• 한국수소및신에너지학회논문집
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• 제4권1호
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• pp.41-50
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• 1993

The hydrogen absorption and desorption characteristics of microencapsulated (CFM)$Ni_{4.7}Al_{0.2}Fe_{0.1}$ and $MmNi_4Fe$ powder with Ni and/or Cu by means of chemical plating method have been investigated. Initial hydrogen absorption rate and activation property were increased remarkably by encapsulation and subsequent compacting. Pellets abtained by compacting of Cu-encapsulated fine powder have fairly good strength even after 30 cycles of hydriding and dehydriding. Encapsulated alloy powder and their compacts show a good resistance to degradation by $O_2$ or CO in hydrogen.

• Journal of Welding and Joining
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• 제5권4호
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• pp.12-21
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• 1987

To investigate the suitability of nitrogen gas as an internal purging gas, various properties of GTA welded joints of duplex, 316L stainless steel, Cu-Ni alloy pipe using nitrogen purging gas were evaluated with reference to onew purged with argon gas. Mechanical properties evaluated by the tensile, bending test, and hardness value of welded joints with nitrogen gas purging did not show any difference those with argon gas. General and local corrosion rates of each welded joint prepared by nitrogen gas purging also showed no difference with those prepared by argon gas. Based on the present test results it is confirmed that nitrogen is a suitable purging gas for GTA welding of stainless steels and nonferrous piping systems, which can be used at lower cost instead of argon.

• 한국표면공학회지
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• 제9권3호
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• pp.1-4
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• 1976

In order to get high wear-resistant gold alloy plating on electronic parts, on attempt has been made, in which Cu, Ni, and Zn EDTA salts were added in gold palting solution. The results obtained on the wear resistance are as follows: 1. The addition of 0.5g/ι or over Cu in plating solution, showed 1.5 times more wear resistance than in case of no addition. 2. The addition of 1.5g/ι or over Ni, showed 3.5 times more wear-resistance . 3. The addition of 1.5g/ι and 4.0g/ι Zn , showed 3.5 times and 6.8 times more wear resistance , respectively. 4. The addition of 1.5g/ι Ni and 1.0g/ι Zn simultaneously , showed about 10 times more wear resistance than in case of no addition.

• 한국수소및신에너지학회논문집
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• 제12권3호
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• pp.177-189
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• 2001

T hydrogen absorption-desorption behavior induced by thermal or hydrogen pressure cycling in a closed system was observed in hydrogen storage alloys, $(La-R-Mm)Ni_{4.5}Fe_{0.5}$, $MmNi_4Fe_{0.85}Cu_{0.15}$ and $(Ce-F-Mm)Ni_{4.7}Al_{0.2}Fe_{0.1}$. Thereby (La-R-Mm), Mm and (Ce-F-Mm) refer to La-rich mischmetal, mischmetal and Ce-free mischmetal respectively. As the results, it is found that the alloy stabilities during thermal cycling varies with alloy composition change. The highest stability occurs in $MmNi_4Fe_{0.85}Cu_{0.15}$ and the lowest stability in $(La-R-Mm)Ni_{4.5}Fe_{0.5}$. Comparing hydrogen pressure cycling with thermal cycling, pressure cycling causes severer degradation of the alloy $(Ce-F-Mm)Ni_{4.7}Al_{0.2}Fe_{0.1}$ than thermal cycling. When the 1500 times-cycled alloy is annealed at $400^{\circ}C$ for 3hrs under 1 atm of hydrogen pressure the hydrogen storage capacity is recovered only partially but not completely to the initial capacity. The amount of capacity loss after annealing is larger in the hydrogen pressure cycled samples than in the thermal cycled, suggesting an incoming of impure gas during hydrogen pressure cycling.

• Journal of Electrochemical Science and Technology
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• 제12권2호
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• pp.188-203
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• 2021

The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the durability of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.189-192
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• 2002

Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi, 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~222$^{\circ}C$, 응고온도범위는 20~37$^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금조성으로 판단된다. 이 합금은 융점이 22$0^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.

• Transactions on Electrical and Electronic Materials
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• 제12권1호
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• pp.28-31
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• 2011

Transformation behavior and shape memory characteristics of Ti-(45-x)Ni-5Cu-xCr (x=0.5-2.0) alloys have been investigated by means of electrical resistivity measurements, differential scanning calorimetry, X-ray diffraction and thermal cycling tests under constant load. Two-stage B2-B19-B19' transformation occurred in Ti-(45-x)Ni-5Cu-xCr alloys. The B2-B19 transformation was separated clearly from the B19-B19' transformation in Ti-44.0Ni-5Cu-1.0Cr and Ti-43.5Ni-5Cu-1.5Cr alloys. A temperature range where the B19 martensite exists was expanded with increasing Cr content because decreasing rate of Ms (85 K / % Cr) was larger than that of Ms' (17 K / % Cr). Ti-(45-x)Ni-5Cu-xCr alloys were deformed in plastic manner with a fracture strain of 68% ~ 43% depending on Cr content. Substitution of Cr for Ni improves the critical stress for slip deformation in a Ti-45Ni-5Cu alloy due to solid solution hardening.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.57-57
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• 2000

본 논문에서는 MCM 및 패키지의 Lid로 사용되는 합금인 Kovar (Fe-Ni-Co alloy) 와 LTCC (Low Temperature Co-fired Ceramics) 간의 Brazing 특성을 연구하였다. 기존에 사용되고 있는 알루미나 패키지의 경우, 주로 80$0^{\circ}C$ 이상의 온도에서 Brazing을 실시하고 있으며, 조성은 Ag-Cu 계열을 사용하고 있다. 하지만, LTCC 의 경우, 소결온도가 85$0^{\circ}C$ 내외로서 기존의 방법을 그대로 적용하기는 어려움이 있다. 또한 Brazing 특성에 따른 접착 강도는 Brazing Alloy 의 영향뿐만 아니라 LTCC 와 전도체 전극사이의 Metallization 에 크게 영향을 받는다. 따라서, 본 논문에서는 Brazing Alloy의 종류 (Ag-Cu, Au-Sn) 및 Brazing 조건에 따른 Brazing 특성뿐만 아니라, 전도체 전극내 유리질 함량에 따른 Brazing 특성을 평가하여 LTCC/Kovar 간의 최적의 Brazing 조건을 구현하고자 하였다.

• 한국분말재료학회지
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• 제26권2호
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• pp.112-118
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• 2019

Infiltration is a popular technique used to produce valve seat rings and guides to create dense parts. In order to develop valve seat material with a good thermal conductivity and thermal expansion coefficient, Cu-infiltrated properties of sintered Fe-Co-M(M=Mo,Cr) alloy systems are studied. It is shown that the copper network that forms inside the steel alloy skeleton during infiltration enhances the thermal conductivity and thermal expansion coefficient of the steel alloy composite. The hard phase of the CoMoCr and the network precipitated FeCrC phase are distributed homogeneously as the infiltrated Cu phase increases. The increase in hardness of the alloy composite due to the increase of the Co, Ni, Cr, and Cu contents in Fe matrix by the infiltrated Cu amount increases. Using infiltration, the thermal conductivity and thermal expansion coefficient were increased to 29.5 W/mK and $15.9um/m^{\circ}C$, respectively, for tempered alloy composite.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.