Effects of Hardeners and Catalysts on the Reliability of Copper to Copper Adhesive Joint |
Min, Kyung-Eun
(Advanced Welding & Joining Technology Center, KITECH)
Kim, Hae-Yeon (Advanced Welding & Joining Technology Center, KITECH) Bang, Jung-Hwan (Advanced Welding & Joining Technology Center, KITECH) Kim, Jong-Hoon (Advanced Welding & Joining Technology Center, KITECH) Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH) |
1 | J. Rieger, Polymer Test., 20, 199 (2001). DOI ScienceOn |
2 | S, Ebnesajjad, Adhesive Technology Handbook, p.137-139, Willian Andrew, USA (2008). |
3 | M. H. Yi, Polym. Sci. Technol., 11(4), 443 (2000) (in Korean). |
4 | Structure adhesive. Google homepage. Retrieved July 26, 2009 from www.docstoc.com/docs. |
5 | K. T. Han, Polym. Sci. Technol., 6(6), 568 (1995) (in Korean). |
6 | K. C. Hwang and J. H. Yoon, in Proceedings of 2005 spring conference of the Korean Society of Automotive Engineers (Ilsan, Gyeonggi-do, Korea, May 2005), p. 950 (in Korean). |
7 | Y. S. Choi, S. H. Lee, H. B. Lee, I. S. Jang, Y. K. Moon, Y. J. Cho, J. H. Kim and I. J. Kim, in Proceedings of 2006 spring annual meeting of the Korean Welding Society (Samcheok, Gangwon-do, Korea, May 2006), p. 74 (in Korean). |
8 | E. Petrie, Epoxy Adhesive Formulations, p.85-109, McGRAW-HILL, USA (2006). |
9 | K. E. Min, J. S. Lee, M. S. Kim, J. K. Kim, in Proceedings of Advances in Materials and Processing Technologies (Paris, France, October, 2010) p.294. |
10 | T. W. Tamulevich, V. E. Moore, The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications, p.2-3, Epoxy Technology, Inc., USA (1980). http://www.epotek.com/SSCDocs/whi tepapers/Tech%20Paper%2011.pdf |