Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions

NaBr 및 NaF 용액에 대한 Sn-3.0Ag-0.5Cu 솔더 합금의 Electrochemical Migration 특성

  • Jung, Ja-Young (School of Materials Science and Engineering, Andong National University) ;
  • Jang, Eun-Jung (School of Materials Science and Engineering, Andong National University) ;
  • Yoo, Young-Ran (School of Materials Science and Engineering, Andong National University) ;
  • Lee, Shin-Bok (School of Materials Science and Engineering, Seoul National University) ;
  • Kim, Young-Sik (School of Materials Science and Engineering, Andong National University) ;
  • Joo, Young-Chang (School of Materials Science and Engineering, Seoul National University) ;
  • Chung, Tai-Joo (School of Materials Science and Engineering, Andong National University) ;
  • Lee, Kyu-Hwan (Surface Technology Research Center, Korea Institute of Machinery and Materials) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 정자영 (안동대학교 신소재공학부) ;
  • 장은정 (안동대학교 신소재공학부) ;
  • 유영란 (안동대학교 신소재공학부) ;
  • 이신복 (서울대학교 재료공학부) ;
  • 김영식 (안동대학교 신소재공학부) ;
  • 주영창 (서울대학교 재료공학부) ;
  • 정태주 (안동대학교 신소재공학부) ;
  • 이규환 (한국기계연구원 표면기술연구센터) ;
  • 박영배 (안동대학교 신소재공학부)
  • Published : 2007.06.30
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Abstract

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

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References

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