• 마이크로전자및패키징학회지
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• 제23권3호
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• pp.7-14
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• 2016

High junction temperature directly or indirectly affects the optical performance and reliability of high power LEDs in many ways. This paper is focused on junction temperature characterization of LEDs. High power LEDs (3W) were tested in temperature steps to reach a thermal equilibrium condition between the chamber and the LEDs. The LEDs were generated by pulsed currents with duty ratios (0.091% and 0.061%) in multiple steps from 0mA and 700mA. The diode forward voltages corresponding to the short pulsed currents were monitored to correlate junction temperatures with the forward voltage responses for calibration measurement. In junction temperature measurement, forward voltage responses at different current levels were used to estimate junction temperatures. Finally junction temperatures in multiple steps of currents were estimated in effectively controlled conditions for designing the reliability of LEDs.

• 한국인터넷방송통신학회논문지
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• 제8권6호
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• pp.35-40
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• 2008

최근 사파이어기판 위에 성장한 갈륨나이트라이드 발광다이오드의 소자 제작 기술이 비약적으로 발전하였다. 하지만 이들 다이오드가 이미 상업적으로 활용되고 있다 할지라도 갈륨나이트라이드 발광다이오드에 있어서 다이오드를 구성하는 물질들과 소형화에 따른 정전기 방전에 의한 피해를 고려해야한다. 정전기방전(ESD)에 의한 피해는 발광소자의 신뢰성에 매우 큰 영향을 주는 파라미터중 하나이다. 본 연구에서는 대량생산 되는 발광다이오드의 생산공정에서 발생하는 정전기방전에 의한 피해와 이에 대한 대책을 논의하였다. 대부분의 ESD 문제는 장비의 적정한 사용과 공정 환경 개선을 통해서 제어되었다.

• 대한전자공학회논문지SD
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• 제44권2호
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• pp.7-12
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• 2007

고휘도 LED(Light-Emitting Diode)를 구현하기 위한 칩 설계의 최적화에 이용할 수 있는 SPICE 기반의 LED 3차원 회로 모델을 개발하였다. 본 모델은 LED를 일정한 면적의 픽셀로 구획하고, 각각의 픽셀은 n-전극, n-형 반도체, p-형 반도체, 및 p-전극 등의 일반적인 LED 레이어 구조를 반영하는 회로망으로 나타낸다. 개별의 박막 층과 접촉 저항은 저항 네트웍으로, pn-접합부는 일반적인 pn-접합 다이오드로 각각 모델링 한다. 별도의 테스트 패턴을 이용하여 독립적으로 추출한 파라미터를 이용한 시뮬레이션 결과는 실험 결과와 정확하게 일치함을 확인하였다.

• 마이크로전자및패키징학회지
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• 제21권1호
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• pp.19-23
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• 2014

LED (Light Emitting Diode) 시장의 발전이 빠르게 이루어지고 있음에 따라 점차 고효율 LED의 필요성이 증가하고 있다. 이에 우리는 Hole Type의 Padless 신 구조 수직형 LED에서, 접촉 전극의 크기와 그 배치가 Chip의 가동 전압에 어떠한 영향을 미치는지 알아보았다. 이를 위하여 LED simulation을 통한 계산과 실제 Chip 제작을 통한 전기적 특성 평가를 하였다. 그 결과, Simulation 을 통하여 n전극의 크기가 커질수록 구동전압이 낮아짐을 확인하였고, N 전극의 형태가 확산됨에 따라서도 구동전압이 낮아짐을 확인하였다. 이러한 추세는 실제 제작한 LED Chip의 측정 결과와 비슷한 경향을 나타내었다.

• Journal of Biosystems Engineering
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• 제24권2호
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• pp.115-122
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• 1999

Because of their small mass, volume, solid state construction and long life, light-emitting diodes(LEDs) hold promises as a lighting source for intensive plant production system. Spectral characteristics and light intensity of LEDs were tested to investigate their feasibility as artificial lighting sources for growth and morphogenesis control in transplant production system. Blue, green, and red LEDs had a peak-emission wavelength at 442nm, 522nm, and 673nm, respectively. Their half width defined as the difference between upper and lower wavelength in the intensity equivalent to 50% of the maximum intensity showed 26nm, 41nm, and 74nm, respectively. Photosynthetic photon flux(PPE) at the distance of 9cm under the LEDs array was measured as $235{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$ for red, $109{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$ for green, and $75{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$ for blue LEDs. At the same distance, green LEDs had the illuminance of 13,0001x, nine to ten times higher than those of red and blue LEDs. Red, green, and blue LEDs at a distance of 9cm had the irradiance of $46W{\cdot}m^{-2},\;19W{\cdot}m^{-2},\;8W{\cdot}m^{-2}$, respectively. Light intensity of blue, green, and red LEDs increased linearly in proportion to the magnitude of the current applied to the operating circuit. Thus the light intensity of LEDs was controlled by the applied current in operating circuit.

• Journal of the Optical Society of Korea
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• 제16권4호
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• pp.349-353
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• 2012

Uniform spreading of injection current in light-emitting diodes (LEDs) is one of the crucial requirements for better device performances. It is reported that non-uniform current spreading leads to low output power, high current crowding, heating, and reliability degradation of the LED device. This paper reports on the effects of different surface and electrode geometries in the LEDs. To increase the output power of LEDs and reduce the series resistance, a rectangular-type LED (RT-LED) with a centered island cathode has been fabricated and investigated by comparison with a conventional LED (CV-LED). The performances of RT-LEDs were prominently enhanced via uniform current spreading and low current crowding. Performances in terms of increased output power and lower forward voltage of simulated RT-LEDs are much superior to those of CV-LEDs. Based on these results, we investigated the correlation between device geometries and optical characteristics through the fabricated CV and RT-LEDs. The measured output power and forward voltage of the RT-LEDs at 100 mA are 64.7% higher and 8% smaller compared with those of the CV-LEDs.

• 한국재료학회지
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• 제23권3호
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• pp.177-182
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• 2013

Nanosphere lithography is an inexpensive, simple, high-throughput nanofabrication process. NSL can be done in different ways, such as drop coating, spin coating or by means of tilted evaporation. Nitride-based light-emitting diodes (LEDs) are applied in different places, such as liquid crystal displays and traffic signals. The characteristics of gallium nitride (GaN)-based LEDs can be enhanced by fabricating nanopatterns on the top surface of the LEDs. In this work, we created differently sized (420, 320 and 140 nm) nanopatterns on the upper surfaces of GaN-based LEDs using a modified nanosphere lithography technique. This technique is quite different from conventional NSL. The characterization of the patterned GaN-based LEDs revealed a dependence on the size of the holes in the pattern created on the LED surface. The depths of the patterns were 80 nm as confirmed by AFM. Both the photoluminescence and electroluminescence intensities of the patterned LEDs were found to increase with an increase in the size of holes in the pattern. The light output power of the 420-nm hole-patterned LED was 1.16 times higher than that of a conventional LED. Moreover, the current-voltage characteristics were improved with the fabrication of differently sized patterns over the LED surface using the proposed nanosphere lithography method.

• Journal of the Optical Society of Korea
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• 제18권3호
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• pp.283-287
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• 2014

Square lattice nano-hole arrays with diameters and periodicities of 200 and 500 nm, respectively, are fabricated on InGaN/GaN blue light emitting diodes (LEDs) using electron-beam lithography and inductively coupled plasma reactive ion etching processes. Cathodoluminescence (CL) investigations show that light emission intensity from the LEDs with the nano-hole arrays is enhanced compared to that from the planar sample. The CL intensity enhancement factor decreases when the nano-holes penetrate into the multiple quantum wells (MQWs) due to the plasma-induced damage and the residues. Wet chemical treatment using KOH solution is found to be an effective method for light extraction from the nano-patterned LEDs, especially, when the nano-holes penetrate into the MQWs. About 4-fold CL intensity enhancement factor is achieved by the KOH treatments after the dry etching for the sample with a 250-nm deep nano-hole array.

• Journal of the Optical Society of Korea
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• 제17권1호
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• pp.22-26
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• 2013

The author analyzes the luminous efficiency of the phosphor-conversion white light-emitting diode (LED) that consists of a blue LED chip and a yellow phosphor. A theoretical model is derived to find the relation between luminous efficiency (LE) of a white LED, wall-plug efficiency (WPE) of a blue LED chip, and the phosphor absorption ratio of blue light. The presented model enables to obtain the theoretical limit of LE and the lower bound of WPE. When the efficiency model is applied to the measured results of a phosphor-conversion white LED, the limit theoretical value of LE is obtained to be 261 lm/W. In addition, for LE of 88 lm/W at 350 mA, the lower bound of WPE in the blue LED chip is found to be ~34%. The phosphor absorption ratio of blue light was found to have an important role in optimizing the luminous efficiency and colorimetric properties of phosphor-conversion white LEDs.

• 한국광학회:학술대회논문집
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• 한국광학회 2007년도 하계학술발표회 논문집
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• pp.285-286
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• 2007

Current distributions according to electrode patterns in vertical structured InGaN/GaN LED (light emitting diode) were investigated quantitatively by utilizing three dimensional electrical circuit modeling method. The uniformity of the injected current density in the active layer was compared among different electrode patterns. It was found that the current uniformity was greatly dependent on the electrode pattern in vertical InGaN/GaN LEDs.