Journal of Welding and Joining

  • 제27권3호
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  • Pages.17-22
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  • 2009
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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3D 전자패키징용 관통실리콘비아의 충진 및 미세피치 접합기술

Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package

  • 유세훈 (한국생산기술연구원 용접접합기술지원센터) ;
  • 이창우 (한국생산기술연구원 용접접합기술지원센터)
  • 발행 : 2009.06.30
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참고문헌

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