Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2003.11a
- /
- Pages.1407-1412
- /
- 2003
Deformation Behavior of MEMS Gyroscope Package Subjected to Temparature Change
온도변화에 따른 MEMS 자이로스코프 패키지의 변형측정
- Published : 2003.11.05
Abstract
In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity
Keywords