Browse > Article

Enhancement of Wetting Characteristics for Anisotropic Conductive Adhesive with Low Melting Point Solder via Carboxylic Acid-based Novel Reductants  

Kim, Hyo-Mi (School of Chemical Engineering & Materials Science, Chung-Ang University)
Kim, Joo-Heon (School of Chemical Engineering & Materials Science, Chung-Ang University)
Publication Information
Polymer(Korea) / v.34, no.1, 2010 , pp. 52-57 More about this Journal
Abstract
The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.
Keywords
low melting point alloys (LMPA); anisotropic conductive adhesive (ACA); wetting; thermorheological property;
Citations & Related Records

Times Cited By Web Of Science : 0  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
연도 인용수 순위
  • Reference
1 J. Liu, Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd., Port Erin, UK, 1999.
2 J. C. Jagt, P. J. M. Beris, and G. F. C. M. Lijten, lEEE Trans. CPMT-Part B, 18, 292 (1995).
3 K. Suganuma, Science, 5, 55 (2001)
4 K. Fujimoto, K. Yasuda, and J. M. Kim, JP 3869688 (2006)
5 M. Abtew and G. Selvaduray, Mater. Sci. Eng.: R Rep., 27, 95 (2000).   DOI   ScienceOn
6 J. M. Kim, K. Yasuda, and K. Fujimoto, J. Electon. Mater., 34, 600 (2005).   DOI   ScienceOn
7 R. D. Gamota and M. C. Melton, lEEE/CPMT Transactions International Electronics Manufacturing Symposium, Seattle, WA, 1996
8 M. A. Uddin, M. O. Alam, Y. C. Chan, and H. P. Chan, Micro elecron. Reliab., 44, 505 (2004)   DOI   ScienceOn
9 Z. Lai and J. Liu, lEEE Trans. CPMT, 19, 647 (1996).
10 J. M. Kim, K. Yasuda, M. Rito, and K. Fujomoto, Mater. Trans., 45, 157 (2004).   DOI   ScienceOn
11 J. M. Kim, J. Kor. Weld. Joining Soc., 25, 133 (2007)
12 M. A. Uddin, M. O. Alam, Y. C. Chan, and H. P. Chan, Microelecron. ReIiab., 44, 505 (2004).   DOI   ScienceOn
13 J. M. Kim, K. C. Yang, S. B. Lee, S. H. Lee, Y. E. Shin, K. H. Chang, J. G. Han, Y. S. Eom, J. T. Moon, J. W. Baek and J. D. Nam, Mat. Sci For, 580, 217 (2008)
14 Y. Li, K. S. Moon, H. Li and C. P. Wong, Proc. 54th Electronic Components and Technology Conference, Las Vegas, NV, United States, 2004.
15 R. Ardeleanu, N. Voiculescu, M. Marcu, G. Roman, C. Buchidau, L. Scarescu, and G. Sacarescu, Macromol. Rap. Comm., 18, 739 (1997).   DOI   ScienceOn
16 Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam, and J. M. Kim, Microelectron. Eng., 85, 327 (2008).   DOI   ScienceOn