Solderability of thin ENEPIG plating Layer for Fine Pitch Package application |
Back, Jong-Hoon
(Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Lee, Byung-Suk (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) Yoo, Sehoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) Han, Deok-Gon (MK Chem & Tech) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Yoon, Jeong-Won (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) |
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