• Journal of Welding and Joining
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• v.31 no.6
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• pp.71-76
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• 2013

Gas nitriding is a surface hardening process where nitrogen is introduced into the surface of a ferrous alloy. During fusion welding of nitrided carbon steel, the nitride inside weld metal is dissolved and generates nitrogen gas, which causes porosities - blow holes and pits. In this study, several laser welding processes such as weaving welding, two-pass welding, dual beam welding and laser-arc hybrid welding were investigated to elongate the weld pool to enhance nitrogen gas evacuation. The surface pits were successfully eliminated with elongated weld pool. However blowholes inside the weld metal were effective reduced but not fully disappeared.

• Journal of Welding and Joining
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• v.22 no.5
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• pp.9-12
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• 2004

• Journal of Welding and Joining
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• v.22 no.5
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• pp.13-17
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• 2004

• Journal of Welding and Joining
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• v.27 no.3
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• pp.17-22
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• 2009

• Journal of Welding and Joining
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• v.26 no.4
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• pp.21-26
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• 2008

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.48 no.4
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• pp.68-76
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• 2011

In this paper, we propose a method for joining mobile nodes in wireless sensor networks using hysteresis features. It is possible to use static hysteresis, whereby joining and withdrawal are carried out repeatedly when a mobile node is located at boundary points. The energy consumption of the nodes can be effectively managed by a decrease in the response packets of the neighbors under the joining requests of the mobile nodes. However, static hysteresis causes a decrease in the joining rate. In order to increase the joining rate, dynamic hysteresis is used. To evaluate the performance of the proposed technique, the joining rate is investigated and analyzed. Simulation results show that the proposed method enables efficient joining according to the mobility of nodes in wireless sensor networks.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Journal of Welding and Joining
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• v.25 no.1
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• pp.30-36
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• 2007

A joining of dissimilar metal combination faces significant problems such as poor strength and cracking associated with brittle intermetallic compounds(IMC) formed. An application of laser allows low heat input; leading to less dilution and smaller heat affected zone. The $CO_2$ laser overlay was conducted on an AC2B alloy with feeding Fe-based powders. The overlay area was significantly influenced from the travel velocity rather than the powder feeding rate. The interface between the overlay and substrate consisted of the hard and brittle IMC($FeAl_3,\;Fe_3Al,\;Fe_2Al_5$), which initiating and propagating the crack. The reciprocating test for the slide wear was conducted on a multi-pass overlay experiment. Comparing with the multi-pass overlay with no overlap, the overlay with 50% overlap showed better wear resistance.