1 |
J. Liu, Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., Port Erin, UK, 1999.
|
2 |
J. C. Jagt, P. J. M. Beris, and G. F. C. M. Lijten, lEEE Trans. CPMT-Part B, 18, 292 (1995).
|
3 |
K. Suganuma, Science, 5, 55 (2001)
|
4 |
K. Fujimoto, K. Yasuda, and J. M. Kim, JP 3869688 (2006)
|
5 |
M. Abtew and G. Selvaduray, Mater. Sci. Eng.: R Rep., 27, 95 (2000).
DOI
ScienceOn
|
6 |
J. M. Kim, K. Yasuda, and K. Fujimoto, J. Electon. Mater., 34, 600 (2005).
DOI
ScienceOn
|
7 |
R. D. Gamota and M. C. Melton, lEEE/CPMT Transactions International Electronics Manufacturing Symposium, Seattle, WA, 1996
|
8 |
M. A. Uddin, M. O. Alam, Y. C. Chan, and H. P. Chan, Micro elecron. Reliab., 44, 505 (2004)
DOI
ScienceOn
|
9 |
Z. Lai and J. Liu, lEEE Trans. CPMT, 19, 647 (1996).
|
10 |
J. M. Kim, K. Yasuda, M. Rito, and K. Fujomoto, Mater. Trans., 45, 157 (2004).
DOI
ScienceOn
|
11 |
J. M. Kim, J. Kor. Weld. Joining Soc., 25, 133 (2007)
|
12 |
M. A. Uddin, M. O. Alam, Y. C. Chan, and H. P. Chan, Microelecron. ReIiab., 44, 505 (2004).
DOI
ScienceOn
|
13 |
J. M. Kim, K. C. Yang, S. B. Lee, S. H. Lee, Y. E. Shin, K. H. Chang, J. G. Han, Y. S. Eom, J. T. Moon, J. W. Baek and J. D. Nam, Mat. Sci For, 580, 217 (2008)
|
14 |
Y. Li, K. S. Moon, H. Li and C. P. Wong, Proc. 54th Electronic Components and Technology Conference, Las Vegas, NV, United States, 2004.
|
15 |
R. Ardeleanu, N. Voiculescu, M. Marcu, G. Roman, C. Buchidau, L. Scarescu, and G. Sacarescu, Macromol. Rap. Comm., 18, 739 (1997).
DOI
ScienceOn
|
16 |
Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam, and J. M. Kim, Microelectron. Eng., 85, 327 (2008).
DOI
ScienceOn
|