• Korean Journal of Materials Research
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• v.28 no.6
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• pp.361-364
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• 2018

Binary Ti-Al alloys below 51.0 mass%Al content exhibit a breakaway, transferring from parabolic to linear rate law. The second $Al_2O_3$ layer might have some protectiveness before breakaway. Ti-63.1 mass%Al oxidized at 1173 K under parabolic law. Breakaway oxidation is observed in every alloy, except for Ti-63.1 mass%Al. After breakaway, oxidation rates of the binary TiAl alloys below 34.5 mass%Al obey almost linear kinetics. The corrosion rate of Ti-63.1 mass%Al appears to be almost parabolic. As content greater than 63.0 mass% is found to be necessary to form a protective alumina film. Addition of Mo improves the oxidation resistance dramatically. No breakaway is observed at 1123 K, and breakaway is delayed by Mo addition at 1173 K. At 1123 K, no breakaway, but a parabolic increase in mass gain, are observed in the Mo-added TiAl alloys. The binary Ti-34.5 mass%Al exhibits a transfer from parabolic to linear kinetics. At 1173 K, the binary alloys show vary fast linear oxidation and even the Mo-added alloys exhibit breakaway oxidation. The 2.0 mass%Mo-added TiAl exhibits a slope between linear and parabolic. At values of 4.0 and 6.0 mass% added TiAl alloys, slightly larger rates are observed than those for the parabolic rate law, even after breakaway. On those alloys, the second $Al_2O_3$ layer appears to be persistently continuous. Oxidation resistance is considerably degraded by the addition of Mn. Mn appears to have the effect of breaking the continuity of the second $Al_2O_3$ layer.

• Korean Journal of Materials Research
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• v.28 no.6
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• pp.317-323
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• 2018

Crystal structure of the $L1_2$ type $(Al,X)_3Ti$ alloy (X = Cr,Cu) is analyzed by X-ray diffractometry and the nonuniform strain behavior at high temperature is investigated. The lattice constants for the $L1_2$ type $(Al,X)_3Ti$ alloys decrease in the order of the atomic number of the substituted atom X, and the hardness tends to increase. In a compressive test at around 473K for $Al_{67.5}Ti_{25}Cr_{7.5}$, $Al_{65}Ti_{25}Cr_{10}$ and $Al_{62.5}Ti_{25}Cu_{12.5}$ alloys, it is found that the stress-strain curves showed serration, and deformation rate dependence appeared. It is assumed that the generation of serration is due to dynamic strain aging caused by the diffusion of solute atoms. As a result, activation energy of 60-95 kJ/mol is obtained. This process does not require direct involvement. In order to investigate the generation of serrations in detail, compression tests are carried out under various conditions. As a result, in the strain rate range of this experiment, serration is found to occur after 470K at a certain critical strain. The critical strain increases as the strain rate increases at constant temperature, and the critical strain tends to decrease as temperature rises under constant strain rate. This tendency is common to all alloys produced. In the case of this alloy system, the serration at around 473K corresponds to the case in which the dislocation velocity is faster than the diffusion rate of interstitial solute atoms at low temperature.

• Journal of Powder Materials
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• v.24 no.3
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• pp.235-241
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• 2017

Titanium alloys have high specific strength, excellent corrosion and wear resistance, as well as high heat-resistant strength compared to conventional steel materials. As intermetallic compounds based on Ti, TiAl alloys are becoming increasingly popular in the aerospace field because these alloys have low density and high creep properties. In spite of those advantages, the low ductility at room temperature and difficult machining performance of TiAl and $Ti_3Al$ materials has limited their potential applications. Titanium powder can be used in such cases for weight and cost reduction. Herein, pre-forms of Ti-Al-xMn powder alloys are fabricated by compression forming. In this process, Ti powder is added to Al and Mn powders and compressed, and the resulting mixture is subjected to various sintering temperature and holding times. The density of the powder-sintered specimens is measured and evaluated by correlation with phase formation, Mn addition, Kirkendall void, etc. Strong Al-Mn reactions can restrain Kirkendall void formation in Ti-Al-xMn powder alloys and result in increased density of the powder alloys. The effect of Al-Mn reactions and microstructural changes as well as Mn addition on the high-temperature compression properties are also analyzed for the Ti-Al-xMn powder alloys.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.447-452
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• 2005

The synthesis and consolidation of titanium silicide by electro-discharge-sintering has been investigated. As-received Ti powder was in flaky shape and the mean particle size was $45.0{\mu}m$, whereas the mean particle size of the pre-milled Si powder with angular shape was $8.0{\mu}m$. Single pulse of 2.5 to 5.0 kJ/0.34g-elemental Ti and pre-milled Si powder mixture with the composition of $Ti-37.5at.\%$ Si was applied using $300{\mu}F$ capacitor. The solid with $Ti_5Si_3$ phase has been successfully fabricated by the discharge with the input energy more than 2.5kJ in less than $129{\mu}sec.$ Hv values were found to be higher than $1000kgf/mm^2$. The formation of $Ti_5Si_3$ occurred through a fast solid state diffusion reaction.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.726-731
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• 2002

Reaction synthesis is a process to form ceramics, intermetallics and their composites from elemental powder mixture. Application of this process to a surface modification techniques has a possibilities to enable the process at a lower temperature or for a shorter time, although synthesized materials are likely to include voids and unreacted elements. This paper intend to examine the effect of Si addition to the mixture of Al and Ni on the densification of synthesized Ni-Al intermetallic compounds and to evaluate the surface properties of obtained coatings. By the Si addition, exothermic reaction temperature to form Ni-Al intermetallic was lowered to be below the melting point of Al. Si soluted $Al_3$Ni$_2$, $Al_3$Ni and $Al_{6}$Ni$_3$Si were mainly formed in the coating layer when powder mixture was heated to 973K for 300s. Besides, densification was enhanced by increasing hot press pressure, Si additions and heating rate. When the composition of eutectic Al-Si reaches 78%, void ratio of sintered compact reduced to 0.4%. It is caused by higher flowability of Al-Si liquid phase generated and its infiltration into the void. Since the hardness of NiAl(Si) compound (about 600HV) formed in the coating layer is higher than that of Ni-Al compound (about 400HV), coating layer with high density and superior wear property is obtained by hot press using reaction synthesis from Al-Ni-Si powder mixture.

• Korean Journal of Materials Research
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• v.5 no.7
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• pp.869-879
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• 1995

TiAi intermetallic compound has been extensively studied for possible high temperature structural applications because of its high specific strength at high temperature, high creep resistance, and good oxidation resistance at elevated temperatures. In addition to its good properties, an economic manufacturing routes should be developed for this material to be used more extensively. One of the promising route in manufacturing TiAl intermetallics is the Self-propagating High-temperature Synthesis (SHS) method. Thus in this study, an attempt was made to study the mechanism of the SHS process in TiAl synthesis. The composition of the sample was Ti-(45, 50, 53)at% Al and the microstuctures of the products were analyzed using optical microscope and scanning electron microscope. When the phases formed at the main SHS reaction of whicyh combustion temperature is higher than the melting temperature of aluminum were identified as TiAl and Ti$_3$Al ; Ti$_3$Al cores surrounded by TiAl phase. In order to increase the combustion temperature, carbon was added 5 and 10at.%. When the carbon content was 10at.%, the heat of the reaction was large enough to melt the phase formed and that is consistent with the theoretical calculation results of the adiabatic temperature. The combution temperatue, which was measured by a computer data acquisition system, increased with the carbon content. The phases formed from the reaction involving the carbon added were indentified as TiAl and Ti$_2$AlC using XRD. The vickers hardness of the reaction product increased with the carbon content.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.987-992
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• 1998

Titanium aluminide intermetallic compound was formed from high purity elemental Ti and A1 foils by selfpropagating, high-temperature synthesis(SHS1 in hot press. Formation of $TiAl_3$ intermetallics at the interface between Ti and Al foil was observed to be controlled by temperature, pressure and heating rate. Especially, the heating rate is the most important role to form intermetallic compound by SHS reaction. According to DTA experiment, the SHS reactions appeared at two different temperatures below and above the melting point of Al. It was also observed that both SHS reaction temperatures increased with increasing the heating rate. After the SHS reaction of alternatively layered 10 Ti and 9 A1 foils at the heating rate of $20^{\circ}C$/min, the $700\mu\textrm{m}$ thick titanium aluminide sheet was formed by heat treatment at $810^{\circ}C$ for 4hours.

• Advances in materials Research
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• v.1 no.1
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• pp.51-74
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• 2012

A powder metallurgy-based rapid consolidation technique, Plasma Pressure Compaction ($P^2C^{(R)}$), was utilized to produce near-net shape parts of gamma titanium aluminides (${\gamma}$-TiAl). Micron-sized ${\gamma}$-TiAl powders, composed of Ti-50%Al and Ti-48%Al-2%Cr-2%Nb (at%), were rapidly consolidated to form near-net shape ${\gamma}$-TiAl parts in the form of 1.0" (25.4 mm) diameter discs, as well as $3"{\times}2.25"$ ($76.2mm{\times}57.2mm$) tiles, having a thickness of 0.25" (6.35 mm). The ${\gamma}$-TiAl parts were consolidated to near theoretical density. The microstructural morphology of the consolidated parts was found to vary with consolidation conditions. Mechanical properties exhibited a strong dependence on microstructural morphology and grain size. Because of the rapid consolidation process used here, grain growth during consolidation was minimal, which in turn led to enhanced mechanical properties. Consolidated ${\gamma}$-TiAl samples corresponding to Ti-48%Al-2%Cr-2%Nb composition with a duplex microstructure (with an average grain size of $5{\mu}m$) exhibited superior mechanical properties. Flexural strength, ductility, elastic modulus and fracture toughness for these samples were as high as 1238 MPa, 2.3%, 154.58 GPa and 17.95 MPa $m^{1/2}$, respectively. The high temperature mechanical properties of the consolidated ${\gamma}$-TiAl samples were characterized in air and vacuum and were found to retain flexural strength and elastic modulus for temperatures up to $700^{\circ}C$. At high temperatures, the flexural strength of ${\gamma}$-TiAl samples with Ti-50%Al composition deteriorated in air by 10% as compared to that in vacuum. ${\gamma}$-TiAl samples with Ti-48%Al-2%Nb-2%Cr composition exhibited better if not equal flexural strength in air than in vacuum at high temperatures.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.