• Title/Summary/Keyword: Layer-by-layer Deposition Method

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Fabrication of ZnO inorganic thin films by using UV-enhanced Atomic Layer Deposition

  • Song, Jong-Su;Yun, Hong-Ro;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.312.1-312.1
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    • 2016
  • We have deposited ZnO thin films by ultraviolet (UV) enhanced atomic layer deposition using diethylznic (DEZ) and water (H2O) as precursors with UV light. The atomic layer deposition relies on alternating dose of the precursor on the surface and subsequent chemisorption of the precursors with self-limiting growth mechanism. Though ALD is useful to deposition conformal and precise thin film, the surface reactions of the atomic layer deposition are not completed at low temperature in many cases. In this experiment, we focused on the effects of UV radiation during the ALD process on the properties of the inorganic thin films. The surface reactions were found to be complementary enough to yield uniform inorganic thin films and fully react between DEZ and H2O at the low temperature by using UV irradiation. The UV light was effective to obtain conductive ZnO film. And the stability of TFT with UV-enhanced ZnO was improved than ZnO by thermal ALD method. High conductive UV-enhanced ZnO film have the potential to applicability of the transparent electrode.

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Study on the Atomic Layer Deposition System and Process of the MgO Thin Layer for the Thin Film Encapsulation of OLED (OLED의 Thin Film Encapsulation을 위한 MgO 박막의 원자층 증착 장치 및 공정에 관한 연구)

  • Cho, Eou Sik;Kwon, Sang Jik
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.22-26
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    • 2021
  • Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al2O3 and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al2O3/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP2 precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

Effect of Deposition Parameters on the Property of SiC Layer in TRISO-Coated Particles (TRISO 피복 입자에서 증착 조건이 탄화규소층의 특성에 미치는 영향)

  • Park, J.H.;Kim, W.J.;Park, J.N.;Park, K.H.;Park, J.Y.;Lee, Y.W.
    • Korean Journal of Materials Research
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    • v.17 no.3
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    • pp.160-166
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    • 2007
  • TRISO coatings on $ZrO_{2}$ surrogate kernels were conducted by a fluidized-bed chemical vapor deposition (FBCVD) method. Effects of the deposition temperature and the gas flow rate on the properties of SiC layer were investigated in the TRISO-coated particles. Deposition rate of the SiC layer decreased as the deposition temperature increased in the temperature range of $1460^{\circ}-1550^{\circ}C$. At the deposition temperature of $1550^{\circ}C$ the SiC layer contained an excess carbon, whereas the SiC layers had stoichiometric compositions at $1460^{\circ}C\;and\;1500^{\circ}C$. Hardness and elastic modulus measured by a nanoindentation method were the highest in the SiC layer deposited at $1500^{\circ}C$. The SiC layer deposited at the gas flow rate of 4000 sccm exhibited a high porosity and contained large pores more than $1{\mu}m$, being due to a violent spouting of particles. On the other hand, the SiC layer deposited at 2500 sccm revealed the lowest porosity.

Effects of surface geometry of MgO protective layer for AC-PDPs

  • Park, Sun-Young;Moon, Sung-Hwan;Heo, Tae-Wook;Kim, Jae-Hyuk;Lee, Joo-Hwi;Kim, Hyeong-Joon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1395-1398
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    • 2007
  • MgO thin films were deposited by e-beam evaporator using the 2-step method for alternate current plasma display panels (AC-PDPs). Glancing angle deposition (GLAD) method was employed to produce various surface geometry of the thin film; the bottom layer was deposited on a substrate by normal e-beam evaporation method and the top layer was deposited on bottom layer with $85^{\circ}$ by GLAD method. Results show that firing and sustain voltages improved as the sharpness of surface and isolated columnar structures increases, respectively.

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Fabrication of $TiO_2$ Blocking Layers for CuSCN Based Dye-Sensitized Solar Cells by Atomic Layer Deposition Method

  • Baek, Jang-Mi;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.310.2-310.2
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    • 2013
  • For enhancement of dye-sensitized solar cell performance, TiO2 blocking layer has been used to prevent recombination between electron and hole at the conducting oxide and electrolyte interface. In solid state dye-sensitized solar cells, it is necessary to fabricate pin-hole free TiO2 blocking layer. In this work, we deposited the TiO2 blocking layer on conducting oxide by atomic layer deposition and compared the efficiency. To compare the efficiency, we fabricate solid state dye-sensitized solar cell with using CuSCN as hole transport material. We see the efficiency improve with 40nm TiO2 blocking layer and the TiO2 blocking layer morphology was characterized by SEM. Also, we used this blocking layer in TiO2/Sb2S3/ CuSCN solar cell.

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Characteristics of ZnO Thin Films of FBAR using ALD and RF Magnetron Sputtering (ALD와 RF 마그네트론 스퍼터링을 이용한 FBAR 소자의 ZnO 박막증착 및 특성)

  • Shin, Young-Hwa;Kwon, Sang-Jik;Yoon, Young-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.2
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    • pp.164-168
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    • 2005
  • Piezoelectric ZnO thin films were for the first time formed on SiO$_2$/Si(100) substrate using 2-step deposition, atomic layer deposition(ALD) and RF magnetron sputtering deposition, for film bulk acoustic resonator(FBAR) applications. The ZnO buffer layer by ALD was deposited using alternating diethyl zinc(DEZn)/$H_2O$ exposures and ultrahigh purity argon gas for purging. The ZnO films by 2-step deposition revealed stronger c-axis-preferred orientation and smoother surface than those by the conventional RF sputtering method. The solidly mounted resonator(SMR)-typed FBAR fabricated by using 2-step deposition method revealed higher quality factor of 580 and lower return loss of -17.35dB. Therefore the 2-step deposition method in this study could be applied to the FBAR device fabrication.

Characteristics of As-doped ZnO thin films with various buffer layer temperatures prepared by PLD method (PLD법을 이용한 Buffer Layer 증착온도에 따른 As-doped ZnO 박막의 특성)

  • Lee, Hong-Chan;Shim, Kwang-Bo;Oh, Young-Jei
    • Journal of Sensor Science and Technology
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    • v.15 no.2
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    • pp.84-89
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    • 2006
  • Highly concentrated p-type ZnO thin films can be obtained by doping of N, P and As elements. In this study, undoped ZnO buffer layers were prepared on a (0001) sapphire substrate by a ultra high vaccum pulsed laser deposition(UHV-PLD) method. ZnO buffer layers were deposited with various deposition temperature($400{\sim}700^{\circ}C$) at 350 mtorr of oxygen working pressure. Arsenic doped(1 wt%) ZnO thin films were deposited on the ZnO buffer layers by UHV-PLD. Crystallinity of the samples were evaluated by X-ray diffractometer and scanning electron microscopy. Optical, electrical properties of the ZnO thin films were estimated by photoluminescence(PL) and Hall measurements. The optimal condition of the undoped ZnO buffer layer for the deposition of As-doped ZnO thin films was at $600^{\circ}C$ of deposition temperature.

Characteristics Investigation of ZnO-Si-ZnO Multi-layer Thin Films Fabricated by Pulsed Laser Deposition (펄스 레이저 증착법에 의해 제작된 ZnO-Si-ZnO 다층 박막의 특성 연구)

  • 강홍성;강정석;심은섭;방성식;이상렬
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.1
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    • pp.65-69
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    • 2003
  • ZnO-Si-ZnO multi-layer thin films have been deposited by pulsed laser deposition (PLD). And then, the films have been annealed at 300$^{\circ}C$ in oxygen ambient pressure. Peak positions of ultraviolet (UV) and visible region were changed by addition of Si layer. Mobility of the films was improved slightly than ZnO thin film without Si layer. The structural property changed by inserting intermediate Si layer in ZnO thin film. The optical properties and structural properties of ZnO-Si-ZnO multi-layer thin films were characterized by PL(Photoluminescence) and XRB(X-ray diffraction) method, respectively. Electrical properties were measured by van der Pauw Hall measurements

Functional Polymer Thin Films based on the Layer-by-Layer Deposition

  • Char, Kook-Heon
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.192-192
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    • 2006
  • Organic/organic and organic/inorganic multilayer films composed of organic polyelectrolytes (PE) and inorganic nanoparticles/platelets were prepared from the layer-by-layer (LbL) deposition using both spinning and dipping. The difference in both LbL methods is quantitatively compared in terms of internal layer ordering and physical properties of the multilayered films. Additionally, we suggest that the patterned multilayer films can be easily prepared by the combination of the spin SA and the lift-off method. Freestanding films were also prepared with the LbL deposition on low energy substrates, which allows the detailed analysis of composition within the films. Other LbL thin films prepared with block copolymer micelles will be discussed.

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Effect of Deposition Temperature on the Property of Pyrolytic SiC Fabricated by the FBCVD Method (유동층 화학기상증착법을 이용하여 제조된 열분해 탄화규소의 특성에 미치는 증착온도의 영향)

  • Kim, Yeon-Ku;Kim, Weon-Ju;Yeo, SungHwan;Cho, Moon-Sung
    • Journal of Powder Materials
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    • v.21 no.6
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    • pp.434-440
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    • 2014
  • Silicon carbide(SiC) layer is particularly important tri-isotropic (TRISO) coating layers because it acts as a miniature pressure vessel and a diffusion barrier to gaseous and metallic fission products in the TRISO coated particle. The high temperature deposition of SiC layer normally performed at $1500-1650^{\circ}C$ has a negative effect on the property of IPyC layer by increasing its anisotropy. To investigate the feasibility of lower temperature SiC deposition, the influence of deposition temperature on the property of SiC layer are examined in this study. While the SiC layer coated at $1500^{\circ}C$ obtains nearly stoichiometric composition, the composition of the SiC layer coated at $1300-1400^{\circ}C$ shows discrepancy from stoichiometric ratio(1:1). $3-7{\mu}m$ grain size of SiC layer coated at $1500^{\circ}C$ is decreased to sub-micrometer (< $1{\mu}m$) $-2{\mu}m$ grain size when coated at $1400^{\circ}C$, and further decreased to nano grain size when coated at $1300-1350^{\circ}C$. Moreover, the high density of SiC layer (${\geq}3.19g/cm^3$) which is easily obtained at $1500^{\circ}C$ coating is difficult to achieve at lower temperature owing to nano size pores. the density is remarkably decreased with decreasing SiC deposition temperature.