• Korean Journal of Materials Research
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• v.17 no.1
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• pp.43-49
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• 2007

Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in $Na_2SO_4$ solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in ${SO_4}{^2-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.

• BMB Reports
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• v.48 no.2
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• pp.97-102
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• 2015

Neurons in the developing brain form the cortical plate (CP) in an inside-out manner, in which the late-born neurons are located more superficially than the early-born neurons. Fyn, a member of the Src family kinases, plays an important role in neuronal migration by binding to many substrates. However, the role of the Src-homology 2 (SH2) domain in function of Fyn in neuronal migration remains poorly understood. Here, we demonstrate that the SH2 domain is essential for the action of Fyn in neuronal migration and cortical lamination. A point mutation in the Fyn SH2 domain ($Fyn^{R176A}$) impaired neuronal migration and their final location in the cerebral cortex, by inducing neuronal aggregation and branching. Thus, we provide the first evidence of the Fyn SH2 domain contributing to neuronal migration and neuronal morphogenesis.

• Journal of Physiology & Pathology in Korean Medicine
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• v.20 no.6
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• pp.1629-1635
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• 2006

The migration of vascular smooth muscle cells (VSMC) and the production of matrix metallopreteinases-9 (MMP-9) may play a key role in the development of atherosclerosis. In this study, we have more extensively investigated the inhibitory effect of UR on MMP-9 activity and TNF-${\alpha}$ induced human aortic smooth muscle cells (HASMC) migration. The result from gelatin zymography showed that UR inhibited MMP-9 activity in a dose-dependent manner (IC50 = 55 g/ml). In addition, UR strongly inhibited the migration of HASMC induced by TNF-treatment (IC50 = 125 g/ml), although it has very low cytotoxic effect on HASMC (IC50 > 500 g/ml). These results suggest that UR is a potential anti-atherosclerotic agent through inhibition of MMP-9 activity and VSMC migration.

• Fire Science and Engineering
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• v.33 no.6
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• pp.114-119
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• 2019

We found metallic migration phenomena at the fire scene in Printed circuit board (PCB) of LED light equipment which are commonly used. Accordingly we did this study. In order to generate rapidly metallic migration, we experiment the water drop test under low voltage (3.0 V) and a small amount of water condition. As a results of our experiment, we saw the growth of metallic migration of Copper and checked directly short of the PCB between isolated two poles by Cu migration. Finally we saw the shape of dendrite pattern by Cu migration using Scanning electron microscope (SEM) and analyzed that components via Energy dispersive Spectrometer (EDS).

• Journal of Welding and Joining
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• v.25 no.3
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• Journal of KIISE:Computing Practices and Letters
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• v.11 no.4
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• pp.293-304
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• 2005

In this paper, we research on job migration in a grid computing environment with cactus and MPICH-C2 based on Globus. Our concepts are to perform job migration by finding the site with plenty of computational resources that would decrease execution time in a grid computing environment. The Migration Manager recovers the job from the checkpointing files and restarts the job on the migrated site. To select a migrating site, the proposed method considers system's performance index, cpu's load, network traffic to send migration job tiles and the execution time predicted on a migration site. Then it selects a site with maximal performance gains. By selecting a site with minimum migration time and minimum execution time. this approach implements a more efficient grid computing environment. The proposed method Is proved by effectively decreasing total execution time at the $K\ast{Grid}$.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.312-316
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• 2016

The energetics of defects in the presence of domain walls in $LiNbO_3$ are characterized using density-functional theory calculations. Domain walls show stronger interactions with antisite defects than with interstitial defects or vacancies. As a result, antisite defects act as a strong pinning center for the domain wall in $LiNbO_3$. Analysis of migration behavior of the antisite defects across the domain wall shows that the migration barrier of the antisite defects is significantly high, such that the migration of antisite defects across the domain wall is energetically not preferable. However, further study on excess electrons shows that the migration barrier of antisite defects can be lowered by changing the charge states of the antisite defects. So, excess electrons can enhance the migration of antisite defects and thus facilitate domain wall movement by weakening the pinning effect.

• Proceedings of the Korean Information Science Society Conference
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• 2011.06b
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• pp.9-12
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• 2011

가상화 기술은 물리적 컴퓨팅 자원의 추상화를 통해 다수의 운영 체제나 응용 프로그램이 물리적 서버의 자원을 공유하게 함으로써 소요비용을 절감하고 자원을 통합 관리할 수 있는 기술이다. 그러나 가상화 기반 클러스터에서는 클러스터를 이루는 물리적 서버들이 균형적으로 자원을 활용하지 못하고 특정 서버로 자원 활용률이 집중되는 현상(hotspot)이 발생 할 수 있다. 이에 본 논문에서는 Live migration 기술을 이용하여 가상화 클러스터의 자원 효율을 높이는 알고리즘을 제안한다. 제안 알고리즘은 hotspot의 원인이 되는 자원의 우선순위를 기반으로 가장 적합한 대상을 선정하여 가상머신을 이동시켜 클러스터의 자원 활용률의 균형을 도모하고 추가적인 hotspot의 발생을 최소화고 불필요한 Live migration을 방지하여 migration시에 발생하는 로드를 줄일 수 있다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.3
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• pp.24-29
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• 2009

In case of the optimization problems that have many design variables, the conventional genetic algorithms(GA) fall into a trap of local minima with high probability. This problem is called the premature convergence problem. To overcome it, the parallel genetic algorithms which adopt the migration mechanism have been suggested. But it is hard to determine the several parameters such as the migration size and the migration interval for the parallel GAs. Therefore, we propose a new method to determine the migration interval automatically in this paper. To verify its validity, it is applied to some traditional mathematical optimization problems and is compared with the conventional parallel GA. It is also applied to the optimal design of the brushless DC motor for an electric wheel chair which is a real world problem and has five design variables.