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http://dx.doi.org/10.4191/kcers.2013.50.3.238

Characteristics of the PbO-Bi2O3-B2O3-ZnO-SiO2 Glass System Doped with Pb Metal Filler  

Choi, Jinsam (Department of Ceramic Engineering, Gyeongsang National University)
Jeong, DaeYong (School of Materials Engineering, Inha University)
Shin, Dong Woo (Department of Ceramic Engineering, Gyeongsang National University)
Bae, Won Tae (Department of Ceramic Engineering, Gyeongsang National University)
Publication Information
Journal of the Korean Ceramic Society / v.50, no.3, 2013 , pp. 238-243 More about this Journal
Abstract
We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.
Keywords
Lead glass; Pb filler; Hybrid paste; Flip chip; Bonding;
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Times Cited By KSCI : 1  (Citation Analysis)
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