• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Journal of the Optical Society of Korea
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• v.20 no.5
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• pp.601-606
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• 2016

In this study, in order to analyze the low-temperature sintering process of silver and copper nanoparticles, we calculate their melting temperatures and surface melting temperatures with respect to particle size. For this calculation, we introduce the concept of mean-squared displacement of the atom proposed by Shi (1994). Using a parameter defined by the vibrational component of melting entropy, we readily obtained the surface and bulk melting temperatures of copper and silver nanoparticles. We also calculated the absorption cross-section of nanoparticles for variation in the wavelength of light. By using the calculated absorption cross-section of the nanoparticles at the melting temperature, we obtained the laser threshold energy for the sintering process with respect to particle size and wavelength of laser. We found that the absorption cross-section of silver nanoparticles has a resonant peak at a wavelength of close to 350 nm, yielding the lowest threshold energy. We calculated the intensity distribution around the nanoparticles using the finite-difference time-domain method and confirmed the resonant excitation of silver nanoparticles near the wavelength of the resonant peak.

• Journal of Korea Foundry Society
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• v.35 no.3
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• pp.62-66
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• 2015

Tape casting is an important forming operation used to prepare flat sheets in the various industries. In this study, Doctor Blade tape casting of In-based low melting point alloy was carried out. The purpose of this investigation was to determine the possibility of applying the Doctor Blade tape casting process to the manufacture of low melting point alloy sheets that can be used as thermal fusible parts of battery safety systems. In-based molten alloy that has a melting point of $95^{\circ}C$ was produced; it's viscosity was measured at various temperatures. The molten alloy was used as a slip in the caster of the Doctor Blade tape casting system. The effects of the molten alloy temperatures and carrier speeds on the produced sheet shape were observed. For the casting conditions of 1.5 cm slip height, $120^{\circ}C$ slip temperature, 0.05 mm blade gap and 60 m/min. carrier speed, an In-based alloy thin tape well shaped with 0.16 mm uniform thickness was continuously produced.

• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Elastomers and Composites
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• v.32 no.5
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• pp.318-324
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• 1997

Since the rigid and continuous networks of high-purity silica(white carbon) were relatively transparent to microwaves, high purity silica coupled with microwaves using a zirconia susceptor at room temperature and it was then heated to its melting temperature. The low-purity silica, contained small amount of impurities, yielded greater microwave absorption owing to easy motion of the interstitial alkali ions and it was then heated to its melting temperature. X-ray diffraction patterns of the low-purity silica were broader than those of the high-purity silica due to higher concentration of non-bridging bond and more deformed random network structure. In the vulcanization process of whitened or coloured rubber compound which is employing low-purity silica(white carbon) as a reinforcing filler, vulcanizate could be obtained effectively by microwave heating energy.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.699-700
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• 2009

• Journal of the Korean Ceramic Society
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• v.49 no.2
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• pp.191-196
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• 2012

In this study, tin phosphate glass system($SnO_2-(1-x)P_2O_5-xB_2O_3$) that occur during the melting of the metal oxide inhibition of the oxidation reaction, and to reduce oxides of high melting temperature in the following three methods were melting. The first is the general way in the atmosphere, and the second by injecting $N_2$ gas under a neutral atmosphere, and finally in the air were melted by the addition of a reducing agent Melt in the atmosphere when the oxidation of the metal oxide is inhibited by low temperatures were melting. In addition, the deposition of crystals within glassy or inhibit devitrification phenomenon is also improved over 80% transmittance. This phenomenon, when the melting of glass, many of $Sn^{4+}$ ions are reduced to the $Sn^{2+}$ was forming oxides SnO, because it acts as a modifier oxide.

• Bulletin of the Korean Chemical Society
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• v.33 no.3
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• pp.929-932
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• 2012

The classical molecular dynamics simulation was used to study the phase transition of gold nanoparticles under confinement using Sutton-Chen (SC) potential. Metal gold nanoparticles with different number of atoms are subject to replica exchange molecular dynamics simulation for this purpose. The simulation showing the solidto-liquid melting temperature largely remains unaffected by confinement, while the confinement induces characteristic pre-melting at very low temperature depending on atom number in nanoparticles.

• Journal of the Korean Society of Safety
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• v.8 no.4
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• pp.139-148
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• 1993

Thermosyphons are simple devices that can passively transport thermal energy over relatively long distance with little temperature degradation. These attributes permit the use of low grade thermal energy for thermal control of structures including the snow melting and deicing to the pavement surface. The thermosyphon system requires no costly energy input and Is completely maintenance free. This paper presents the experimental results of the snow melting system in which thermosyphon was utilized to transfer the geothermal energy to the pavement to obviate slipping traffic accidents due to freezing of pavement in winter.