• 대한금속재료학회지
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• 제49권5호
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• pp.395-399
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• 2011

In this study, micro gas sensors for ammonia gas were prepared by adopting MEMS technology and using a sol-gel process. Three types of sensors were prepared via different synthesis routes starting with W sol and Ru sol mixture. This mixture was deposited on a MEMS platform and the platform was subsegueny heated to a temperature of $350^{\circ}C$. The topography and crystal structure of the sensing film were studied using FE-SEM and XRD. The response of the gas sensor to $NH_3$ gas was examined at various operating temperatures and gas concentrations. The sensor response increased almost linearly with gas concentration and the best sensing response was obtained at $333^{\circ}C$ for 5.0 ppm $NH_3$ for the specimen prepared by coating $WO_3$ powders with the Ru sol mixture.

• 한국기계가공학회지
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• 제5권1호
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• pp.45-50
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• 2006

This paper shows a new precision actuator of MUTM(miniature universal testing machine) for the testing of compression and tensile load on the MEMS materials and structures. The MUTM consists of a sample holder, an ultraprecision precision actuator(tranlation stage) and load sensor. The precision actuator has been developed for generating displacements with nanometer accuracy and a dynamic range of 1mm simultaneously. In this paper, it can be made by using the displacement property of bi-morph type PZT, which is able to extend the long range(stroke) according to cantilever size. However, it is not enough to be generated for compression and tensile load in miniature universal testing machine. Therefore, three dozen bi-morph type PZTs are used for generating the load. The load and displacement of the precision actuator are 35g and 0.4mm respectively.

• 한국기계가공학회지
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• 제10권1호
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• pp.1-7
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• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• 센서학회지
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• 제17권1호
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• pp.35-40
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• 2008

Low power bridge type micro gas sensors were fabricated by micro machining technology with TMAH (Tetra Methyl Ammonium Hydroxide) solution. The sensing devices with different heater materials such as metal and poly-silicon were obtained using CMOS (Complementary Metal Oxide Semiconductor) compatible process. The tellurium films as a sensing layer were deposited on the micro machined substrate using shadow silicon mask. The low power micro gas sensors showed high sensitivity to NO with high speed. The pure tellurium film used micro gas sensor showed good sensitivity than transition metal (Pt, Ti) used tellurium film.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.77-81
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• 2020

Silicon wafer etching in micro electro mechanical systems (MEMS) fabrication is challenging to form 3-D structures. Well known Si-wet etch of silicon employs potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and sodium hydroxide (NaOH). However, the existing silicon wet etching process has a fatal disadvantage that etching of the back side of the wafer is hard to avoid. In this study, a wet etching bath for 150 mm wafers was designed to prevent back-side etching of silicon wafer, and we demonstrated the optimized process recipe to have anisotropic wet etching of silicon wafer without any damage on the backside. We also presented the design of wet bath for 300 mm wafer processing as a promising process development.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권9호
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• pp.495-501
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• 2000

This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

• Design & Manufacturing
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• 제14권1호
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• pp.36-41
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• 2020

Recently, due to the development of MEMS technology, researches for the production of effective micro structures and shapes have been actively conducted. However, the process technology based on chemical etching has a number of problems such as environmental pollution and time problems due to multi-process. Various processes to cope with this process are being studied, and one of the mechanical etching processes is the powder blasting process. This process is a method of spraying fine particles, which has the advantage of being an effective process in manufacturing hard brittle materials. However, it is also a process that adversely affects the material surface roughness and material properties due to the impact of the injection of fine particles. In this study, after fabricating micro-channels in fused silica glass with excellent optical properties among the hard brittle materials, we used the nano indentation system to analyze the micro parts using nano-particles as well as machinability and surface roughness analysis of the processed surface. The analysis was performed for the effective processing of powder blasting.

• 비파괴검사학회지
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• 제24권6호
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• pp.573-580
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• 2004

본 연구는 cMUT 제작을 위한 미세공정기술을 개발하기 위하여 수행되었다. 이를 위하여 외국의 관련 제조공정 연구결과들을 분석하였다. cMUT 제작의 주요 공정인 미소 진동 박막 형성, 희생층 형성, 식각 공정에 대한 실험을 수행하여 적절한 공정조건을 찾고자 하였다. 각 제작 공정조건들을 변화시켜 가면서 증착된 실리콘 질화막의 두께, 균일도, 잔류응력을 측정하였다. 희생층으로서 실리콘 산화막의 공정조건을 변화시켜 가면서 산화막의 성장률을 분석하였다. 마지막으로 희생층 식각을 위한 최적 식각공정을 얻기 위한 실험을 수행하였다. 본 연구에서 얻어진 주요 미세공정 조건은 추후 cMUT 제작에 적용될 예정이다.

• 비파괴검사학회지
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• 제32권1호
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• pp.41-46
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• 2012

MEMS/NEMS 구조체의 개발과 응용기술의 발달로 박판 및 박막의 기계적 물성 평가에 대한 요구가 점차 늘어나고 있다. 기계적 물성은 주로 인장시험이나 초음파의 속도 측정으로 평가되어 왔으나, 박판/박막 구조의 경우 기존의 기술로는 측정에 한계가 있어 나노압입시험법, 유도초음파법 등의 새로운 기술이 개발되고 있다. 본 연구에서는 박판 구조의 금속재료의 탄성계수를 평가하기 위하여 EMAT으로 송수신된 박판내에서의 유도초음파 진행 속도를 측정하였으며, 이론적으로 계산된 유도초음파 군속도와 실험적인 군속도의 최적화 과정을 통해 최종적으로 박판의 탄성계수를 평가하였다. 두께 $50{\mu}m$의 니켈 박판에서 측정된 영률은 201.6 GPa이었으며, 나노압입시험법으로 측정된 207 GPa, 참고문헌의 203.7 GPa과 비교하면 약 3% 내에서 일치하는 결과이다.

• 센서학회지
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• 제11권1호
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• pp.39-47
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• 2002

광 저장장치는 디스크 트랙에 레이저빔을 위치시켜 정보를 저장한다. 정보의 용량이 증대되면서 좀더 높은 저장 밀도를 요구하게 되었고, 그만큼 정밀한 레이저빔의 위치제어가 필요하게 되었다. 본 논문에서는 광 저장장치용 정전형 마이크로 미러를 MEMS기술을 이용해 제조하고 그 특성을 조사하였다. 마이크로 미러는 벌크 마이크로머시닝 기술에 의하여 제조되었으며, 특히 접합공정이 이루어지고 난 후에 연마공정에 의해서 실리콘 웨이퍼의 두께 및 미러면의 형태를 형성하는 공정을 적용함으로서 제현성을 높였다. 제작된 미러의 크기는 $3.0mm{\times}2.5mm$ 이고, 35V에서 변위는 $3.2{\mu}m$ 였다.