Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints (PCB 표면처리에 따른 Sn-3.0Ag-0.5Cu 무연솔더 접합부의 in-situ 금속간 화합물 성장 및 Electromigration 특성 분석)
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- Journal of the Microelectronics and Packaging Society
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- v.22 no.2
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- pp.47-53
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- 2015