Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2006.05a
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- Pages.481-482
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- 2006
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- 2005-8446(pISSN)
A study on the application of MEMS CMP with Micro-structure pad
마이크로 구조를 가진 패드를 이용한 MEMS CMP 적용에 관한 연구
- Park Sung-Min (Mechanical and Precision Eng. Dept. PNU) ;
- Jeong Suk-Hoon (Mechanical and Precision Eng. Dept. PNU) ;
- Jeong Moon-Ki (Mechanical and Precision Eng. Dept. PNU) ;
- Park Boum-Young (Mechanical and Precision Eng. Dept. PNU) ;
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Jeong Hea-Do
(Mechanical and Precision Eng. Dept. PNU)
- 박성민 (부산대 대학원 정밀기계공학과) ;
- 정석훈 (부산대 대학원 정밀기계공학과) ;
- 정문기 (부산대 대학원 정밀기계공학과) ;
- 박범영 (부산대 대학원 정밀기계공학과) ;
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정해도
(부산대 대학원 정밀기계공학과)
- Published : 2006.05.01
Abstract
Chemical-mechanical polishing, the dominant technology for LSI planarization, is trending to play an important function in micro-electro mechanical systems (MEMS). However, MEMS CMP process has a couple of different characteristics in comparison to LSI device CMP since the feature size of MEMS is bigger than that of LSI devices. Preliminary CMP tests are performed to understand material removal rate (MRR) with blanket wafer under a couple of polishing pressure and velocity. Based on the blanket CMP data, this paper focuses on the consumable approach to enhance MEMS CMP by the adjustment of slurry and pad. As a mechanical tool, newly developed microstructured (MS) pad is applied to compare with conventional pad (IC 1400-k Nitta-Haas), which is fabricated by micro melding method of polyurethane. To understand the CMP characteristics in real time, in-situ friction force monitoring system was used. Finally, the topography change of poly-si MEMS structures is compared according to the pattern density, size and shape as polishing time goes on.