• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1902-1907
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• 2008

The current work presents a design and fabrication technique for a microchannel system to measure the local temperature distribution inside microchannel. This micro channel system fabricated by MEMS technique is integrated with a heater and an array of temperature sensors so that detailed heat transfer phenomena inside micro-scale channel can be studied. Materials widely used in semiconductor process were selected to fabricate a heater and temperature sensors on a silicon wafer. On these heater and sensors a channel wall was fabricated with SU-8. The friction constant and the local Nusselt number distribution measured for the deionized water flow in the microchannel is presented.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1297-1305
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• 2004

Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.448-452
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• 2007

Many industrial operations require continuous or nearly-continuous operation of machines, which if interrupted can result in significant financial loss. The condition monitoring of these machines has received considerable attention recent years. Rapid developments in semiconductor, computing, and communication with a remote site have led to a new generation of sensor called "smart" sensors which are capable of wireless communication with a remote site. The purpose of this research is the development of smart sensor using which can on-line perform condition monitoring. This system is addressed to detect conditions that may lead to equipment failure when it is running. Moreover it will reduce condition monitoring expense using low cost MEMS accelerometer. This sensor can receive data in real-time or periodic time from MEMS accelerometer. Furthermore, this system is capable for signal preprocessing task (High Pass Filter, Low Pass Filter and Gain Amplifier) and analog to digital converter (A/D) which is controlled by CPU. A/D converter that converts 10bit digital data is used. This sensor communicates with a remote site PC using TCP/IP protocols. Wireless LAN contain IEEE 802.11i-PSK or WPA (PSK, TKIP) encryption. Developed sensor executes performance tests for data acquisition accuracy estimations.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.8
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• pp.63-70
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• 2006

Due to the small size and weight of micro aerial vehicle (MAV), only miniaturized MEMS type sensors are applicable for MAV autonomous flight system. In this paper, we propose a accelerometer and gyro mixing algorithm to improve an attitude performance of MEMS type sensors. The performance of the proposed mixing algorithm is compared with the performance of fuzzy-based mixing algorithm through simulation. The simulation results show that the attitude compensation method through the attitude compensation has better performance than the fuzzy-based mixing method for MAV attitude estimation.

• Journal of Korean Association for Spatial Structures
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• v.18 no.4
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• pp.49-59
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• 2018

Wireless sensors are more favorable in measuring structural response compared to conventional sensors. This is because they are easier to use with no issues with cables and are considerably cheaper. There are several applications that can be used in recording and analyzing data from MEMS sensor installed on an iPhone. The Vibration App is one of the applications used and there has not been adequate research conducted in analyzing the performance of this App. This paper analyzed the performance of the Vibration App by comparing it with the performance of an ICP sensor. Results show that natural frequency results are more accurate (error less than 5%) in comparison to the amplitude results. This means that built- in MEMS sensor in smartphones are good at estimating natural frequency of structures. In addition, it was seen that the results became more accurate at higher frequencies (5.0Hz and 10.0Hz).

• Journal of the Computational Structural Engineering Institute of Korea
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• v.26 no.4
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• pp.271-274
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• 2013

Inclinometer sensors are widely applied in many fields. Especially in the field of construction of high-rise buildings also measure the horizontal and vertical help has been applied to monitor. Recent micro electro-mechanical system(MEMS) technology with the development of the many sensors have been developed. In this paper, a MEMS inclinometer is based on a MEMS accelerometer. The sensor can measure the angle of inclination using the relationship between static acceleration and gravity acceleration from an accelerometer. From this principle, inclinometer has been developed that has more accurate. The accuracy is proved by the experiment with laser displacement. Results in the experiment express high-accuracy, stability and economics of MEMS inclinometer. In conclusion, wireless MEMS inclinometer sensor is expected to be applicable in the areas of construction and many other industries with accurate and convenient monitoring system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.317-322
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• 2010

This paper reports the fabrication and characterization of surface micromachined poly 3C-SiC capacitive pressure sensors on silicon wafer operable in touch mode and normal mode for high temperature applications. FEM(finite elements method) simulation has been performed to verify the analytical mode. The sensing capacitor of the capacitive pressure sensor is composed of the upper metal and the poly 3C-SiC layer. Measurements have been performed in a temperature range from $25^{\circ}C$ to $500^{\circ}C$. Fabrication process of designed poly 3C-SiC touch mode capacitive pressure sensor was optimized and would be applicable to capacitive pressure sensors that are required high precision and sensitivity at high pressure and temperature.

• Journal of Sensor Science and Technology
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• v.20 no.1
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• pp.40-45
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• 2011

Microcantilevers have been actively used in probe-based microscopy and gravimetric sensing for biological or chemical analytes. To integrate actuation or detection schemes in the structure, typical fabrication processes include several photolithographic steps along with conventional MEMS fabrication. In this paper, a simple and straightforward way to fabricate and operate silicon microcantilever mass sensors is presented. The fabricated microcantilever sensors which can be electrostatically actuated require only two photolithographic steps. Resonant characteristics of fabricated microcantilevers are measured with a custom optical-lever and results show size-dependent quality factors. Using a $40\;{\mu}m$ long, $7\;{\mu}m$ wide, and $3\;{\mu}m$ thick cantilever, we achieved subfemtogram mass resolution in a 1 Hz bandwidth.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.31 no.3
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• pp.411-422
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• 2021

The autonomous driving system mounted on the unmanned vehicle recognizes the external environment through several sensors and derives the optimum control value through it. Recently, studies on physical level attacks that maliciously manipulate sensor data by performing signal-injection attacks have been published. signal-injection attacks are performed at the physical level and are difficult to detect at the software level because the sensor measures erroneous data by applying physical manipulations to the surrounding environment. In order to detect a signal-injection attack, it is necessary to verify the dependability of the data measured by the sensor. As so far, various methods have been proposed to attempt physical level attacks against sensors mounted on autonomous driving systems. However, it is still insufficient that methods for defending and detecting the physical level attacks. In this paper, we demonstrate signal-injection attacks targeting MEMS sensors that are widely used in unmanned vehicles, and propose a method to detect the attack. We present a signal-injection detection model to analyze the accuracy of the proposed method, and verify its effectiveness in a laboratory environment.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.592-595
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• 2004

This paper presents a study on the development of a multi-sensing inertial sensor with a single mechanical structure, which can be used both as a gyroscope and an accelerometer. The proposed MEMS gyro-accelerometer is designed to detect the angular rate and the acceleration at the same time using two separate detection circuits for one proof mass. In this study, the detection and signal processing circuit for an effective signal processing of different inertial measurements is designed, fabricated, and tested. The experimental results show that the performances of the gyro-accelerometer have resolutions of 1mg and 0.025deg/sec and nonlinearities of less than 0.5% for the accelerometer and the gyroscope, respectively, which are similar results with those of sensors with different structures and different detection circuits. The size of the sensor is reduced almost by 50% comparing with the sensors of separated proof mass.