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http://dx.doi.org/10.6117/kmeps.2017.24.1.083

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application  

Back, Jong-Hoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Lee, Byung-Suk (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Yoo, Sehoon (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Han, Deok-Gon (MK Chem & Tech)
Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Yoon, Jeong-Won (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.1, 2017 , pp. 83-90 More about this Journal
Abstract
In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.
Keywords
Fine pitch package; Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG); solder; wetting test; interfacial reaction;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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