• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.395-399
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• 2011

In this study, micro gas sensors for ammonia gas were prepared by adopting MEMS technology and using a sol-gel process. Three types of sensors were prepared via different synthesis routes starting with W sol and Ru sol mixture. This mixture was deposited on a MEMS platform and the platform was subsegueny heated to a temperature of $350^{\circ}C$. The topography and crystal structure of the sensing film were studied using FE-SEM and XRD. The response of the gas sensor to $NH_3$ gas was examined at various operating temperatures and gas concentrations. The sensor response increased almost linearly with gas concentration and the best sensing response was obtained at $333^{\circ}C$ for 5.0 ppm $NH_3$ for the specimen prepared by coating $WO_3$ powders with the Ru sol mixture.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.1
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• pp.45-50
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• 2006

This paper shows a new precision actuator of MUTM(miniature universal testing machine) for the testing of compression and tensile load on the MEMS materials and structures. The MUTM consists of a sample holder, an ultraprecision precision actuator(tranlation stage) and load sensor. The precision actuator has been developed for generating displacements with nanometer accuracy and a dynamic range of 1mm simultaneously. In this paper, it can be made by using the displacement property of bi-morph type PZT, which is able to extend the long range(stroke) according to cantilever size. However, it is not enough to be generated for compression and tensile load in miniature universal testing machine. Therefore, three dozen bi-morph type PZTs are used for generating the load. The load and displacement of the precision actuator are 35g and 0.4mm respectively.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.1-7
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• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.35-40
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• 2008

Low power bridge type micro gas sensors were fabricated by micro machining technology with TMAH (Tetra Methyl Ammonium Hydroxide) solution. The sensing devices with different heater materials such as metal and poly-silicon were obtained using CMOS (Complementary Metal Oxide Semiconductor) compatible process. The tellurium films as a sensing layer were deposited on the micro machined substrate using shadow silicon mask. The low power micro gas sensors showed high sensitivity to NO with high speed. The pure tellurium film used micro gas sensor showed good sensitivity than transition metal (Pt, Ti) used tellurium film.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.77-81
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• 2020

Silicon wafer etching in micro electro mechanical systems (MEMS) fabrication is challenging to form 3-D structures. Well known Si-wet etch of silicon employs potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and sodium hydroxide (NaOH). However, the existing silicon wet etching process has a fatal disadvantage that etching of the back side of the wafer is hard to avoid. In this study, a wet etching bath for 150 mm wafers was designed to prevent back-side etching of silicon wafer, and we demonstrated the optimized process recipe to have anisotropic wet etching of silicon wafer without any damage on the backside. We also presented the design of wet bath for 300 mm wafer processing as a promising process development.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.9
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• pp.495-501
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• 2000

This paper presents a method to minimize the initial deflection of a multi-layer piezoelectric microactuator without loosing its piezoelectric deflection performance required for light modulating micromirror devices. The multi-layer piezoelectric actuator composed of PZT silicon nitride and platinum layers deflects or buckles due to the gradient of residual stress. Based on the structural analysis results and relationship between process conditions and mechanical properties we have modified the fabrication process and the thickness of thin film layers to reduce the initial residual stress deflection without decreasing its piezoelectric deflection performance. The modified designs fabricated by surface-micromachining process achieved the 77% reduction of the initial deflection compared with that of the conventional method based on the measured micromechanical material properties is applicable to the design refinement of multi-layer MEMS devices and micromechanical structures.

• Design & Manufacturing
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• v.14 no.1
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• pp.36-41
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• 2020

Recently, due to the development of MEMS technology, researches for the production of effective micro structures and shapes have been actively conducted. However, the process technology based on chemical etching has a number of problems such as environmental pollution and time problems due to multi-process. Various processes to cope with this process are being studied, and one of the mechanical etching processes is the powder blasting process. This process is a method of spraying fine particles, which has the advantage of being an effective process in manufacturing hard brittle materials. However, it is also a process that adversely affects the material surface roughness and material properties due to the impact of the injection of fine particles. In this study, after fabricating micro-channels in fused silica glass with excellent optical properties among the hard brittle materials, we used the nano indentation system to analyze the micro parts using nano-particles as well as machinability and surface roughness analysis of the processed surface. The analysis was performed for the effective processing of powder blasting.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.6
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• pp.573-580
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• 2004

The main goal of this study was to develop a micro-fabrication process for the capacitive micromachined ultrasonic transducer (cMUT). In order to achieve this goal, the former research results of the micro-electro-mechanical system (MEMS) process for the cMUT were analyzed. The membrane deposition, sacrificial layer deposition and etching were found to be a main process of fabricating the cMUT. The optimal conditions for those microfabrication were determined by the experiment. The thickness, uniformity, and residual stress of the $Si_3N_3$ deposition which forms the membrane of the cMUT were characterized after growing the $Si_3N_3$ on Si-wafer under various process conditions. As a sacrificial layer, the growth rate of the $SiO_2$ deposition was analyzed under several process conditions. The optimal etching conditions of the sacrificial layer were analyzed. The microfabrication process developed in this study will be used to fabricate the cMUT.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.1
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• pp.41-46
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• 2012

As the development of MEMS/NEMS structure and application technology the demand for an assessment of the mechanical properties have increased. The mechanical properties are mainly evaluated by using tensile test or ultrasonic wave measurement. However, the new technology have been developed such as nano-indentation, guided wave method because they have a limitation in case of a thin plate and thin film. In the study, the guided wave velocities are measured by electromagnetic-acoustic transducer(EMAT), the material properties of thin metallic foils are obtained using optimization process of the theoretical and experimental group velocity of guided wave. The Young's modulus obtained by the optimization process(201.6 GPa), nano-indentation(207.0 GPa) and literature value(203.7 GPa) of a $50{\mu}m$ thick nickel thin plate shows good agreement within 3%.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.39-47
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• 2002

Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. The mirror was fabricated by using MEMS technology. Especially, the Process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the process reliability. The mirror size was $2.5mm{\times}3mm$ and it needed about 35V for displacement of $3.2{\mu}m$.