Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 8 Issue 2
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- Pages.49-52
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- 2001
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Multi-Chip Packaging for Mobile Telephony
Abstract
This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.
Keywords