• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.101-104
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• 1998

A new planar-type micro gas sensor was designed and fabricated on silicon substrate and the operating characteristics of the sensor were investigated. The thin sensitive film of the sensor was fabricated by spin-coating of the SnO$_2$ sol solution which was synthesized by hydrothermal method. The spin-coating method for preparation of sensing layer was adopted to improve the long-term stability of the fabricated sensing film instead of physical methods such as rf sputtering and thermal evaporation. The fabricated microsensor showed a fairly good sensing performance for CO gas in air at 250$^{\circ}C$ The sensitivity(S=Ra/Rg) was shown to be about 5 to 2000ppm CO with heating power of 50mW.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.78-83
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• 1998

A small size cartrideg for FET type electrolyte sensor is designed and faricated with much simplified process by using micromachining tenchiques such as silicon etching andglass bonding. Size of the whole cartideg is 2.4cm*2.5cm, and the dead volume of a micro flow-channel in the cartrideg is only 8.5.mu.l. The photosensitive polymer(THB 30) is used to define a micropool and to encapsulate the sensor surface for standardizationof electrolyte sensors. To miniaturize micro flow-channel conventional reference electrode(Ag/AgCl) a differential amplification is introduced using REFET and quasi reference electrode. Refet was fabricated using photosensitive polymer(OMR 83). The fabricated cartridge with built-in pH-ISFET showed good operational characteristics such as linearity and high sensitivity (55.4mV/pH) in a wide pH range(pH2-pH12).

• 제어로봇시스템학회:학술대회논문집
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• 1992.10b
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• pp.22-28
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• 1992

The need for intelligent systems that can operate in an unstructured, dynamic environment has created a growing demand for the use of multiple, distributed sensors. While most research in multisensor fusion has revolved around applications in object recognition-including military applications for automatic target recognition-developments in microsensor technology are encouraging more research in affordable, highly-redundant sensor networks. Three trends that are described at length are the increasing use of microsensors, the techniques that are used in the handling of partial or uncertain data, and the application of neural network techniques for sensor fusion.

• Journal of Sensor Science and Technology
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• v.20 no.6
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• pp.428-433
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• 2011

We report on the building of a micro sensor array based on typical semiconductor fabrication processes aimed at monitoring selectively a specific gas in ambient of other gases. Chemical sensors can be applied for an electronic nose and/or robots using this technique. Microsensor array was fabricated on the same chip using 0.6${\mu}m$ CMOS technology, and unique gas sensing patterns were obtained by principal component analysis from the array. $SnO_2$/Pt sensor for CO gas showed a high selectivity to buthane gas and humidity. $SnO_2$ sensor for hydrogen gas, however, showed a low selectivity to CO and buthane gas. We can obtain more distinguishable patterns that provide the small sensing deviation(the high seletivity) toward a given analyte in the response space than in the chemical space through the specific parameterization of raw data for chemical image formation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.567-570
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. the thermal analysis for the proposed planar structure including temperature distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of an actual device to investigate the acceptability of the computer simulation.

• Bulletin of the Korean Chemical Society
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• v.18 no.6
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• pp.584-588
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• 1997

A new device to accurately deliver small amount of modifier into supercritical carbon dioxide fluid is described. Carbon dioxide, the most widely used mobile phase in supercritical fluid chromatography, is a relatively non-polar fluid, and hence the addition of small amount of polar modifiers could be necessary to migrate polar solutes. In this work, supercritical CO₂and modifier are delivered from the pump to a 100 μL mixing chamber in which a small magnetic bar is rotating. After passing through the mixing chamber, supercritical CO₂is changed to a new mobile phase with different polarity. The amount of modifier added into supercritical CO₂is measured by an amperometric microsensor, which is prepared from a thin film of perfluorosulfonate ionomer.

• Korean Journal of Materials Research
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• v.12 no.11
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• pp.880-882
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• 2002

We have prepared magnetic thin films of FeSiB by sputtering and examined microstructure and magnetic properties of the annealed films in order to investigate the feasibility of the films to microsensor application. Effects of vacuum annealing on the magnetic properties of $Fe_{84}$$Si_{6}$$B_{10}$ films have been examined as a function of temperature. The heating rate and the holding time were 10 K/min and 1 hour, respectively. Vacuum condition was held during cooling to prevent oxidation of the films. The coercivity did not show any noticeable change (~1500 A/m), although the grain size of the crystalline phase in the annealed films increased gradually up to about 16 nm until 673 K. However, both the grain size and the coercivity increased steeply when the annealing temperature increased over 723 K. Since the saturation magnetization is closely related to the phase evolution, the variation of the saturation magnetization of the annealed films was similar to that of the ribbon materials; the thin films were transformed from amorphous to crystalline with $\alpha$-(Fe,Si) phase by increasing annealing temperature.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.12-18
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• 2002

Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.

• Journal of information and communication convergence engineering
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• v.6 no.1
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• pp.38-42
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• 2008

Highly sensitive and mechanically stable gas sensors have been fabricated using the microfabrication and micromachining techniques. The sensing materials used to detect the offensive $CH_3SH$ and $(CH_3)_3N$ gases are 1 wt% Pd-doped $SnO_2$ and 6 wt% $Al_2O_3$-doped ZnO, respectively. The optimum operating temperatures of the devices are $250^{\circ}C$ and $350^{\circ}C$ for $CH_3SH$ and $(CH_3)_3N$, respectively and the corresponding heater power is, respectively, about 55mW and 85mW. Excellent thermal insulation is achieved by the use of a double-layer membrane: i.e. $0.2{\mu}m$-thick silicon nitride and $1.4{\mu}m$-thick phosphosilicate glass. The sensors are mechanically stable enough to endure the heat cycles between room temperature and $350^{\circ}C$, at least for 30 days.

• Journal of IKEEE
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• v.1 no.1 s.1
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.