• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.18 no.4
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• pp.458-464
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• 2008

The structural health monitoring has been gaining more importance in civil engineering areas such as earthquake and wind engineering. The use of health monitoring system can also provide tools for the validation of structural analytical model. However, only few structures such as historical buildings and some important long bridges have been instrumented with structural monitoring system due to high cost of installation, long and complicated installation of system wires. In this paper, the structural monitoring system based on cheap and wireless monitoring system is investigated. The use of advanced technology of micro-electro-mechanical system(MEMS) and wireless communication can reduce system cost and simplify the installation. Further the application of wireless MEMS system can provide enhanced system functionality and due to low noise densities. Identification results are compared to ones using data measured from traditional accelerometers and results indicate that the system identification using wireless MEMS system estimates system parameters accurately.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.282-285
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• 2009

Ignition Safe-Arm-Unit using micro-electromechanical systems(MEMS) for propulsion system was designed and manufactured. MEMS was designed according to the design schemes for conventional mechanical elements. By comparing the design results and the test data of the prototype, small discrepancy was found, which is due to the nonlinear characteristic of the structure and the machining accuracy. The applicability of MEMS for Safe-Arm-Unit was proved by testing MEMS which is assembled into SAU.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.177-182
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• 2007

This paper presents the see-saw type RF MEMS switch based on a single crystalline silicon structure with narrow gap vertical comb. Low actuation voltage and high isolation are key features to be solved in electrostatic RF MEMS switch design. Since these parameters in conventional parallel plate RF MEMS switch designs are in trade-off relationship, both requirements cannot be met simultaneously. In the vertical comb design, however, the actuation voltage is independent of the vertical separation distance between the contact electrodes. Therefore, the large separation gap between contact electrodes is implemented to achieve high isolation. We have designed and fabricated RF MEMS switch which has 46dB isolation at 5GHz, 0.9dB insertion loss at 5GHz and 40V actuation voltage.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.602-606
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• 2005

A systematic procedure of probability analysis for general distributions is developed based on the first four moments estimated from polynomial interpolation of the system response function and the Pearson system. The function approximation is based on a specially selected experimental region for accuracy and the number of function evaluations is taken equal to that of the unknown coefficient for efficiency. For this purpose, three error-minimizing conditions are proposed and corresponding canonical experimental regions are formed for popular probability. This approach is applied to study the stochastic properties of the performance functions of a MEMS structure, which has quite large fabrication errors compared to other structures. Especially, the vibratory micro-gyroscope is studied using the statistical moments and probability density function (PDF) of the performance function to be the difference between resonant frequencies corresponding to sensing and driving mode. The results show that it is very sensitive to the fabrication errors and that the types of PDF of each variable also affect the stochastic properties of the performance function although they have same the mean and variance.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.9 s.186
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• pp.179-189
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• 2006

Recently the electrostatic 2-axis MEMS stages have been fabricated f3r the purpose of an application to PSD (Probe-based Storage Device). However, all of the components (platform, comb electrodes, springs, anchors, etc.) in those stages are placed in-plane so that they have low areal efficiencies such as a few percentage, which is undesirable as data storage devices. In this paper, we present a novel structure of an electrostatic 2-axis MEMS stage that is characterized by having a large areal efficiency of about 25%. For obtaining large area efficiency, the actuator part consisting of mainly comb electrodes and springs is placed right below the platform. The structure and operational principle of the MEMS stage are described, followed by a design and analysis, the fabrication and measurement results. Experimental results show that the driving ranges of the fabricated stage along the x and y axis were 27$\mu$m, 38$\mu$m at the supplied voltages of 65V, 70V, respectively and the natural frequencies along x and y axis were 180Hz, 310Hz, respectively. The total size of the stage is about 5.9$\times$6.8mm$^2$ and the platform size is about 2.7$\times$3.6mm$^2$.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.147-150
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• 2005

Low actuation voltage and no contact stiction are the important factors to apply MEMS RF switches to mobile devices. Conventional electrostatic MEMS RF switches require several tens of voltages for actuation. In this paper we propose PAS MEMS RF switch which adopt PZT actuators and seesaw cantilevers to meet the above requirements. The fundamental structures of PAS MEMS switch were designed, optimized, and fabricated. Through the developed processes PAS SPDT MEMS RF switches were successfully fabricated on 4" wafers and they showed good electrical properties. The driving voltage was less than 5 volts. And the insertion loss was -0.5dB and the isolation was 35dB at 5GHz. The switching speed was about 5kHz. So these MEMS RF switches can be applicable to mobile communication devices or wireless multi-media devices at lower than 6GHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.481-482
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• 2006

Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.