Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Processing Study for the Micro Pillar for Piezoelectric Energy Harvest

압전 에너지 하베스트를 위한 마이크로 필라 공정 연구

  • Yun, Seok-Woo (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Lee, Ku-Tak (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Lee, Kyoung-Su (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Jeong, Soon-Jong (Research Center of Energy semiconductor, Korea Electrotechnology Research Institute) ;
  • Kim, Min-Soo (Research Center of Energy semiconductor, Korea Electrotechnology Research Institute) ;
  • Cho, Kyoung-Ho (Research Headquarter of the Fourth Technology, Agency for Defense Development) ;
  • Koh, Jung-Hyuk (Department of Electronic Materials Engineering, Kwangwoon University)
  • 윤석우 (광운대학교 전자재료공학과) ;
  • 이규탁 (광운대학교 전자재료공학과) ;
  • 이경수 (광운대학교 전자재료공학과) ;
  • 정순종 (한국전기연구원 에너지반도체센터) ;
  • 김민수 (한국전기연구원 에너지반도체센터) ;
  • 조경호 (국방과학연구소 제4기술연구본부) ;
  • 고중혁 (광운대학교 전자재료공학과)
  • Received : 2010.05.18
  • Accepted : 2010.06.21
  • Published : 2010.08.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, the piezoelectric energy harvester was investigated employing the pillar structure with the diameter size of 50~500 um. Usually, the aspect ratio between the height and diameter was related with the piezoelectric performance. High aspect ratio was showed the low electric noise and high piezoelectric properties than low aspect ratio. Therefore, we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the 250 ${\mu}m$. In this presentation, we will report the process and properties of micro pillar structure based on the PMN-PZT (Pb$(Mg_{1/3}Nb_{2/3})O_3$-PbZrTiO$_3$) materials.

Keywords

References

  1. J. Kymissis, C. Kendall, J. Paradiso, and N. Gershenfeld, Proceeding of the Second IEEE International Conference on Wearable Computing (ISWC 1998) (IEEE Computer Society Press, Los Alamitos, Calif., 1998) p. 132.
  2. S. R. Platt, S. Farritor, K. Garvin, and H. Haider, IEEE-ASME Trans. Mechatron. 10, 455 (2005). https://doi.org/10.1109/TMECH.2005.852482
  3. H. W. Kim, A. Batra, S. Priya, K. Uchino, D. Markley, R. E. Newnham, and H. F. Hofmann, Jpn. J . Appl. Phys. 43, 6178 (2004). https://doi.org/10.1143/JJAP.43.6178
  4. Y. Hirata, H. Okuyama, and S. Ogino, J. Mater. Sci. 43, 117 (2008). https://doi.org/10.1007/s10853-007-2086-8
  5. Y. Hirata, H. Okuyama and S. Ogino, Proc. IEEE MEMS Workshop (IEEE, Amsterdam, Netkedands, 1995) p. 191.