• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.1
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• pp.233-238
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• 2016

Recently, the multi-core processor architecture is widely adopted in the embedded processors for enhancing its performance. Multi-core processors are classified either as symmetric or asymmetric. Asymmetric multicore processors are known to score higher performance and more efficient than symmetric multi-core processors. In order to study the performance enhancement of asymmetric multi-core embedded processors over the symmetric ones, the trace-driven simulation has been executed for various asymmetric embedded dual-core, quad-core, octa-core and hexadeca-core processors and compared with the symmetric ones of similar hardware budget using MiBench benchmarks as input.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.5
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• pp.219-224
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• 2015

Recently, the multi-core processor architecture is widely used in the digital signal processors for enhancing its performance. Multi-core processors are classified either as symmetric or asymmetric. Asymmetric multi-core processors are known to have higher performance and more efficient than symmetric multi-core processors. In order to study the performance enhancement of asymmetric multi-core digital signal processors over the symmetric ones, the trace-driven simulation has been executed for various asymmetric quad-core, octa-core and hexadeca-core digital signal processors and compared with the symmetric ones of similar hardware budget using UTDSP benchmarks as input.

• Journal of Computing Science and Engineering
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• v.5 no.1
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• pp.1-18
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• 2011

As the first step toward real-time multi-core computing, this paper presents a novel approach to bounding the worst-case performance for threads running on multi-core processors with shared L2 instruction caches. The idea of our approach is to compute the worst-case instruction access interferences between different threads based on the program control flow information of each thread, which can be statically analyzed. Our experiments indicate that the proposed approach can reasonably estimate the worst-case shared L2 instruction cache misses by considering the inter-thread instruction conflicts. Also, the worst-case execution time (WCET) of applications running on multi-core processors estimated by our approach is much better than the estimation by simply assuming all L2 instruction accesses are misses.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.297-312
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• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• ETRI Journal
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• v.41 no.6
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• pp.863-872
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• 2019

Elliptic curve cryptography is a relatively lightweight public-key cryptography method for key generation and digital signature verification. Some lightweight curves (eg, Curve25519 and Curve Ed448) have been adopted by upcoming Transport Layer Security 1.3 (TLS 1.3) to replace the standardized NIST curves. However, the efficient implementation of Curve Ed448 on Internet of Things (IoT) devices remains underexplored. This study is focused on the optimization of the Curve Ed448 implementation on low-end IoT processors (ie, 8-bit AVR and 16-bit MSP processors). In particular, the three-level and two-level subtractive Karatsuba algorithms are adopted for multi-precision multiplication on AVR and MSP processors, respectively, and two-level Karatsuba routines are employed for multi-precision squaring. For modular reduction and finite field inversion, fast reduction and Fermat-based inversion operations are used to mitigate side-channel vulnerabilities. The scalar multiplication operation using the Montgomery ladder algorithm requires only 103 and 73 M clock cycles on AVR and MSP processors.

• The KIPS Transactions:PartA
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• v.17A no.6
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• pp.265-274
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• 2010

As the process technology scales down and integration densities continue to increase, interconnection has become one of the most important factors in performance of recent multi-core processors. Recently, to reduce the delay due to interconnection, 3D architecture has been adopted in designing multi-core processors. In 3D multi-core processors, multiple cores are stacked vertically and each core on different layers are connected by direct vertical TSVs(through-silicon vias). Compared to 2D multi-core architecture, 3D multi-core architecture reduces wire length significantly, leading to decreased interconnection delay and lower power consumption. Despite the benefits mentioned above, 3D design technique cannot be practical without proper solutions for hotspots due to high temperature. In this paper, we propose three floorplan schemes for reducing the peak temperature in 3D multi-core processors. According to our simulation results, the proposed floorplan schemes are expected to mitigate the thermal problems of 3D multi-core processors efficiently, resulting in improved reliability. Moreover, processor performance improves by reducing the performance degradation due to DTM techniques. Power consumption also can be reduced by decreased temperature and reduced execution time.

• Journal of the Korea Society of Computer and Information
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• v.15 no.11
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• pp.1-9
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• 2010

As the process technology scales down, an interconnection has became a major performance constraint for multi-core processors. Recently, in order to mitigate the performance bottleneck of the interconnection for multi-core processors, a 3D integration technique has drawn quite attention. The 3D integrated multi-core processor has advantage for reducing global wire length, resulting in a performance improvement. However, it causes serious thermal problems due to increased power density. For this reason, to design efficient 3D multi-core processors, thermal-aware design techniques should be considered. In this paper, we analyze the temperature on the 3D multi-core processors in function unit level through various experiments. We also present temperature characteristics by varying application features, cooling characteristics, and frequency levels on 3D multi-core processors. According to our experimental results, following two rules should be obeyed for thermal-aware 3D processor design. First, to optimize the thermal profile of cores, the core with higher cooling efficiency should be clocked at a higher frequency. Second, to lower the temperature of cores, a workload with higher thermal impact should be assigned to the core with higher cooling efficiency.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.2
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• pp.157-163
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• 2016

If trace-driven or execution-driven simulation is used for the performance analysis of asymmetric multi-core processors, excessive time and much disk space are necessary. In this paper, statistical simulations are performed for asymmetric multi-core processors with various hardware configurations. For the experiment, SPEC 2000 benchmark programs are used for profiling and synthesis, which is supplied as input for the simulation of asymmetric multi-core processors. As a result, the performance of asymmetric multi-core processor obtained by statistical simulation is comparable to that of the trace-driven simulation with a tremendous reduction in the simulation time.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.104.2-104
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• 2001

In the intelligent integrated systems, the delay time must be reduced using highly parallel processors, as well as high throughput performance. In this paper, we propose a new concept for building 3D highly parallel processors using multi-layer printed wiring boards with built-in soldering heater (BISH-PWB). The proposed BISH is realized with the long and narrow cupper wiring pattern on the internal layer in the terminal pattern area. Based on the linearity of the cupper resistance vs. temperature, we can measure the BISH, temperature and its calorific value from the heater voltage and current measurements. If we provide the BISH temperature control systems for each BISH, selective multi-point soldering can be realized with same ...

• Journal of the Korea Society of Computer and Information
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• v.17 no.6
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• pp.1-11
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• 2012

As the process technology scales down, multi-core processors cause serious problems such as increased interconnection delay, high power consumption and thermal problems. To solve the problems in 2D multi-core processors, researchers have focused on the 3D multi-core processor architecture. Compared to the 2D multi-core processor, the 3D multi-core processor decreases interconnection delay by reducing wire length significantly, since each core on different layers is connected using vertical through-silicon via(TSV). However, the power density in the 3D multi-core processor is increased dramatically compared to that in the 2D multi-core processor, because multiple cores are stacked vertically. Unfortunately, increased power density causes thermal problems, resulting in high cooling cost, negative impact on the reliability. Therefore, temperature should be considered together with performance in designing 3D multi-core processors. In this work, we analyze the temperature of the cache in quad-core processors varying cache organization. Then, we propose the low-temperature cache organization to overcome the thermal problems. Our evaluation shows that peak temperature of the instruction cache is lower than threshold. The peak temperature of the data cache is higher than threshold when the cache is composed of many ways. According to the results, our proposed cache organization not only efficiently reduces the peak temperature but also reduces the performance degradation for 3D quad-core processors.