Browse > Article
http://dx.doi.org/10.3740/MRSK.2007.17.1.043

Effect of SO42- Ion on Corrosion and Electrochemical Migration Characteristics of Eutectic SnPb Solder Alloy  

Jung, Ja-Young (School of Materials Science and Engineering, Andong National University)
Yoo, Young-Ran (School of Materials Science and Engineering, Andong National University)
Lee, Shin-Bok (School of Materials Science and Engineering, Seoul National University)
Kim, Young-Sik (School of Materials Science and Engineering, Andong National University)
Joo, Young-Chang (School of Materials Science and Engineering, Seoul National University)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Korean Journal of Materials Research / v.17, no.1, 2007 , pp. 43-49 More about this Journal
Abstract
Electrochemical migration phenomenon is correlated with ionization of anode electrode, and ionization of anode metal has similar mechanism with corrosion phenomenon. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in $Na_2SO_4$ solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Sn Ivas primarily ionized in ${SO_4}{^2-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for electrochemical migration resistance of solder alloys.
Keywords
electrochemical migration; solder; $Na_2SO_4$; SnPb; polarization;
Citations & Related Records

Times Cited By SCOPUS : 0
연도 인용수 순위
  • Reference
1 W. J. Ready, L. J. Turbini, S. R. Stock and B. A. Smith, IEEE International Reliability Physics Symposium, 34th Annual Proceedings, 267 (1996)
2 G. Harsanyi, IEEE Electron Device Lett., 20(1), 5 (1999)   DOI   ScienceOn
3 S. B. Lee, Y. R. Yoo, J. Y. Jung, Y. B. Park, Y. S. Kim and Y. C. Joo, Thin Solid Films, 504, 294 (2006)   DOI   ScienceOn
4 P. Simon, N. Bui, N. Pebere, F. Dabosi and L. Albert, J. Power Sources, 55, 63 (1995)   DOI   ScienceOn
5 E. E. Abd El Aal, J. Power Sources, 75, 36 (1998)   DOI   ScienceOn
6 H. P. Hack, Metals Handbook, 13, Corrosion, 9th ed, ASM, Metals Park, OH (1987)
7 P. Simson, N. Bui, N. Pebere and F. Dabosi, J. Power Sources, 53, 163 (1995)   DOI   ScienceOn
8 E. F. EI-Sherbini and S. S. Abd EI Rehim, Mater. Chem. Phys., 88, 17 (2004)   DOI   ScienceOn
9 B. Rudra and D. Jennings, IEEE Trans. Reliab., 43(3), 354 (1994)   DOI   ScienceOn
10 T. Takemoto, R. M. Latanisioni, T. W. Eagart and A. Matsunawa, Corros. Sci., 39(8), 1415 (1997)   DOI   ScienceOn
11 O. Baradel and R. Nuttall, IEEE Colloquium on Electrochemical Measurement, 8/1 (1994)
12 G. Harsanyi, IEEE Trans. Compon. Packaging, Manufact. Tecnol, Part A, 18(3), 602 (1995)   DOI   ScienceOn
13 P. Yalamanchili, M. Al-Sheikhly and A. Christou, IEEE International Reliability Physics Symposium, 34th Annual Proceedings, 258 (1996)
14 T. Takemoto, R. M. Latanisioni, T. W. Eagart and A. Matsunawa, Corros. Sci., 39(8), 1415 (1997)   DOI   ScienceOn
15 H. Shitamoto and T. Nagatani, J. Phys. D: Appl. Phys, 31, 1137 (1998)   DOI   ScienceOn
16 W. J. Ready and L. J. Turbini, J. Eletron. Mater, 31(11), 1208 (2002)   DOI
17 J. Y. Jung, S. B. Lee, Y. R. Yoo, Y. S. Kim, Y. C. Joo and Y. B. Park, J. Microelectronics & Packaging Soc., 13(3), 1 (2006)