• Bulletin of the Korean Chemical Society
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• v.33 no.12
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• pp.4251-4254
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• 2012

• Journal of Power System Engineering
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• v.14 no.4
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• pp.50-55
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• 2010

In order to investigate tribological effects of nano copper particles impregnated(CuN) on surface polytetrafluoroethylene(PTFE) on sealing wear and an experimental study was carried out to determine the wear behavior of copper nano-particles impregnation two kind thickness in super critical $CO_2$ liquid. Experimental results showed that the friction coefficients of CuN PTFE at the low sliding speed(0.44m/s) and the oil temperature ($60^{\circ}C$) were higher than that of virgin PTFE. And a thin nano copper particles impreganated thickness was formed on the surface in the PTFE and the specimen with this treatment has much better friction properties than the original one. Fortunately, at the high load(80 N) and the oil temperature, the friction coefficient of CuN PTFE was lower than that of virgin PTFE. This evidenced the load carrying capacity of CuN PTFE was much better than that of virgin PTFE under the high load condition(80 N) specially. Therefore, it can be concluded that the friction coefficient variation of CuN PTFE is very small but its wear rate decreases greatly with increase in sliding speed.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• Journal of Powder Materials
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• v.15 no.3
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• pp.227-233
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• 2008

Dynamic plastic deformation behavior of copper particles occurred during the cold spray processing was numerically analyzed using the finite element method. The study was to investigate the impact as well as the heat transfer phenomena, happened due to collision of the copper particle of $20{\mu}m$ in diameter with various initial velocities of $300{\sim}600m/s$ into the copper matrix. Effective strain, temperature and their distribution were investigated for adiabatic strain and the accompanying adiabatic shear localization at the particle/substrate interface.

• Journal of Powder Materials
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• v.22 no.4
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• pp.247-253
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• 2015

The sintering mechanisms of nanoscale copper powders have been investigated. A molecular dynamics (MD) simulation with the embedded-atom method (EAM) was employed for these simulations. The dimensional changes for initial-stage sintering such as characteristic lengths, neck growth, and neck angle were calculated to understand the densification behavior of copper nano-powders. Factors affecting sintering such as the temperature, powder size, and crystalline misalignment between adjacent powders have also been studied. These results could provide information of setting the processing cycles and material designs applicable to nano-powders. In addition, it is expected that MD simulation will be a foundation for the multi-scale modeling in sintering process.

• Advances in nano research
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• v.5 no.4
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• pp.359-372
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• 2017

Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of $CuCl_2$ (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of $30-80^{\circ}C$. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at $400^{\circ}C$ and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metalli-ccopper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of $50^{\circ}C$.

• Journal of the Korean Wood Science and Technology
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• v.40 no.3
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• pp.212-227
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• 2012

Current research trends in wood preservatives for enhancing durability was reviewed. Due to leaching of recent Copper-Based Preservatives commonly used as chemicals for pressure treatment; they have been a growing concern, especially in improving the fixation of the copper as alkyl ammonium quat. and azol in wood and preventing the leaching of active ingredients. With the appearance of emulsion type chemicals using micronized and nano-sized wood preservatives, researchs on characteristics of Copper-Based Preservatives regarding penetration and fixation in wood are debatable. Moreover, unlike the case of CCA, the recent alkyl ammonium quat. and azol bear a serious threat in the decrease of antimicrobial effectiveness against wood destroying fungi with copper tolerance. Therefore, development and research of co-biocide is needed.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.4
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• pp.514-521
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• 2008

Many research works for improving a boundary lubrication performance have been executed by using solid lubricants, and been tried to apply an engine lubrication. However those general lubricants have not been applied on engines due to the extreme conditions such as very high temperature and pressure during combustion process in a cylinder. In this study a lubricant containing copper alloy nano-powder is applied on a diesel engine driven by an electric motor. Torques and shaft vibrations are measured, then an engine friction loss and rotating stability are assessed. The results show that the frequency of the vibration is about the same as that of a general lubricant, but the amplitudes in the both X and Y direction are reduced as well as the friction loss is reduced.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.