• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.5
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• pp.191-195
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• 2002

Chemical mechanical Polishing (CMP) process is widely used for the global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2$ ($PN_2$) gas, point of use (POU) slurry filler and high spray bar (HSB) were installed. Our experimental results show that DW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STI) structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters, we studied the correlation between CMP thickness of STI using high selectivity slurry, DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased, the N-poly foot is deteriorated, and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by 100 ${\AA}$, 3.2 u${\AA}$ of IDSN is getting better in base 1 condition. In POE 50% condition, 1.7 u${\AA}$ is improved, and 0.7 u${\AA}$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• Journal of Advanced Navigation Technology
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• v.27 no.6
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• pp.849-854
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• 2023

In this paper, a high-efficiency power amplifier was designed by applying the operating point Class J using LDMOS(laterally diffused metal oxide semiconductor) and optimizing the output matching circuit so that the second harmonic impedance becomes the reactance impedance. The designed power amplifier has a frequency of 108 ~ 110 MHz, Characteristics of PAE(power added efficiency) is 71.5% at P_SAT output (54.5 dBm), 55.5% at P_1dB output (51.5 dBm), and 24.38% at 45 dBm. The CSB(carrier with sideband) amplifier, which is the reference signal in the spatial modulation method, has an operating output of 45 dBm ~ 35 dBm, and linear SDM(sum in the depth of modulation) characteristics(40% ± 0.3%) were obtained. We measure the characteristics in amplitude modulation according to the bias operating point of the power amplifier for CSB and propose the optimal operating point to obtain linear modulation characteristics.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.1-91.1
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• 2010

There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

• Journal of Society of Preventive Korean Medicine
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• v.6 no.1
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• pp.117-128
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• 2002

Metal problems in herbal medicine are not regulate properly by law and public management around world country until this time. General people belief as safety about herbal since natural material. And almost all persons can also purchase by their-self and use by self-prescription in reality. As this result herbal medicines can always occur acute and chronic toxicity by not proper use problems, side-effect and overdose. Heavy metal toxic diseases in historical view point was big accidents that didnot forget including minamata and itai-itai in Japan. These accident's teach to us must not use toxic metal level and not include or at least Pb Hg As Cd in all kind material use and intake by people, especially herbal. Herbal contamination research is beginner state that had not many papers until nowadays. Even if this pan had some papers, it had negative result and bigger and larger than problems level because of one way research trend of not many sample case-report and screening test of dried herbal form in chiefly. Many persons have afraid and risk thinking about herbal, animal and minerals since these cause. Further research related this subject will be needed at fact of epidemiology including case-control and cohort study for more precision research affecting in short and long term intake of oriental medicines

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.82-87
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• 2013

In this work, the 1L grade integrated metal DOC/DPF filter that can install in engine manifold position was developed to investigate the effect of platinum-coating amount of filter on the improvement of filter activation temperature and reduction of particulate matter (PM). This filter was installed in 2.9L CI engine which meets the EURO-4 emission regulation. Tests for PM reduction efficiency of filter were conducted under ND-13 mode with full-load test condition. It was revealed that the time to reach the activation temperature of metal filter ($280^{\circ}C$) was shorter as the amount of platinum-coating increased. This short activation time can be helpful for the reduction of CO and HC emissions during cold start condition. At the same time, PM reduced as the coating amount increased. The reduction percentage of $DOC_{40}$, $DOC_{20}$, and $DOC_0$ were 96.7% (2.34 mg/kW'h), 95.1% (3.47 mg/kW'h), and 94.5% (3.69 mg/kW'h) compared to previous result (71.4 mg/kW'h), respectively.

• Journal of the Korean Society of Industry Convergence
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• v.10 no.4
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• pp.213-219
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• 2007

Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.238-243
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• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

• Proceedings of the KSRS Conference
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• 2007.10a
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• pp.397-400
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• 2007

For mapping the distribution of heavy metals in the mining area, field spectroscopy and hyperspectral remote sensing were used in this study. Although heavy metals are spectrally featureless from the visible to the short wave infrared range, possible variations in spectral signal due to heavy metals bound onto minerals can be explained with the metal binding reaction onto the mineral surface. Variations in the spectral absorption shapes of lattice OH and oxygen on the mineral surface due to the combination of heavy metals were surveyed over the range from 420 to 2400 nm. Spectral parameters such as peak ratio and peak area were derived and statistically linked to metal concentration levels in the streambed samples collected from the dry stream channels. The spatial relationships between spectral parameters and concentrations of heavy metals were yielded as well. Based on the observation at a ground level for the relationship between spectral signal and metal concentration levels, the spectral parameters were classified in a hyperspectral image and the spatial distribution patterns of classified pixels were compared with the product of analysis at the ground level. The degree of similarity between ground dataset and image dataset was statistically validated. These techniques are expected to support assessment of dispersion of heavy metal contamination and decision on optimal sampling point.

• Journal of Technologic Dentistry
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• v.38 no.3
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• pp.175-183
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• 2016

Purpose: Observation of Oxide Film Formation and Bonding Strength according to surface treatment of Co-Cr Alloy for porcelain fused to Metal. Methods: metal specimens $0.5mm{\times}25mm{\times}4mm$ in size were made using Co-Cr alloys for porcelain fused to metal crown (Heraenium P, Tae jung Medis). Dental porcelain $0.5mm{\times}25mm{\times}4mm$ in size was sintered on the metal specimens after changing the etching time, sandblasting condition, and heat treatment temperature. Subsequently, the bonding strength was compared by the three-point flexural strength test using a universal testing machine (UTM) to observe the fracture surface and oxidized layers. Results: With regard to the experimental group treated with acid-etching, Specimen 1 treated for 25 minutes (B-3) showed the highest bonding strength, and Specimen 2 treated only with sandblasting showed the most excellent bonding force at 3.5 bar (C-3). With regard to the experimental group treated with sandblasting at 3.5 bar after acid-etching for 25 minutes, Specimen 3 with heat treatment at $980^{\circ}C$ (D-3) showed the highest bonding strength. Conclusion: The specimen which went through both sandblasting and etching, showed an excellent ceramicmetal bond strength.