• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.463-467
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• 2008

Aluminum nitride (AlN) thin films have been deposited on Au electrodes by using reactive RF magnetron sputtering method in a gas mixture of Ar and $N_2$ at different substrate temperature. It was found that substrate temperature was varied in the range up to $400^{\circ}C$, highly c-axis oriented film can be obtained at $300^{\circ}C$ with full width at half maximum (FWHM) $3.1^{\circ}$. Increase in surface roughness from 3.8 nm to 5.9 nm found to be associated with increase in grain size, with substrate temperature; however, the AlN film fabricated at $400^{\circ}C$ exhibited a granular type of structure with non-uniform grains. The Al 2p and N 1s peak in the X-ray photoelectron spectroscopy (XPS) spectrum confirmed the formation of Al-N bonds. The XPS spectrum also indicated the presence of oxynitrides and oxides, resulting from the presence of residual oxygen in the vacuum chamber. It is concluded that the AlN film deposited at substrate temperature of $300^{\circ}C$ exhibited the most desirable properties for the application of high-frequency surface acoustic devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.458-462
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• 2008

In this paper, we investigated the (002) preferred orientation and morphology characteristics of AlN thin film by using reactive rf sputtering. Additionally, AlN thin films grown in the range from 150 to 300 W were studied under room temperature without substrate heating and post annealing. Sputtered AlN thin films were well grown on Si substrates and the (002) main peak in XRD patterns showed the highest intensity at 300 W with $0.25^{\circ}$ degree of full width at half-maximum (FWHM). As increased RF power, the surface roughness was increased from 1.0 to 3.4 nm. In Fourier transformation infrared spectroscopy (FTIR), $A_1$ (TO) and $E_1$ (TO) mode closed to AlN thin film confirmed the changes with increasing the intensity rate. From these results, we could confirm a chance of the growth of AlN thin film by only low temperature.

• Transactions on Electrical and Electronic Materials
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• v.15 no.1
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• pp.32-36
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• 2014

In this study, the etching characteristics of titanium dioxide ($TiO_2$) thin films were investigated with the addition of $N_2$ to CF4/Ar plasma. The crystal structure of the $TiO_2$ was amorphous. A maximum etch rate of 111.7 nm/min and selectivity of 0.37 were obtained in an $N_2/CF_4/Ar$ (= 6:16:4 sccm) gas mixture. The RF power was maintained at 700 W, the DC-bias voltage was - 150 V, and the process pressure was 2 Pa. In addition, the etch rate was measured as functions of the etching parameters, such as the gas mixture, RF power, DC-bias voltage, and process pressure. We used X-ray photoelectron spectroscopy to investigate the chemical state on the surface of the etched $TiO_2$ thin films. To determine the re-deposition and reorganization of residues on the surface, atomic force microscopy was used to examine the surface morphology and roughness of $TiO_2$ thin films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.45-48
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• 2000

High dielectric (Ba,Sr)TiO$_3$ thin films were etched in an inductively coupled plasma (ICP) as a function of C1$_2$/Ar gas mixing ratio. Under Cl$_2$(20)/Ar(80), the maximum etch rate of the BST films was 400$\AA$/min and selectivities of BST to Pt and PR were obtained 0.4 and 0.2, respectively. We investigated the etched surface of BST by x-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and x-ray diffraction (XRD). From the result of XPS analysis, we found that residues of Ba-Cl and Ti-Cl bonds remained on the surface of the etched BST for high boiling point. The surface roughness decreased as Cl$_2$ increases in Cl$_2$/Ar plasma because of non-volatile etching products. This changed the nature of the crystallinity of BST. From the result of XRD analysis, the crystalliility of etched BST film maintained as similar to as-deposited BST under Ar only and Cl$_2$(20)/Ar(80). However, (100) orientation intensity of etched BST film abruptly decreased at Cl$_2$ only plasma. It was caused that Cl compounds were redeposited on the etched BST surface and damaged to crystallinity of BST film during the etch process.

• 한국방재학회:학술대회논문집
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• 2008.02a
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• pp.85-88
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• 2008

Damage from typhoon disaster can be mitigated by grasping and dealing with the damage promptly for the regions in typhoon track. What is this work, a technique to analyzed dangerousness of typhoon should be presupposed. This study estimated 10m level wind speed using 700hPa wind by typhoon, referring to GPS dropwindsonde study of Franklin(2003). For 700hPa wind, 30km resolution data of Regional Data Assimilation Prediction System(RDAPS) were used. For roughness length in estimating wind of 10m level, landuse data of USGS are employed. For 10m level wind speed of Typhoon Rusa in 2002, we sampled AWS point of $7.4\sim30km$ distant from typhoon center and compare them with observational data. The results show that the 10m level wind speed is the estimation of maximum wind speed which can appear in surface by typhoon and it cannot be compared with general hourly observational data. Wind load on domestic buildings relies on probability distributions of extreme wind speed. Hence, calculated 10m level wind speed is useful for estimating the damage structure from typhoon.

• Design & Manufacturing
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• v.10 no.2
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.125-134
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• 2001

($Ti_{1-x}$ $Cr_{x}$ )N coatings were deposited by an ion-plating method in a reactor with two separate metal sources, Ti and Cr. Ti was evaporated using an electron beam, while Cr evaporation was carried out by resistant heating. The Ti and Cr concentrations in the coatings were controlled by the Ti and Cr evaporation ratio. The coating hardness increased with increasing the Cr content(x) and showed a maximum value of 6,000 HK at around x=0.8. The critical load of the coatings, measured by the scratch test, was around 30 N. The wear resistance properties of the ($Ti_{1-x}$$Cr_{ x}$)N coatings were evaluated using a CSEM pin-on-disk type tribometer. A Cr-steel ball as well as a SiC ball, which had hardness values of 590 HK and 2,600 HK respectively, were used as the pin. After the wear test, the surface morphology, roughness and the concentration of the coatings were investigated, with the main focus being on the effect of wear debris and the transferred layer on the wear behavior.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.90-93
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• 2013

Al:ZnO thin films were deposited using the radio frequency magnetron sputtering technique at various temperatures and sputtering powers. With the increase in the deposition temperature and the decrease in the radio frequency sputtering power, the crystallinity was increased and the surface roughness was decreased, which lead to the decrease in the electrical resistivity of the film. It is also clearly observed that, the intensity of the (002) XRD peak increases with increasing the substrate temperature [1,2]. The electrical resistivity and optical transmittance of the Al:ZnO thin film were analyzed as a function of the post-annealing temperature. It can be seen that with the annealing temperature set at $400^{\circ}C$, the resistivity decreases to a minimum value of $4.1{\times}10^{-3}{\Omega}cm$ and the transmittance increases to a maximum value of 85% of the Al:ZnO thin film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.11
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• pp.1192-1198
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• 2004

Hole transporting polymer(poly［N-(p-diphenylamine)phenylmethacrylamide］, PDPMA) was doped with nile red dye at various concentrations to study the influence of doping on the energy transfer during light emitting processes. Organic LEDs composed of ITO/blend(PDPMA -nile red)/ Alq$_3$/Al as well as thin films of blend(PDPMA -nile red)/ Alq$_3$ were manufactured for investigating photoluminescence, electroluminescence, and current-voltage characteristics. Atomic Force Microscopy was also used to observe surface morphology of the blend films. It was found that such doping. significantly influences the efficiency of the energy transfer from the Alq$_3$ layer to blended layer and the optical/electrical properties could be optimized by choosing the right concentration of the dye molecule. The results also showed a interesting correlation with the morphological aspect, i.e. the optimum luminescence at the concentration with the least surface roughness. When the concentration of nile red was 0.8 wt%, the maximum energy transfer could be achieved.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.604-607
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• 2005

Dependence of the crystallinity, surface roughness, carrier concentration, carrier mobility, electrical resistivity and transmittance of Al-doped ZnO films deposited on glass substrates by RF-magnetron sputtering on effects of the ratio of the RF power for AlZnO to that for ZnO (R) have been investigated. X-ray diffraction spectra show strong preferred orientation along the c-axis. The full width at half maximum (FWHM) of the ZnO (002) peak decreases slightly as R increases in the range of R<1.0, whereas it increases substantially in the range of R>1.0. Scanning electron micrographs (SEM) show that the ZnO film surface becomes coarse as R increases. The carrier concentration and the carrier mobility in the ZnO thin film are maximal for R=1.5 and 1.0, respectively. The electrical resistivity is minimal for R=1.0 The transmittance of the ZnO:Al film tends to increase, but to decrease slightly in the range of R>0.5. It may be concluded that the optimum R value is 1.0, considering all these analysis results. The cause of the changes in the structure and physical properties of ZnO thin films with R are also discussed.