Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

1999.11a
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Pages.131-135
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1999

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)

권호 표지

Study on the structure of buried type capacitor for MCM (Multi-Chip-Module)

MCM-C(Multi-Chip-Module)용 내장형 캐패시터의 구조적 특성에 관한 연구

Yoo, C.S. (Korea Electronics Technology Institute) ;
Lee, W.S. (Korea Electronics Technology Institute) ;
Cho, H.M. (Korea Electronics Technology Institute) ;
Lim, W. (Korea Electronics Technology Institute) ;
Kang, N.K. (Korea Electronics Technology Institute) ;
Park, J.C. (Korea Electronics Technology Institute)

유찬세 (전자부품연구원) ;
이우성 (전자부품연구원) ;
조현민 (전자부품연구원) ;
임욱 (전자부품연구원) ;
강남기 (전자부품연구원) ;
박종철 (전자부품연구원)

Published : 1999.11.01

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