한국분말야금학회:학술대회논문집 (Proceedings of the Korean Powder Metallurgy Institute Conference)
- 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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- Pages.377-378
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- 2006
Development of Nano-Tungsten-Copper Powder and PM Processes
- Lee, Seong (ADD) ;
- Noh, Joon-Woong (ADD) ;
- Kwon, Young-Sam (CetaTech, Inc.) ;
- Chung, Seong-Taek (CetaTech, Inc.) ;
- Johnson, John L. (Kennametal Inc.) ;
- Park, Seong-Jin (Mississippi State University) ;
- German, Randall M. (Mississippi State University)
- 발행 : 2006.09.24
초록
Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.