• The Journal of the Korea institute of electronic communication sciences
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• v.12 no.2
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• pp.315-324
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• 2017

The smart grid with distributed power supply introduces a number of problems including not only the problems of the existing power grid but also the problem of protection co-operation due to new electric phenomenon because it has a mixed operation structure combining the existing radial operation structure and the new loop operation structure. The EMTP based power system analysis method has flexibility and convenience from the view of system configuration but it requires another experimental verification because of uncertainty of design and analysis results. On the other hand, the real demonstration system has difficulties in observing accurate fault on large scale system due to considerable economical and spatial construction cost, system configuration constraint, and it is difficult to demonstrate the distributed, autonomous and adaptive control strategy of smart grid. In this paper, a basic theory for a micro smart grid simulator design using MEMS(Micro Electro-Mechanical Systems) miniaturization technology is studied which can safely and freely experiment and observe electrical phenomena, and distribution, autonomous adaptive control strategy for disturbances on 22.9kV smart grid under minimum economic and spatial cost.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.9-12
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• 2006

We have designed and fabricated micro power generators by electroplating which is important in MEMS(micro electro mechanical system) technique. We have electroplated MEMS coils on the glass substrates and have chosen one of these coils for experiments. The thickness, width, and length of the coil are $7{\mu}m,\;20{\mu}m$, and 1.6 m, respectively. We have analyzed the structure of MEMS coil by SEM. We have made a vibrating system for reproducible results in measurement. With reciprocating a magnet on the surface of a fabricated winding coil, the micro power generator produce an alternating voltage. We have changed the vibrational frequency from 0.5 Hz to 8 Hz. The generated voltage was 106 mV at 3 Hz and 198 mV at 6 Hz. We aim at the micro power generator which can change vibration energy to useful electric energy.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Journal of the Korea institute for structural maintenance and inspection
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• v.9 no.4
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• pp.227-234
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• 2005

In this paper, a smart wireless MEMS-based accelerometer(MA) system has been designed and experimented for smart monitoring system of civil structures. Various performance and experimental tests have been carried out to evaluate whether this system is suitable for monitoring system of civil structures. First, we examined its sensitivity, resolution, and noise, specifically to evaluate the performance of the smart wireless MA system. The results of experiments enabled us to estimate performance of the MA in SWMAS in comparison to the value of data sheet from MA. Second, characteristics of model structure were analyzed by the ambient vibration test based on the NExT combined with ERA. Finally, this analysis was compared to the one that was made by FE results, and the comparison proved that a smart wireless MA system was fitted in smart monitoring system effectively.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.78-88
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• 2017

Cantilever beam MEMS piezoelectric accelerometers are the simplest and most widely used accelerometer structure. This paper discusses the design of a piezoelectric accelerometer exclusively for SHM applications. While such accelerometers need to operate at a lower frequency range, they also need to possess high sensitivity and low noise floor. The availability of a simple model for deflection, charge, and voltage sensitivities will make the accelerometer design procedure less cumbersome. However, a review of the open literature suggests that such a model has not yet been proposed. In addition, previous works either depended on FEM analysis or only reported on the fabrication and characterization of piezoelectric accelerometers. Hence, this paper presents, for the first time, a simple analytical model developed for the deflection, induced voltage, and charge sensitivity of a cantilever beam piezoelectric accelerometer.The model is then verified using FEM analysis for a range of different cases. Further, the model was validated by comparing the induced voltages of an accelerometer estimated using this model with experimental voltages measured in the accelerometer after fabrication. Subsequently, the design of an accelerometer is demonstrated for SHM applications using the analytical model developed in this work. The designed accelerometer has 60 mV/g voltage sensitivity and 2.4 pC/g charge sensitivity, which are relatively high values compared to those of the piezoresistive and capacitive accelerometers for SHM applications reported earlier.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1931-1942
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• 2002

In this paper a formulation of robust optimization is presented and illustrated by a design example of vibratory micro gyroscopes in order to reduce the effect of variations due to uncertainties in MEMS fabrication processes. For the vibratory micro gyroscope considered it is important to match the resonance frequencies of the vertical (sensing) and lateral (driving) modes as close as possible to attain a high sensing sensitivity. A deterministic optimization in which the difference of both the sensing and driving natural frequencies is minimized as an objective function results in highly enhanced performance but apt to be very sensitive to fabrication errors. The formulation proposed is to attain robustness of the performance by including the sensitivity of the response with respect to uncertain variables as a term of objective function to be minimized. This formulation is simple and practically applicable since no detail statistical information on fabrication errors is required. The geometric variables, beam width, length and thickness of vibratory micro gyroscopes are adopted as design variables and at the same time considered as uncertain variables because here occur the fabrication errors. A robustness test in terms of a percentage yield by using the Monte Carlo simulation has shown that the robust optimum produces twice more acceptable designs than the deterministic optimum. Improvement of robustness becomes bigger as the amount of fabrication errors is assumed larger. Considering that the magnitude of fabrication errors and uncertainties in a MEMS structure are comparatively large, the present method is illustrated to be a viable approach for a robust MEMS design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.193-197
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• 2003

As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1255-1260
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• 2003

In order to reduce driving power consumption, we propose and fabricate a new structure of asymmetric SOI 1${\times}$2 thermo-optic switch that has a back side silicon trenched structure. Compared to conventional SOI thermo optic switches without heat sink structure, it shows an improvement of switching power reduction from about 4 watt to 1.8 watt without sacrificing cross talk of about 20 ㏈ at the light wavelength of 1.55 $\mu\textrm{m}$. Here we also described the main design consideration and fabrication procedure for the proposed device.

• Tribology and Lubricants
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• v.18 no.4
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• pp.249-254
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• 2002

Adhesive contact characteristics of torus-shaped bumps were analyzed using the finite element technique considering the adhesive force. Analyses focused on the effect of rim and bump radii on the adhesive contact behavior such as the jump-to-contact behavior, adhesion hysteresis, pull-off forces, contact region and pressure, and surface and subsurface stresses. Analysis results in the absence of adhesive force were also included to examine the effect of adhesive force. The applicability of torus-shaped bumps to the MEMS structure for reduction of friction is discussed.