• 제목/요약/키워드: Multi-Chip Packaging

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A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J.
    • 마이크로전자및패키징학회지
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    • 제9권1호
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    • pp.43-48
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    • 2002

  • Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

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3D Multi-chip packaging 을 위한 열 설계 및 열전 냉각 성능 시뮬레이션 (Simulation of thermal design and thermoelectric cooling for 3D Multi-chip packaging)

  • 장봉균;현승민;김재현;이학주
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2009년도 추계학술대회 논문집
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    • pp.711-712
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    • 2009

  • MCP 기술을 이용한 반도체 칩에서 문제가 되는 방열문제를 해결하기 위한 방법으로 열전 냉각 소자를 이용하여 열을 방출 시키는 방법에 관하여 연구를 수행하였다. 시뮬레이션을 통하여 열전 소자가 작동할 때, 흡수하는 열량을 계산할 수 있었으며, 열전 소자의 냉각 성능도 평가 할 수 있었다. 이러한 열 해석 및 열전 해석을 통하여 적층 구조의 MCP 모듈을 위한 열 설계 및 효율적 냉각을 가능하게 할 수 있을 것이다.

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Multi-Chip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • 마이크로전자및패키징학회지
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    • 제8권2호
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    • pp.49-52
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    • 2001

  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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MultiChip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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    • pp.1-7
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    • 2001

  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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