• Journal of the Korean Electrochemical Society
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• v.15 no.3
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• pp.135-148
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• 2012

Ionic liquids are steadily attracting interests throughout a recent decade and their application is expanding into various fields including electrochemistry due to their unique properties such as non-volatility, inflammability, low toxicity, good ionic conductivity, wide electrochemical potential window and so on. These features make ionic liquids become an alternative solution for electrodeposition of metals that cannot be electroplated in aqueous electrolytes. In this review, we classify investigated metals into three categories, which are light (Li, Mg), refractory (Ti, Ta) and noble (Pd, Pt, Au) metals, rather than covering the exhaustive list of metals and try to update the recent development in this area. In electrodeposition of light metals, granular fine Li particles were successfully obtained while the passivation of electrodeposited Mg layers is an obstacle to reversible deposition-dissolution process of Mg. In the case of refractory metals, the quality of Ta and Ti deposit particles was effectively improved with addition of LiF and pyrrole, respectively. In noble metal category, EMIM TFSA ionic liquid as an electrolyte for Au electrodeposition was proven to be effective and BMP TFSA ionic liquid developed a smooth Pd deposit. Pt nanoparticle production from ionic liquid droplet in aqueous solution can be cost-effective and display an excellent electrocatalytic activity.

• Journal of the Korean institute of surface engineering
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• v.43 no.5
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• pp.243-247
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• 2010

The micro Vickers hardness and internal stress of Ni-Fe metal thin film synthesized by electrodeposition method at $25^{\circ}C$ were studied as a function of bath composition, and surface microstructure and atomic compositions of thin films were investigated by SEM and EDS. And the shape change of $200\;{\AA}$ Ni-Fe nanowires made using anodic aluminum oxide(AAO) templates by electrodeposition method were observed by SEM as a function of ultrasonic treatment time and bath composition. The Fe deposition contents on the substrate non-linearly increased with Fe ion concentration over total metal ion concentration. In case of low Fe contents film, the grain size is smaller and denser than high Fe contents deposited films, and the micro Vickers hardness increased with Fe contents of electrodeposited films. These results affected the shape change of nanowire after ultrasonic treatments.

• Korean Chemical Engineering Research
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• v.47 no.2
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• pp.141-149
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• 2009

The Cu thin film material and process, which have been already used for metallization of CMOS(Complementary Metal Oxide Semiconductor), has been highlighted as the Cu metallization is introduced to the metallization process for giga - level memory devices. The recent progresses in the development of key elements in electrochemical processes like surface pretreatment or electrolyte composition are summarized in the paper, because the semiconductor metallization by electrochemical processes such as electrodeposition and electroless deposition controls the thickness of Cu film in a few nm scales. The technologies in electrodeposition and electroless deposition are described in the viewpoint of process compatibility between copper electrodeposition and damascene process, because a Cu metal line is fabricated from the Cu thin film. Silver metallization, which may be expected to be the next generation metallization material due to its lowest resistivity, is also introduced with its electrochemical fabrication methods.

• Journal of the Korean Electrochemical Society
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• v.4 no.2
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• pp.41-46
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• 2001

The effect of organic additives such as PEG ind MPS on throwing power have been studied in the fabrication of porous reticular metal by electrodeposition using the mixture of cupric sulfate and sulfuric acid as electrolyte. Both the polarization test and the electrodeposition on the stacked electrodes, mean pore diameter of which was $250{\mu}m$, were performed to illustrate the behavior of throwing power quantitatively. As far as PEG was concerned, it lowered throwing power of electrodeposition on the porous electrode used in this work while the addition of MPS up to 500 ppm in electrolyte enhanced throwing power monotonously. When both MPS and PEG were added in electrolyte, the effect of MPS on throwing power was superior to that of PEG. However, the excess addition of MPS was found to cause the defect in mechanical strength of deposit layer. From the result of SEM observation, it could be concluded that less than 50 ppm of MPS in electrolyte was appropriate to avoid the breakage of deposit layer.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.152-157
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• 2021

The pseudocapacitor has a high energy density characteristic because it accumulates charges through a paradic redox reaction. However, due to its strong insulation properties, metal hydroxides should be designed as structural systems optimized for charge transfer to support fast electron transport. Also, Nickel material is weak to heat and is easily deformed when used as a cathode material, so stability must be secured. In this study, nickel hydroxide was produced by electrodeposition to secure the stability of nickel. Electrodeposition is a synthetic method suitable for growing optimized nickel hydroxide because it allows fine control. Nickel hydroxide (Ni(OH)₂) is a metal hydroxide used as a pseudocapacitor anode due to its high capacitance, electrical conductivity and resistance. Therefore, in order to determine how Ni(OH)₂ nanosheets are formed and what are the optimization conditions, various measurement methods were used to focus on structural growth of nanosheets produced by electrodeposition.

• Journal of the Korean institute of surface engineering
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• v.34 no.6
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• pp.553-567
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• 2001

Electrodeposition technology is widely used in industry for various kinds of coatings. Modifications in this technology led to several processes to meet various requirements. Electrolysis in ionic liquids has many advantages such as low energy consumption of energy, low pollutant emission and low operating costs. Although ionic liquids have already been used in liquid/liquid extraction processes, only recently their use in electrodeposition was exploited. Electrochemical deposition of composites is an expanding area. Coupled with the progress in the synthesis of nanometric powder, this research will open a large number of innovative materials. Pulse current plating is another electrodeposition technique which yields improved coatings. Although electrodeposition is now regarded as an environmental non-friendly process, it is economically viable and has many inherent advantages. For certain applications, alternatives to electrodeposition have not yet been fully implemented. Hence, continued research in this technology is warranted. This article reviews some recent advances in electrodeposition technology. Aspects of electrodeposition such as electrolysis in ionic liquids, electrodeposition of composites, pulse current plating techniques, metal and alloy deposition, compound deposition and effects of additives are discussed in this review.

• Korean Chemical Engineering Research
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• v.52 no.1
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• pp.26-39
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• 2014

Cu interconnection in electronic devices is fabricated via damascene process including Cu electrodeposition. In this review, Cu electrodeposition and superfilling for fabricating Cu interconnection are introduced. Superfilling results from the influences of organic additives in the electrolyte for Cu electrodeposition, and this is enabled by the local enhancement of Cu electrodeposition at the bottom of filling feature formed on the wafer through manipulating the surface coverage of organic additives. The dimension of metal interconnection has been constantly reduced to increase the integrity of electronic devices, and the width of interconnection reaches the range of few tens of nanometer. This size reduction raises the issues, which are the deterioration of electrical property and the reliability of Cu interconnection, and the difficulty of Cu superfilling. The various researches on the development of organic additives for the modification of Cu microstructure, the application of pulse and pulse-reverse electrodeposition, Cu-based alloy superfilling for improvement of reliability, and the enhancement of superfilling phenomenon to overcome the current problems are addressed in this review.

• Journal of the Korean Electrochemical Society
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• v.3 no.3
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• pp.152-156
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• 2000

The effect of cupric ion concentration on the throwing power has been studied in the electrodeposition of Cu on the porous reticular electrodes with the electrolytes of $CuSO_4\;and\;H_2SO_4$. Sulfuric acid electrolytes with lower concentration of $CuSO_4$ improved throwing power in electrodeposition of copper not only due to higher cathodic polarizability but also due to higher conductivity of the electrolytes. The increase in conductivity of the electrolytes at low concentration of $CuSO_4$ could be also illustrated by the decrease in viscosity of the electrolytes. It was found that both the throwing power and the limiting current density should be taken into account in the electrodeposition of Cu on the reticular electrodes. According to the experimental results, the electrolyte of 0.2M $CuSO_4$ and 0.5M $H_2SO_4$ was found to be the most appropriate condition at the current density of $10mA/cm^2$.

• Journal of the Korean institute of surface engineering
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• v.27 no.1
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• pp.45-53
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• 1994

A kinetic study on the electrodeposition of zinc-iron alloys onto a steel in chloride solutions has been car-ried out using a rotating disc geometry. The results show that the deposition rate was increased with electropotential, disc rotation speed and temperature, and consequently the rate was partly controlled by elec-trochemical reaction and partly by mass transport. The iron content of deposit was more increased with cell voltage than with disc rotating speed and temperature. During electrodeposition process, the addition of metal-lic zinc powder retards oxidation rate of $Fe^{2+}$.

• Journal of Electrochemical Science and Technology
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• v.3 no.1
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• pp.1-13
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• 2012

Many researchers focus on indium contained semiconductors and alloy compounds for their various applications. Electrochemists want to obtain indium contained compounds simply via one-step electrodeposition. First of all, electrochemistry of constituent elements must be understood in order to develop the best condition for the electrodeposition of indium contained compounds. We will review the electrochemistry of indium. Equilibria between indium metal and indium ions and the standard electrode potentials of the equilibria will be reviewed. The electrochemical reactions of indium species are affected by surrounding conditions. Thus dependences of electrochemical behaviors of indium metal and indium ions on various parameters will be reviewed.