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http://dx.doi.org/10.6117/kmeps.2012.19.4.057

Effects of PCB Surface Finishes on Mechanical Reliability of Sn-1.2Ag-0.7Cu-0.4In Pb-free Solder Joint  

Kim, Sung-Hyuk (School of Materials Science and Engineering, Andong National University)
Kim, Jae-Myeong (School of Materials Science and Engineering, Andong National University)
Yoo, Sehoon (Micro-Joining Center, Korea Institute of Industrial Technology)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.4, 2012 , pp. 57-64 More about this Journal
Abstract
Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.
Keywords
Sn-1.2Ag-0.7Cu-0.4In Pb-free solder; electroless nickel immersion gold (ENIG) finish; organic solderability preservative (OSP); high-speed shear test;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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