• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.107-107
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• 2009

Micro pillar structure was investigated for the energy havesting applications. The micro pillar structures were investigated to find proper size of pillars. In this experiments, the aspect ratio between the height and diameter were changed to extract maximum peizoelectric coefficient. We proposed the idea and model for the energy harvesting systems based on the micro-pillar structure.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• 제5권5호
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• pp.631-636
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• 2018

Extraction of photosynthetic currents from thylakoids was studied using micro pillar structured electrode. Thylakoids were isolated from spinach leaves, and the size and shape of thylakoids were estimated from scanning electron microscopy images. Based on the geometry information of thylakoids, micro pillar shaped electrode was designed and fabricated using metal-assisted chemical etching of silicon wafers. Influence of photovoltaic effect on the silicon-based micro pillar electrode was confirmed to be negligible. Photosynthetic currents were measured in a three-electrode setup with an electron mediator, potassium ferricyanide. Photosynthetic currents from micro pillar electrodes were enhanced compared with the currents from flat electrodes. This indicates the significance of the enhanced contact between thylakoids and an electrode for harvesting photosynthetic electrons.

• Applied Science and Convergence Technology
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• 제23권1호
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• pp.54-59
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• 2014

The roll-to-roll (R2R) fabrication method to make micro-scale pillar arrays for biomimetic functionalization of surfaces is presented. Inspired by the micro-structure of plants in nature, a surface with a synthetic micro-scale pillar array is fabricated via maskless photolithography. After the surface is SAM (self-assembled monolayer) coated with trichlorosilane in a vacuum desiccator, it displays a hydrophobic property even in R2R replicas of original substrate, whose properties are further characterized using various pitches and diameters. In order to perform a comparison between the original micro-pattern and its replicas, surface morphology was analyzed using scanning electron microscopy and wetting characteristics were measured via a contact angle measurement tool with a $10{\mu}L$ water droplet. Efficient roll-to-roll imprinting for a biomimetic functionalized surface has the potential for use in many fields ranging from water repelling and self-cleaning to microfluidic chips.

• 마이크로전자및패키징학회지
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• 제30권3호
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• pp.1-10
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• 2023

최근, 고사양 컴퓨터, 모바일 제품의 수요가 증가하면서 반도체 패키지의 고집적화, 고밀도화가 요구된다. 따라서 많은 양의 데이터를 한 번에 전송하기 위해 범프 크기 및 피치 (Pitch)를 줄이고 I/O 밀도를 증가시킬 수 있는 플립 칩 (flip-chip), 구리 필러 (Cu pillar)와 같은 마이크로 범프 (Micro-bump)가 사용된다. 하지만 범프의 직경이 70 ㎛ 이하일 경우 솔더 (Solder) 내 금속간화합물 (Intermetallic compound, IMC)이 차지하는 부피 분율의 급격한 증가로 인해 취성이 증가하고, 전기적 특성이 감소하여 접합부 신뢰성을 악화시킨다. 따라서 이러한 점을 개선하기 위해 UBM (Under Bump Metallization) 또는 Cu pillar와 솔더 캡 사이에 diffusion barrier 역할을 하는 층을 삽입시키기도 한다. 본 review 논문에서는 추가적인 층 삽입을 통해 마이크로 범프의 과도한 IMC의 성장을 억제하여 접합부 특성을 향상시키기 위한 다양한 연구를 비교 분석하였다.

• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.601-604
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• 2010

In this study, the piezoelectric energy harvester was investigated employing the pillar structure with the diameter size of 50~500 um. Usually, the aspect ratio between the height and diameter was related with the piezoelectric performance. High aspect ratio was showed the low electric noise and high piezoelectric properties than low aspect ratio. Therefore, we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the 250 ${\mu}m$. In this presentation, we will report the process and properties of micro pillar structure based on the PMN-PZT (Pb$(Mg_{1/3}Nb_{2/3})O_3$-PbZrTiO$_3$) materials.

• 한국전기전자재료학회논문지
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• 제25권4호
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• pp.286-289
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• 2012

In this paper, we have proposed piezoelectric energy harvester employing the pillar structure with the diameter size of 500 um. So we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the $500{\mu}m$. Simultaneously, we tried to make a comparative study to use ceramic bulk - polymer structure In this paper, we will report the process and properties of micro pillar structure based on the PMN-PZT ($Pb(Mg_{1/3}Nb_{2/3})O_3-PbZrTiO_3$) materials. Finally, We will propose a method for generating electrical energy with a piezoelectric element using vibration, an energy source can be obtained from the "clean" energy.

• JSTS:Journal of Semiconductor Technology and Science
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• 제7권3호
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• pp.161-165
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• 2007

In this paper, mesoporous Pt on micro pillars Pt electrode is newly designed, fabricated, and characterized on silicon substrate for non-enzymatic electrochemical sensor micro-chip integrated with CMOS readout circuitry. The fabricated micro/nano Pt electrode has cylindrical hexangular arrayed nano Pt pores with a diameter of 3.2 nm which is formed on top of the micro pillars Pt electrode with approximately $6{\mu}m$ in diameter, $6{\mu}m$ in space, and $50{\mu}m$ in height. The measured current responses of the fabricated plane Pt, mesoporous Pt, and mesoporous Pt on the micro pillar Pt electrodes are approximately $9.9nA/mm^2,\;6.72{\mu}A/mm^2,\;and\;7.67{\mu}A/mm^2$ in 10mM glucose solution with 0.1M phosphate buffered saline (PBS) solution, respectively. In addition, the measured current responses of the fabricated plane Pt, mesoporous Pt, and mesoporous Pt on the micro pillar Pt electrodes are approximately $0.15{\mu}A/mm^2,\;0.56{\mu}A/mm^2,\;and\;0.74{\mu}A/mm^2$ in 0.1mM ascorbic acid (AA) solution with 0.1M phosphate buffered saline (PBS) solution, respectively. This experimental results show that the proposed micro/nano Pt electrode is highly sensitive and promising for CMOS integrated non-enzymatic electrochemical sensor applications. Since the micro-pillar Pt electrode can also be utilized with a micro-fluidic mixer in the sensor chip, the sensor chip can be much smaller, cheaper, and easier to be fabricated.

• 마이크로전자및패키징학회지
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• 제28권4호
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• pp.57-61
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• 2021

마이크로 기둥 구조물 위에 인듐 범프 배열을 형성하는 공정을 제안한다. Benzocyclobutene (BCB) 평탄화와 etch-back 공정을 통하여 매우 협소한 마이크로 기둥 위에 인듐 범프를 형성할 수 있는 공간을 확보할 수 있다. 본 연구에서는 단파장 적외선을 감지용 320×256 포맷의 하이브리드 카메라 센서 제조에 대한 자세한 공정 과정을 소개한다. 다양한 공정을 거친 BCB 필름의 shear strength는 quartz crystal microbalance 방법으로 측정하여 추출하였다. BCB 필름의 shear strength는 인듐 범프보다 10³배 더 높은 것으로 확인하였다. 제작된 SWIR 카메라 센서로부터 측정된 암전류의 분포는 제안한 인듐 범프 형성 공정이 매우 민감한 적외선 카메라 센서를 구현하는 데 유용할 수 있음을 제시한다.

• 반도체디스플레이기술학회지
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• 제11권4호
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• pp.43-48
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• 2012

The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc. for forming the high precision micro-pattern. Also A number of studies of screen printing method has been conducted as the method for the cost down through the improvement of productivity. Because of being the dot printing method of the cylindrical shape not being the line printing method like the existing PDP barrier rib and phosphor, the pillar arrays using the screen printing method is deposited in the hemispherical type not being cylindrical shape in the existing printing process conditions. In this paper, the parameters were set on the screen printing device in order to deposit the cross-sectional shape with the cone or trapezoid shape of the pillar in depositing the pillars used the screen printing device for vacuum glazing. The cross-sectional shape slope of the pillar according to the parameters was measured. And analysis the effect of the screen printing process conditions on the cross-sectional shape slope of pillars based upon the result of being measured. The processing conditions were drawn to minimize the cross-sectional shape slope of pillar.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.