform을 기반으로 하는 SoC 상의 DMAC 설계)

  • Hwang, In-Ki;Kim, Jung-Sik
    • Proceedings of the KIEE Conference
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    • 2004.11c
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    • pp.417-419
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    • 2004
  • Because of the demands for high performance and high integrated system, the needs for optimal platform becomes more importance. Optimal platform can handle more data effectively with same resources. AMBA(Advanced Microprocessor Bus Architecture)$^{TM}$ defines on-chip communication standard for designing high performance embedded micro-controllers. It is consisted of AHB, ASB and APB. It can support fast implementation and reliability in system that is composed with reusable IPs. DMAC is one of master in system and generate master signals of AHB to communicate data from one slave(peripheral or memory) to another slave. It can reduce burden of CPU and increase system performance. We designed DMAC based on AMBA and it supports 13 Channels. Each channel can be controlled by software program. It decides channel's priority using round-robin method. It can support P2P, P2M, M2P and P2P communication.

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Fault injection and failure analysis on Xilinx 16 nm FinFET Ultrascale+ MPSoC

  • Yang, Weitao;Li, Yonghong;He, Chaohui
    • Nuclear Engineering and Technology
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    • v.54 no.6
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    • pp.2031-2036
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    • 2022
  • Energetic particle strikes the device and induces data corruption in the configuration memory (CRAM), causing errors and even malfunctions in a system on chip (SoC). Software-based fault injection is a convenient way to assess device performance. In this paper, dynamic partial reconfiguration (DPR) is adopted to make fault injection on a Xilinx 16 nm FinFET Ultrascale+ MPSoC. And the reconfiguration module implements the Sobel and Gaussian image filtering, respectively. Fault injections are executed on the static and reconfiguration modules' bitstreams, respectively. Another contribution is that the failure modes and effects analysis (FMEA) method is applied to evaluate the system reliability, according to the obtained injection results. This paper proposes a software-based solution to estimate programmable device vulnerability.

A study on failure detection in 64MDRAM gate-polysilicon etching process (64MDRAM gate-polysilicon 식각공정의 이상검출에 관한 연구)

  • 차상엽;이석주;우광방
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.1485-1488
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    • 1997
  • The capacity of memory chip has increased vert quickly and 64MDRAM becomes main product in semiconductor manufacturing lines consists of many sequential processes, including etching process. although it needs direct sensing of wafer state for the accurae detching, it depends on indirect esnsing and sample test because of the complexity of the plasma etching. This equipment receives the inner light of etch chamber through the viewport and convets it to the voltage inetnsity. In this paper, EDP voltage signal has a new role to detect etching failure. First, we gathered data(EPD sigal, etching time and etchrate) and then analyzed the relationships between the signal variatin and the etch rate using two neural network modeling. These methods enable to predict whether ething state is good or not per wafer. For experiments, it is used High Density Inductive coupled Plasma(HDICP) ethcing equipment. Experiments and results proved to be abled to determine the etching state of wafer on-line and analyze the causes by modeling and EPD signal data.

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Surface Analysis of Aluminum Bonding Pads in Flash Memory Multichip Packaging

  • Son, Dong Ju;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.4
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    • pp.221-225
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    • 2014
  • Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

Enhanced Prediction Algorithm for Near-lossless Image Compression with Low Complexity and Low Latency

  • Son, Ji Deok;Song, Byung Cheol
    • IEIE Transactions on Smart Processing and Computing
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    • v.5 no.2
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    • pp.143-151
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    • 2016
  • This paper presents new prediction methods to improve compression performance of the so-called near-lossless RGB-domain image coder, which is designed to effectively decrease the memory bandwidth of a system-on-chip (SoC) for image processing. First, variable block size (VBS)-based intra prediction is employed to eliminate spatial redundancy for the green (G) component of an input image on a pixel-line basis. Second, inter-color prediction (ICP) using spectral correlation is performed to predict the R and B components from the previously reconstructed G-component image. Experimental results show that the proposed algorithm improves coding efficiency by up to 30% compared with an existing algorithm for natural images, and improves coding efficiency with low computational cost by about 50% for computer graphics (CG) images.

VLSI Design of Processor IP for TCP/IP Protocol Stack (TCP/IP프로토콜 스택 프로세서 IP의 VLSI설계)

  • 최병윤;박성일;하창수
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.927-930
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    • 2003
  • In this paper, a design of processor IP for TCP/IP protocol stack is described. The processor consists of input and output buffer memory with dual bank structure, 32-bit RISC microprocessor core, DMA unit with on-the-fly checksum capability. To handle the various modes of TCP/IP protocol, hardware and software co-design approach is used rather than the conventional state machine based design. To eliminate delay time due to the data transfer and checksum operation, DAM module which can execute the checksum operation on-the-fly along with data transfer operation is adopted. By programming the on-chip code ROM of RISC processor differently. the designed stack processor can support the packet format conversion operations required in the various TCP/IP protocols.

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An Optimization Technique for Irregular Data Access Patterns on Software Controlled On-Chip Memory SubSystems (소프트웨어 제어 온칩 메모리 서브시스템에서 불규칙 데이터 접근 패턴 최적화 기법)

  • Cho, Doo-San;Cho, Jung-Seok
    • Proceedings of the Korean Information Science Society Conference
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    • 2012.06a
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    • pp.212-214
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    • 2012
  • 데이터 집약적인 대부분의 애플리케이션들은 규칙적인 메모리 접근 패턴과 동시에 불규칙적인 접근 패턴을 커널 코드에 포함하고 있다. 그 동안 대부분의 메모리 접근 패턴 최적화 기법은 규칙적인 패턴에 집중되어 있었다. 하지만 암호화/통신 관련 애플리케이션에서는 불규칙한 패턴으로 메모리 접근의 대부분을 구성하는 경우가 많다. 이러한 불규칙한 메모리 접근 패턴을 대상으로 온칩메모리를 효율적으로 사용하도록 최적화 기법을 일반화하여 설계하는 일은 어려운 작업이기 때문에 관련 연구분야에 큰 진전이 없는 실정이다. 우리는 불규칙 메모리 접근 패턴 최적화 문제를 해결하기 위하여 데이터 클러스터링 기법을 제안하였다. 클러스터링은 접근되는 데이터의 시공간 지역성을 계산하여 이득이 큰 데이터들을 하나의 블록으로 구성하여 온칩메모리에 상주시키는 기본단위로 사용하는 기법이다. 본 기법을 이용하면 기존의 캐시메모리에 비하여 약 19% 에너지 소모를 절감할 수 있다.

Study on a Basis of a Smart Card Model (스마트카드 모델의 기준에 관한 연구)

  • Hwang, Sun-Tae;Lee, Hyung
    • The Journal of Society for e-Business Studies
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    • v.4 no.3
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    • pp.197-212
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    • 1999
  • In general, the electronic commerce systems comprise the background system, terminal, network and smart cards. Among them, the smart card systems are expected to take a great portion of applications for the convenience of rapidly improving technology. The technology includes adopting RISC processors or co-processors for cryptography and developing new memory systems based on the standardization. In this paper, we investigate the overall trends of the technology and the standardization process of smart cards. We also propose the guidelines to enhance the capabilities of designing H/W and S/W related to COS(Chip Operating System).

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